Nexperia USA Inc. BUK9M67-60ELX
- Part No.:
- BUK9M67-60ELX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK9M67-60ELX.pdf
- Description:
- SINGLE N-CHANNEL 60 V, 44 MOHM L
- Quantity:
- Payment:

- Shipping:

Inventory:1,457
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Product details
Overview
BUK9M67-60EL from Nexperia is a single N-channel logic-level MOSFET rated for 60 V drain-source voltage, 44 mΩ RDS(on) at VGS = 4.5 V and Tj = 25 °C, housed in LFPAK33 (SOT1210) package with enhanced SOA technology. It is AEC-Q101 qualified to 175 °C and specifically designed for linear-mode operation in automotive airbag squib voltage regulation.
For engineers reviewing the BUK9M67-60EL datasheet, BUK9M67-60EL pinout, BUK9M67-60EL application, or BUK9M67-60EL equivalent, this device is selected for high-reliability 12 V automotive systems requiring robust avalanche energy handling (14.4 mJ), low-threshold gate drive (VGS(th) typ. 1.65 V), and stable RDS(on) performance across temperature.
Technical Context
This MOSFET employs Enhanced Safe Operating Area (SOA) technology to sustain extended linear-mode conduction-critical for precise squib voltage control during airbag deployment. Its LFPAK33 copper-clip construction delivers low thermal resistance (Rth(j-mb) typ. 3.1 K/W) and high board-level reliability via gull-wing leads.
The device features a 4-pin source configuration (pins 1–3), isolated gate (pin 4), and drain-connected mounting base (mb), enabling efficient heat transfer to the PCB. Avalanche ruggedness is validated per unclamped inductive switching (EAS = 14.4 mJ, IAS = 16.2 A) under defined test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum blocking voltage compatible with 12 V automotive battery transients up to ISO 7637-2 Pulse 5a. |
| RDS(on) | 35 mΩ typ. @ VGS = 10 V, Tj = 25 °C - Enables low conduction loss in high-current squib drive circuits. |
| VGS(th) | 1.65 V typ. @ Tj = 25 °C - Ensures reliable turn-on with standard 3.3 V/5 V logic-level controllers. |
| ID | 20 A continuous @ Tmb = 25 °C - Validated current capability under controlled thermal mounting conditions. |
| EAS | 14.4 mJ - Single-pulse avalanche energy rating supports robust fault tolerance in inductive squib loads. |
| Rth(j-mb) | 3.1 K/W typ. - Low junction-to-mounting-base thermal resistance enables direct PCB copper pour cooling. |
| QGD | 3.1 nC typ. @ VGS = 4.5 V - Gate-drain charge value critical for predicting switching behavior in linear-mode biasing. |
Pinout & Package
LFPAK33 (SOT1210) is a plastic, single-ended surface-mount package with 8 leads and 0.65 mm pitch. It uses copper-clip construction for high current capability and gull-wing leads for automated optical inspection and mechanical reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 (S) | Source | Three parallel source terminals reduce bond-wire inductance and improve current sharing in high-di/dt applications. |
| 4 (G) | Gate | Isolated gate input with low gate leakage (<100 nA) ensures stable biasing in safety-critical linear operation. |
| Mounting base (mb) | Drain | Exposed drain-connected copper pad provides primary thermal path to PCB and contributes to low Rth(j-mb). |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Qualified to 175 °C junction temperature-ensures long-term reliability in under-hood automotive environments. |
| Enhanced SOA technology | Extends linear-mode safe operating area beyond standard MOSFETs, enabling stable voltage regulation in airbag squib drivers. |
| LFPAK33 copper-clip construction | Delivers 2× higher current density vs. conventional SO8, with improved power cycling endurance and thermal stability. |
| Gull-wing lead form | Enables high-yield AOI inspection and superior solder-joint reliability under thermal shock and vibration stress. |
| Drain-connected mounting base | Provides low-inductance, low-resistance thermal and electrical path to PCB-critical for minimizing voltage overshoot during fast switching. |
Applications
| Airbag Squib Driver | Automotive Body Control Module |
|---|---|
Use Scenario: Precise voltage regulation for pyrotechnic squib firing in dual-stage airbag systems. IC Role / Device Role / Timing Role: Linear-mode MOSFET acting as adjustable current sink to control squib voltage rise time and peak energy delivery. Use Value: Enhanced SOA ensures stable operation during extended linear conduction without thermal runaway, meeting ASAM/ISO 26262 functional safety requirements. | Use Scenario: Load switching for interior lighting, window lift motors, and seat position actuators in 12 V vehicle architectures. IC Role / Device Role / Timing Role: High-side or low-side power switch managing up to 20 A continuous load with minimal voltage drop. Use Value: 44 mΩ RDS(on) at 4.5 V gate drive reduces power loss and thermal stress in space-constrained BCM PCB layouts. |
| Engine Control Unit Power Stage | Electric Power Steering Pre-driver |
Use Scenario: Driving solenoid valves and fuel injectors requiring fast, low-loss switching in engine management systems. IC Role / Device Role / Timing Role: Final output stage delivering pulsed current with tight timing control and low propagation delay (td(on) = 5 ns). Use Value: Low QGD (3.1 nC) and fast switching parameters enable accurate pulse-width modulation at frequencies up to 100 kHz. | Use Scenario: Intermediate power stage between microcontroller and main H-bridge in EPS motor control. IC Role / Device Role / Timing Role: Logic-level gate driver buffer providing robust gate charging for high-current MOSFETs in safety-critical steering assist. Use Value: AEC-Q101 qualification and 175 °C operation ensure uninterrupted function during prolonged high-load EPS maneuvers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | 60 V, 2.2 mΩ RDS(on), PowerFLAT 5x6 package, lower RDS(on) but no AEC-Q101 linear-mode validation. | Targeted at high-efficiency switching (e.g., DC-DC converters), not linear-mode squib regulation. | Select only if application operates strictly in saturation/switching mode and requires ultra-low on-resistance. |
| ON Semiconductor NTMFS5C676NL | 60 V, 4.5 mΩ RDS(on), SO-8 package, AEC-Q101 qualified but lacks Enhanced SOA documentation for linear use. | Suitable for general-purpose automotive switching; not characterized for sustained linear conduction. | Prefer when board space allows SO-8 and linear-mode operation is not required. |
Compared with STL220N6F7 and NTMFS5C676NL, BUK9M67-60EL uniquely combines AEC-Q101 qualification, documented Enhanced SOA for linear-mode stability, and LFPAK33 thermal performance-making it the only validated choice for airbag squib voltage regulation where safe, predictable conduction is mandatory.
Availability
BUK9M67-60EL is available at Aetrix Electronics and suitable for automotive airbag systems, body control modules, and engine control units requiring stable component supply with full traceability and lifecycle continuity.
Supply support for BUK9M67-60EL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-grade MOSFETs and ESD protection solutions.
This device belongs to Nexperia's ASFET (Application Specific Field-Effect Transistor) product line, engineered specifically for demanding automotive linear-mode applications such as airbag squib control and precision load regulation.
FAQ
What is the maximum continuous drain current for BUK9M67-60EL under real-world PCB conditions?
The datasheet specifies 20 A continuous current at Tmb = 25 °C, verified in application testing. In practice, achievable current depends on PCB copper area, thermal vias, ambient temperature, and airflow. With 2 oz copper, 6 thermal vias, and forced convection, 12–15 A continuous is typical at Tmb ≤ 100 °C.
Does BUK9M67-60EL support gate drive from a 3.3 V microcontroller?
Yes. With VGS(th) typ. 1.65 V and RDS(on) = 50 mΩ max at VGS = 4.5 V and Tj = 25 °C, the device turns on fully with 3.3 V logic. However, RDS(on) increases to ~69 mΩ at VGS = 3.3 V, so thermal design must account for higher conduction loss.
How is the mounting base (mb) electrically connected, and what is its role in circuit layout?
The mounting base is internally connected to the drain terminal and serves as the primary thermal and electrical interface to the PCB. It must be soldered to a large copper pour tied to the drain net. This connection minimizes inductance, improves heat dissipation, and avoids floating drain potential that could cause EMI or latch-up.
What distinguishes Enhanced SOA technology from standard MOSFET SOA curves?
Enhanced SOA extends the linear-mode operating envelope-particularly at high VDS and medium ID-by optimizing cell layout and thermal coupling. Unlike standard MOSFETs that fail due to localized hot-spot formation, BUK9M67-60EL maintains uniform channel conduction across its die, enabling stable 100 ms+ linear operation at 48 V/5 A without thermal runaway.
BUK9M67-60ELX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 43.8mOhm @ 5A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 19 nC @ 10 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 915 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 45W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK9M67-60ELX FAQ
1.How can I place an order for BUK9M67-60ELX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9M67-60ELX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9M67-60ELX reliable?
The price and inventory of BUK9M67-60ELX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M67-60ELX is usually 5 days.
3.What payment methods are accepted for BUK9M67-60ELX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M67-60ELX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9M67-60ELX?
BUK9M67-60ELX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9M67-60ELX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9M67-60ELX?
For technical support, including BUK9M67-60ELX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M67-60ELX requirements.
6.How does Aetrix verify that BUK9M67-60ELX is sourced from the original manufacturer or authorized distributors?
All BUK9M67-60ELX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M67-60ELX meets industry standards.
7.What is the process for return or replacement of BUK9M67-60ELX?
All BUK9M67-60ELX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M67-60ELX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9M67-60ELX part is unused and in its original packaging.
Return procedure for BUK9M67-60ELX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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