Nexperia USA Inc. BUK9M48-80LX

Overview

BUK9M48-80LX from Nexperia is an AEC-Q101-qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, rated for 80 V V_DS, 48 mΩ R_DS(on) at V_GS = 10 V and T_j = 25 °C, and 15 A continuous drain current at T_mb = 25 °C. It delivers soft body-diode recovery and side-wettable flanks for AOI-compatible solder joints, targeting high-reliability automotive load switching in 12 V/24 V/48 V systems.

For engineers reviewing the BUK9M48-80LX datasheet, BUK9M48-80LX pinout, BUK9M48-80LX application, or BUK9M48-80LX equivalent, key selection criteria include its 80 V blocking capability, logic-level gate drive compatibility down to 4.5 V, AEC-Q101 qualification at 175 °C junction temperature, and LFPAK33 thermal performance with R_th(j-mb) = 2.75 K/W.

Technical Context

This MOSFET employs Nexperia's Trench12 process for low R_DS(on) and optimized switching behavior. Its gate threshold voltage (V_GS(th)) ranges from 1.4 V to 2.45 V across -55 °C to 175 °C, enabling robust turn-on with standard 3.3 V or 5 V logic controllers. The device integrates a monolithic source-drain diode with 7.5 nC recovered charge and 17.5 ns reverse recovery time under defined conditions.

The LFPAK33 package features a thermally enhanced mounting base connected directly to the drain, delivering 50 W total power dissipation at T_mb = 25 °C. Its side-wettable flanks support automated optical inspection of solder joints, while the 0.65 mm pitch and 8-terminal layout enable compact, high-current PCB routing in space-constrained automotive modules.

Key Specifications

Pinout & Package

LFPAK33 (SOT1210) is a surface-mount, 8-terminal power package with exposed drain mounting base and side-wettable flanks for AOI-capable solder joint verification. Dimensions: 3.40 mm × 2.45 mm × 0.90 mm (L × W × H), 0.65 mm lead pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Compared with STL220N4F7AG and NTMFS4C09NT1G, the BUK9M48-80LX trades some R_DS(on) for superior manufacturability (side-wettable flanks), guaranteed automotive qualification, and optimized thermal resistance in a smaller 3.4 mm × 2.45 mm footprint - making it ideal for space-limited, high-volume automotive modules requiring zero-defect solder joint reliability.

Availability

BUK9M48-80LX is available at Aetrix Electronics and suitable for automotive motor control, LED lighting, transmission solenoid actuation, and electronic circuit protection requiring stable component supply across extended temperature and lifetime requirements.

Supply support for BUK9M48-80LX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, high-reliability discrete and logic devices for automotive, industrial, and consumer markets.

The BUK9M48-80LX belongs to Nexperia's Automotive Logic-Level MOSFET product line, engineered specifically for robust, high-current switching in 12 V–48 V automotive subsystems where AEC-Q101 compliance, thermal efficiency, and automated manufacturing compatibility are mandatory.

FAQ

What is the maximum junction temperature and how is it validated?

The BUK9M48-80LX is qualified to AEC-Q101 at 175 °C junction temperature. This rating is verified through high-temperature operating life (HTOL), temperature cycling, and unbiased high-humidity accelerated stress testing per AEC-Q101 Rev G. The device maintains specified R_DS(on) and V_GS(th) stability up to 175 °C, with thermal resistance R_th(j-mb) = 2.75 K/W enabling direct PCB thermal coupling.

Can this MOSFET be used in high-frequency PWM applications above 100 kHz?

Yes - with Q_G(tot) = 16.5 nC max and Q_GD = 3.1 nC max at V_GS = 5 V, the BUK9M48-80LX supports switching frequencies up to 250 kHz in hard-switched topologies when paired with a 1–2 Ω gate driver. Its 5.7 ns typical rise time and 5 ns fall time (at V_GS = 5 V, R_G(ext) = 5 Ω) confirm suitability for fast PWM in LED dimming and motor control.

How does the side-wettable flank feature impact manufacturing yield?

The side-wettable flanks on all eight terminals enable full 100% automated optical inspection (AOI) of solder fillet height and wetting angle - eliminating reliance on X-ray for hidden joint verification. This has been shown to increase first-pass yield by ≥0.8% in high-volume SMT lines and reduce field return rates linked to cold-solder joints in automotive modules.

Is the mounting base electrically isolated or connected to a specific terminal?

The mounting base (mb) is electrically connected to the drain (D) terminal - it is not isolated. This configuration provides the lowest possible thermal resistance path from junction to PCB copper, but requires careful layout to avoid unintended drain-to-ground shorts. The base must be routed to the high-side or low-side drain net depending on circuit topology.