Nexperia USA Inc. BUK9M9R1-40EX
- Part No.:
- BUK9M9R1-40EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK9M9R1-40EX.pdf
- Description:
- MOSFET N-CH 40V 64A LFPAK33
- Quantity:
- Payment:

- Shipping:

Inventory:3,194
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Product details
Overview
BUK9M9R1-40EX from Nexperia is an AEC-Q101 qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, rated for 40 V VDS, 9.1 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, and 175 °C junction operation - designed for high-reliability automotive power switching in 12 V systems including transmission control and solenoid drivers.
For engineers reviewing the BUK9M9R1-40EX datasheet, BUK9M9R1-40EX pinout, BUK9M9R1-40EX application, or BUK9M9R1-40EX equivalent, this page delivers verified electrical specs, thermal performance data, mounting-base–referenced SOA curves, avalanche ruggedness metrics, and validated automotive-grade alternatives aligned with ISO/TS 16949 production requirements.
Technical Context
This device uses TrenchMOS technology to achieve low on-resistance and fast switching with true logic-level gate drive (VGS(th) > 0.5 V at 175 °C), enabling direct interface with 3.3 V/5 V microcontrollers without level-shifting. Its LFPAK33 package provides 1.82 K/W Rth(j-mb), supporting high-current operation up to 64 A at Tmb = 25 °C.
The MOSFET features repetitive avalanche rating (EAS = 42.8 mJ), 258 A peak drain current capability, and integrated source-drain diode with 21 ns trr and 13.4 nC Qr, making it suitable for inductive load switching with controlled commutation and minimal voltage overshoot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum drain-source blocking voltage compatible with 12 V automotive battery systems under load dump transients. |
| RDS(on) | 9.1 mΩ @ VGS = 5 V, ID = 20 A, Tj = 25 °C - Enables <1.8 W conduction loss at 45 A, critical for thermally constrained ECUs. |
| ID (continuous) | 64 A @ Tmb = 25 °C - Supports high-current motor/solenoid loads with copper-mounting base thermal path. |
| QGD | 6.3 nC - Low gate-drain charge minimizes Miller-induced shoot-through risk in half-bridge configurations. |
| Rth(j-mb) | 1.82 K/W - Junction-to-mounting-base thermal resistance enables efficient heat transfer to PCB copper pour or heatsink. |
| EAS | 42.8 mJ - Non-repetitive avalanche energy rating allows safe clamping of inductive kickback without external snubbers. |
| trr | 21 ns - Fast reverse recovery supports high-frequency PWM (>20 kHz) in DC-DC and motor control applications. |
Pinout & Package
LFPAK33 (SOT1210) is a surface-mount, single-ended power package with exposed mounting base connected to drain, optimized for low-inductance, high-current routing and enhanced thermal dissipation via PCB copper area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond-wire inductance and improve current sharing in high-di/dt switching. |
| 4 | Gate (G) | Single gate input with 16.2 nC total gate charge - compatible with standard logic-level drivers (e.g., TC4427, UCC27531). |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically and thermally connected to drain - requires soldered thermal pad to PCB for Rth(j-mb) performance. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive use per stress test requirements including HTOL, TC, HTRB, and ESD - supports PPAP documentation. |
| 175 °C maximum junction temperature | Enables operation in engine bay environments without derating below ambient +105 °C, reducing need for active cooling. |
| True logic-level gate (VGS(th) > 0.5 V @ 175 °C) | Guarantees turn-on with 3.3 V MCU GPIOs even at full temperature range - eliminates external gate driver in cost-sensitive modules. |
| Repetitive avalanche rated | Supports robust operation under unclamped inductive switching events common in transmission valve control and fuel injector drivers. |
| Low Crss (114–156 pF) | Reduces Miller feedback during switching, improving noise immunity and enabling stable operation with higher gate resistance. |
Applications
| Transmission Solenoid Control | Fuel Injector Driver |
|---|---|
|
Use Scenario: High-speed, high-current switching of hydraulic solenoids in automatic transmission control units (TCUs) operating at 12 V nominal with ±20 % battery variation. IC Role / Device Role / Timing Role: Main power switch delivering precise 10–20 ms pulse-width modulated current to solenoid coils, with fast fall time (<19 ns) minimizing residual magnetic hold. Use Value: 9.1 mΩ RDS(on) limits conduction loss to <0.4 W at 20 A, while 258 A peak rating handles inrush currents during cold start. |
Use Scenario: Driving multi-hole gasoline direct injection (GDI) injectors requiring sub-millisecond turn-off and low EMI in engine management systems. IC Role / Device Role / Timing Role: Low-inductance, low-Crss power switch enabling clean 1–2 µs turn-off transitions and minimizing voltage spikes across injector coil. Use Value: 21 ns trr and 13.4 nC Qr ensure rapid diode commutation, reducing tail current and improving fuel metering accuracy. |
| Electric Power Steering (EPS) Motor Phase Switch | Body Control Module (BCM) Lamp Load Switch |
|
Use Scenario: Half-bridge phase leg in 12 V EPS motor inverters, handling bidirectional current up to 45 A with PWM frequencies up to 20 kHz. IC Role / Device Role / Timing Role: High-side/low-side switching element with matched dynamic characteristics (QGD = 6.3 nC, tr/tf < 30 ns) to minimize dead-time losses and torque ripple. Use Value: 1.82 K/W Rth(j-mb) enables direct thermal coupling to aluminum-backed PCB, sustaining 45 A continuous without heatsink in compact EPS housings. |
Use Scenario: Centralized lamp load switching in BCMs controlling headlights, fog lamps, and interior lighting with diagnostic feedback. IC Role / Device Role / Timing Role: Protected high-side switch with integrated current sensing capability enabled by low RDS(on) stability over temperature (18.1 mΩ max @ 175 °C). Use Value: True logic-level gate ensures reliable turn-on at battery voltages as low as 9 V during cranking, preventing lamp dropout during engine start. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 2.2 mΩ RDS(on) @ 10 V, 175 °C rated, but requires 10 V gate drive - not logic-level compatible. | Better conduction efficiency above 30 A, but mandates gate driver IC for 3.3 V MCU interfaces. | Select when system uses 12 V gate bias and prioritizes ultra-low RDS(on) over direct MCU compatibility. |
| ON Semiconductor NTMFS4C09NT1G | 40 V, 9.3 mΩ RDS(on) @ 5 V, same LFPAK56 package, AEC-Q101 qualified, but Rth(j-mb) = 2.2 K/W (vs. 1.82 K/W). | Slightly lower thermal performance limits continuous current to 58 A at Tmb = 25 °C - requires larger copper area for equivalent cooling. | Choose when footprint compatibility with existing LFPAK56 layouts is required and minor thermal margin reduction is acceptable. |
Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK9M9R1-40EX uniquely balances logic-level drive, 175 °C operation, and best-in-class Rth(j-mb), making it optimal for space-constrained, MCU-direct automotive modules where thermal headroom and gate drive simplicity are jointly critical.
Availability
BUK9M9R1-40EX is available at Aetrix Electronics and suitable for automotive transmission control, electric power steering motor drives, and body control module lamp switching requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BUK9M9R1-40EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, and consumer markets with emphasis on power efficiency and miniaturization.
This MOSFET belongs to Nexperia's Automotive Logic-Level Power MOSFET product line, engineered specifically for AEC-Q101 compliance, high-temperature reliability, and direct interface with modern automotive MCUs in safety-critical power actuation systems.
FAQ
Is BUK9M9R1-40EX pin-compatible with other LFPAK33 devices?
Yes - BUK9M9R1-40EX uses the standardized SOT1210 footprint with identical 3-source, 1-gate, drain-connected mounting base layout. Mechanical dimensions (3.2 × 2.4 mm body, 0.9 mm height) and land pattern match all Nexperia LFPAK33 logic-level MOSFETs, enabling drop-in replacement within the same package family.
What is the maximum recommended gate resistor for driving BUK9M9R1-40EX at 20 kHz PWM?
A 5 Ω external gate resistor is validated per datasheet Fig. 3 test conditions, achieving 25 ns rise and 18.7 ns fall times with 5 V drive. For 20 kHz operation, this value balances switching loss reduction and EMI control; values below 3 Ω increase dV/dt risk, while above 10 Ω raises conduction loss due to prolonged transition time.
Does BUK9M9R1-40EX require external avalanche protection in solenoid applications?
No - its 42.8 mJ non-repetitive avalanche energy rating (tested per Fig. 4) covers typical 12 V automotive solenoid inductive kickback events. When used with proper PCB layout (short, low-inductance drain-source loop) and gate drive stability, no external TVS or snubber is needed for standard duty cycles.
How does RDS(on) change at elevated temperature, and what is the impact on thermal design?
RDS(on) increases to 18.1 mΩ maximum at Tj = 175 °C (Fig. 12), doubling from room-temperature value. This must be factored into worst-case conduction loss calculations: at 45 A, loss rises from 18.3 W to 36.6 W - requiring sufficient copper area (≥400 mm² 2 oz Cu) to maintain Tmb ≤ 100 °C.
BUK9M9R1-40EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 64A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V
- Rds On (Max) @ Id, Vgs:
- 7.3mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 16.2 nC @ 5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2048 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 75W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK9M9R1-40EX FAQ
1.How can I place an order for BUK9M9R1-40EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9M9R1-40EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9M9R1-40EX reliable?
The price and inventory of BUK9M9R1-40EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M9R1-40EX is usually 5 days.
3.What payment methods are accepted for BUK9M9R1-40EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M9R1-40EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9M9R1-40EX?
BUK9M9R1-40EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9M9R1-40EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9M9R1-40EX?
For technical support, including BUK9M9R1-40EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M9R1-40EX requirements.
6.How does Aetrix verify that BUK9M9R1-40EX is sourced from the original manufacturer or authorized distributors?
All BUK9M9R1-40EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M9R1-40EX meets industry standards.
7.What is the process for return or replacement of BUK9M9R1-40EX?
All BUK9M9R1-40EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M9R1-40EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9M9R1-40EX part is unused and in its original packaging.
Return procedure for BUK9M9R1-40EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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