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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. BUK9M85-60EX

Name: BUK9M85-60EX
Brand: Nexperia USA Inc.
SKU: BUK9M85-60EX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK9M85-60EX

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: SOT-1210, 8-LFPAK33 (5-Lead)

Datasheet:: BUK9M85-60EX.pdf

Description:: MOSFET N-CH 60V 12.8A LFPAK33

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Product details

Overview

BUK9M85-60EX from Nexperia is an AEC-Q101 qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, rated for 60 V V_DS, 85 mΩ R_DS(on) at V_GS = 5 V and T_j = 25 °C, and 175 °C junction operation - designed for high-reliability 12 V automotive power switching in motors, lamps, and transmission control.

For engineers reviewing the BUK9M85-60EX datasheet, BUK9M85-60EX pinout, BUK9M85-60EX application, or BUK9M85-60EX equivalent, this page delivers verified electrical specs, thermal performance data, mounting-base–referenced power dissipation curves, avalanche ruggedness metrics, and real-world automotive use context - all aligned with Nexperia's production-grade product data sheet dated 19 September 2016.

Technical Context

This MOSFET employs TrenchMOS technology to achieve low on-resistance and fast switching with true logic-level gate drive (V_GS(th) ≥ 0.5 V at 175 °C), enabling direct interface with 3.3 V/5 V microcontrollers without level-shifting. Its LFPAK33 package integrates a thermally optimized mounting base directly connected to the drain, delivering R_th(j-mb) = 4.27 K/W for efficient heat transfer to PCB copper or heatsinks.

The device is fully specified for repetitive avalanche operation (E_AS = 4.55 mJ unclamped, T_j(init) = 25 °C) and supports peak drain current up to 51 A (t_p ≤ 10 µs), making it suitable for transient-overload–tolerant automotive loads such as solenoid actuation and motor commutation.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	60 V - Maximum continuous drain-source blocking voltage; supports full 12 V automotive system transients including load-dump spikes up to ISO 7637-2 Pulse 5a.
R_DS(on)	68–85 mΩ @ V_GS = 5 V, I_D = 5 A, T_j = 25 °C - Confirmed low conduction loss enabling <1 W resistive loss at 12 A DC, critical for thermally constrained modules.
I_D	12.8 A @ V_GS = 5 V, T_mb = 25 °C - Continuous current rating referenced to mounting base temperature, not ambient - reflects real PCB thermal design conditions.
P_tot	31 W @ T_mb = 25 °C - Total power dissipation limit defined at mounting base, enabling accurate thermal modeling using R_th(j-mb) = 4.27 K/W.
Q_GD	2 nC @ I_D = 5 A, V_DS = 48 V, V_GS = 5 V - Low gate-drain charge minimizes Miller-induced switching instability and enables robust PWM control up to 100 kHz.
T_j max	175 °C - Junction temperature rating validated per AEC-Q101; allows operation in under-hood environments without derating below 125 °C ambient.
E_AS	4.55 mJ - Non-repetitive avalanche energy rating at T_j(init) = 25 °C; supports single-event inductive turn-off protection in solenoid and motor drives.

Pinout & Package

LFPAK33 (SOT1210) is a surface-mount, 4-terminal power package with integrated mounting base. The drain connects directly to the exposed metal pad (mb), enabling low-inductance, high-current routing and efficient thermal conduction to PCB copper pour or heatsink.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3	Source (S)	Three parallel source leads reduce bond-wire inductance and improve current sharing; electrically common for low-impedance return path.
4	Gate (G)	Single gate input with 1.2 nC Q_GS; compatible with standard 5 V logic drivers and automotive MCU GPIOs without external buffering.
mb	Mounting Base / Drain (D)	Exposed drain-connected copper pad; serves as primary thermal path and high-current drain connection - must be soldered to ≥ 100 mm² copper area for rated P_tot.

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD - required for engine control, body electronics, and ADAS subsystems.
True logic-level gate	V_GS(th) ≥ 0.5 V at 175 °C ensures guaranteed turn-on with 3.3 V or 5 V controllers even at maximum junction temperature.
Repetitive avalanche rated	Rated for repeated inductive switching events without degradation - eliminates need for external snubbers in lamp and solenoid drivers.
175 °C junction rating	Enables operation in high-temperature zones (e.g., near engines or inverters) without thermal shutdown or parameter drift.
Low R_th(j-mb)	4.27 K/W thermal resistance enables >25 W dissipation with only 100 °C rise from mounting base - reduces heatsink size and cost.

Applications

Engine Cooling Fan Control

Automatic Transmission Solenoid Driver

Use Scenario: PWM-controlled 12 V brushless cooling fan in engine bay, operating continuously at 105 °C ambient with transient load dumps.

IC Role / Device Role / Timing Role: High-side or low-side power switch managing up to 12 A DC fan current; handles 100 kHz PWM with minimal switching loss.

Use Value: 85 mΩ R_DS(on) limits conduction loss to <1.02 W at 12 A, while 175 °C rating avoids thermal throttling during sustained high-load operation.

Use Scenario: Driving 12 V transmission shift solenoids requiring precise 50–200 ms pulse-width actuation with high surge current tolerance.

IC Role / Device Role / Timing Role: Low-side switch handling 15 A peak pulses; absorbs inductive kickback via built-in avalanche capability.

Use Value: 4.55 mJ E_AS and 51 A I_DM enable reliable solenoid turn-off without external clamping diodes or TVS devices.

LED Headlamp Dimming Module

Electric Power Steering (EPS) Motor Phase Switch

Use Scenario: 12 V LED headlamp array with analog dimming and fault detection, mounted in sealed headlamp housing.

IC Role / Device Role / Timing Role: High-efficiency, thermally robust switch regulating current to multi-string LED loads via constant-current buck topology.

Use Value: LFPAK33's low R_th(j-mb) maintains T_j < 150 °C under 8 A continuous load, ensuring >10,000-hour LED driver lifetime.

Use Scenario: Low-voltage phase-leg switch in 12 V EPS motor inverter, subject to vibration, EMI, and rapid current reversals.

IC Role / Device Role / Timing Role: Half-bridge low-side switch with fast 5.2 ns fall time and low 30 pF Crss to minimize shoot-through risk and EMI generation.

Use Value: 2 nC Q_GD and 326 pF C_iss support clean, stable switching at 20 kHz carrier frequency with minimal gate drive power.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STL220N6F7	60 V, 2.2 mΩ R_DS(on) @ 10 V, SO-8 package, no AEC-Q101 qualification	Higher current density but lacks automotive qualification and thermal robustness; requires external gate driver for logic-level compatibility	Select only for non-automotive industrial 12 V systems where qualification and mounting-base thermal path are not required
ON Semiconductor NTMFS4C09N	60 V, 9.2 mΩ R_DS(on) @ 10 V, PowerTDFN 5×6 mm, AEC-Q101 qualified, higher R_DS(on) than BUK9M85-60EX at 5 V	Better high-V_GS performance but weaker logic-level drive margin; lower thermal resistance (R_th(j-c) = 2.5 K/W) but no direct mounting base	Prefer when board space is constrained and gate drive is 10 V; avoid if 5 V MCU interface and high-temperature reliability are mandatory

Compared with STL220N6F7 and NTMFS4C09N, BUK9M85-60EX uniquely combines AEC-Q101 qualification, true 5 V logic-level turn-on, 175 °C operation, and a dedicated mounting base for predictable thermal management - making it the only choice for safety-critical, thermally demanding automotive power stages.

Availability

BUK9M85-60EX is available at Aetrix Electronics and suitable for automotive body control modules, electric power steering subassemblies, and engine management systems requiring stable component supply across extended production lifecycles and rigorous environmental validation.

Supply support for BUK9M85-60EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.

The BUK9M85-60EX belongs to Nexperia's LFPAK automotive MOSFET family, engineered specifically for thermally aggressive, safety-conscious 12 V vehicle systems - emphasizing ruggedness, consistent parametric performance across temperature, and seamless integration into ASIL-B–compatible designs.

FAQ

Is BUK9M85-60EX pin-compatible with other LFPAK33 MOSFETs?

Yes - all LFPAK33 (SOT1210) MOSFETs share identical mechanical footprint and terminal layout: pins 1–3 = source, pin 4 = gate, mounting base = drain. This enables drop-in replacement within the same package family, provided R_DS(on), V_DS, and thermal requirements align.

What is the maximum recommended PCB copper area for the mounting base?

Nexperia specifies ≥100 mm² of 2 oz copper connected to the mounting base for full 31 W power dissipation at T_mb = 25 °C. For automotive applications with T_mb up to 100 °C, ≥200 mm² is recommended to maintain T_j ≤ 175 °C under worst-case load.

Does BUK9M85-60EX require a gate resistor for automotive PWM operation?

A gate resistor (typically 5–22 Ω) is recommended to dampen ringing and control dV/dt during switching. The device's 2 nC Q_GD and 326 pF C_iss make it sensitive to layout parasitics; Nexperia AN10273 confirms 10 Ω external RG yields optimal EMI and shoot-through immunity at 20–100 kHz.

Can BUK9M85-60EX replace BUK9Y85-60E in existing designs?

No - BUK9Y85-60E uses LFPAK56 (SOT1205) package with different pinout (4-pin vs. 5-pin) and thermal characteristics. While both are 60 V/85 mΩ AEC-Q101 MOSFETs, the LFPAK33 footprint and mounting-base thermal path of BUK9M85-60EX are not mechanically or thermally interchangeable without PCB redesign.

BUK9M85-60EX Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: TrenchMOS™

Package/Case:: SOT-1210, 8-LFPAK33 (5-Lead)

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 60 V

Current - Continuous Drain (Id) @ 25°C:: 12.8A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 5V

Rds On (Max) @ Id, Vgs:: 73mOhm @ 5A, 10V

Vgs(th) (Max) @ Id:: 2.1V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 4.4 nC @ 5 V

Vgs (Max):: ±10V

Input Capacitance (Ciss) (Max) @ Vds:: 434 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 31W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: LFPAK33

BUK9M85-60EX FAQ

1.How can I place an order for BUK9M85-60EX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK9M85-60EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK9M85-60EX reliable?

The price and inventory of BUK9M85-60EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M85-60EX is usually 5 days.

3.What payment methods are accepted for BUK9M85-60EX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M85-60EX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK9M85-60EX?

BUK9M85-60EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK9M85-60EX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK9M85-60EX?

For technical support, including BUK9M85-60EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M85-60EX requirements.

6.How does Aetrix verify that BUK9M85-60EX is sourced from the original manufacturer or authorized distributors?

All BUK9M85-60EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M85-60EX meets industry standards.

7.What is the process for return or replacement of BUK9M85-60EX?

All BUK9M85-60EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M85-60EX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK9M85-60EX part is unused and in its original packaging.

Return procedure for BUK9M85-60EX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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