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Nexperia USA Inc. BUK9M9R5-40HX

Part No.:
BUK9M9R5-40HX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
SOT-1210, 8-LFPAK33 (5-Lead)
Datasheet:
AetrixBUK9M9R5-40HX.pdf
Description:
MOSFET N-CH 40V 40A LFPAK33
Quantity:
Payment:
Payment
Shipping:
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Inventory:8,999

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Product details

Overview

BUK9M9R5-40HX from Nexperia is an AEC-Q101 qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, rated for 40 V VDS, 9.5 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and 40 A continuous drain current at Tmb = 25 °C. It employs Trench 9 superjunction technology and copper-clip LFPAK construction for high power density and robustness in automotive body control modules.

For engineers reviewing the BUK9M9R5-40HX datasheet, BUK9M9R5-40HX pinout, BUK9M9R5-40HX application, or BUK9M9R5-40HX equivalent, key selection criteria include its 175 °C junction rating, repetitive avalanche capability, gull-wing lead form for AOI compatibility, and low RDS(on) at 4.5 V gate drive for 12 V system compatibility.

Technical Context

This MOSFET uses Trench 9 TrenchMOS superjunction architecture to achieve low conduction losses while maintaining fast switching performance: QGD = 1.7–3.5 nC at VGS = 4.5 V and QG(tot) = 17–24 nC at VGS = 10 V. Its source-drain diode exhibits soft reverse recovery (S = 0.63) and low Qr = 14 nC, supporting efficient synchronous rectification in DC-DC converters.

The LFPAK33 package integrates a thermally optimized copper clip connecting the die directly to the mounting base, delivering Rth(j-mb) = 2.51–2.74 K/W and enabling high-power operation with minimal PCB thermal design overhead. The device is fully characterized for operation across Tj = −55 °C to 175 °C and supports pulsed drain currents up to 218 A.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum drain-source blocking voltage compatible with 12 V automotive systems with transient margin.
RDS(on) 9.5 mΩ max at VGS = 10 V, ID = 15 A, Tj = 25 °C - Enables low conduction loss in high-current load switches.
ID cont. 40 A at Tmb = 25 °C - Validated continuous current under ideal thermal mounting conditions.
EAS 19 mJ non-repetitive avalanche energy - Supports unclamped inductive switching in motor drive and solenoid control.
Rth(j-mb) 2.51 K/W typical - Junction-to-mounting-base thermal resistance enables direct heatsinking without thermal vias.
QGD 1.7–3.5 nC at VGS = 4.5 V - Low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency.
VGS(th) 0.7–2.15 V - Logic-level threshold ensures full enhancement with standard 3.3 V/5 V microcontroller outputs.

Pinout & Package

LFPAK33 (SOT1210) is a surface-mount, single-ended copper-clip package with gull-wing leads and an exposed metal mounting base electrically connected to the drain. Its 8-lead configuration provides triple-source terminals for low-inductance, high-current source return paths and enhanced thermal transfer to the PCB.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3 Source (S) Three parallel source terminals reduce source inductance and improve current sharing in high-di/dt applications.
4 Gate (G) Single gate input with low RG = 0.3–2.3 Ω - minimizes gate drive power and improves switching speed control.
Mounting Base Drain (D) Exposed copper pad tied internally to drain - serves as primary thermal path and high-current drain connection.

Key Features

Feature Design Value
AEC-Q101 qualified to 175 °C Validated reliability for under-hood automotive environments including engine control and chassis modules.
Trench 9 superjunction technology Enables 9.5 mΩ RDS(on) at 40 V rating - achieves higher power density than planar MOSFETs in same footprint.
Repetitive avalanche rated Withstands repeated inductive turn-off stress without degradation - eliminates need for external snubbers in motor drives.
Gull-wing leads Facilitates automated optical inspection (AOI) and improves solder joint reliability versus J-leads or QFNs.
Soft reverse recovery diode S = 0.63 and Qr = 14 nC - reduces EMI and voltage overshoot during freewheeling in DC-DC and LED drivers.

Applications

Body Control Module Engine Cooling Fan Driver

Use Scenario: High-side load switching for door locks, window lifts, and interior lighting in 12 V vehicle architectures.

IC Role / Device Role / Timing Role: N-channel high-side switch controlled via gate driver IC, operating in on/off mode with <100 µs switching transitions.

Use Value: Triple-source pins minimize layout inductance and prevent shoot-through during fast PWM dimming of LED cabin lights.

Use Scenario: PWM-controlled brushless DC fan motor in engine bay with ambient temperatures up to 125 °C.

IC Role / Device Role / Timing Role: Low-side switching element in 3-phase inverter half-bridge, handling 30 A peak phase current.

Use Value: 175 °C junction rating and 19 mJ avalanche energy ensure reliable operation during stall and overcurrent events without derating.

Automotive DC-DC Converter LED Headlamp Driver

Use Scenario: Synchronous rectifier in 12 V → 5 V buck converter powering ADAS camera modules.

IC Role / Device Role / Timing Role: Secondary-side power switch operating at 500 kHz with 4.5 V gate drive from controller.

Use Value: Low QGD (1.7–3.5 nC) and soft diode (S = 0.63) reduce switching loss and EMI, improving converter efficiency by >1.2%.

Use Scenario: Constant-current LED string switching in adaptive front-lighting systems (AFS) with thermal foldback.

IC Role / Device Role / Timing Role: High-side current sink controlling 2 A LED strings with 10 kHz PWM dimming.

Use Value: 9.5 mΩ RDS(on) at 4.5 V gate drive enables direct MCU GPIO control without level-shifting, reducing BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 40 V automotive MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N4F7AG Higher RDS(on) (11.5 mΩ typ), same LFPAK56 package but larger footprint and higher Rth(j-mb) (3.2 K/W). Requires larger PCB area and more thermal copper; less suitable for space-constrained body modules. Prefer when higher peak current (220 A) is required and board space allows.
ON Semiconductor NTMFS4C09NT1G Lower RDS(on) (7.2 mΩ typ), SO-8FL package with higher Rth(j-mb) (4.5 K/W) and no avalanche rating. Lacks repetitive avalanche ruggedness and has inferior thermal performance - unsuitable for motor drive surge conditions. Prefer only for low-stress, low-temperature logic-level switching where avalanche immunity is not needed.

Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK9M9R5-40HX delivers optimal balance of low RDS(on), industry-leading thermal resistance, and certified avalanche capability in the smallest qualified LFPAK33 footprint - making it the preferred choice for thermally constrained, high-reliability 12 V automotive loads.

Availability

BUK9M9R5-40HX is available at Aetrix Electronics and suitable for automotive body electronics, engine management subsystems, and infotainment power distribution requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BUK9M9R5-40HX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.

BUK9M9R5-40HX belongs to Nexperia's LFPAK automotive MOSFET product line, engineered specifically for robust, thermally efficient switching in 12 V vehicle networks - emphasizing AEC-Q101 compliance, avalanche ruggedness, and manufacturability.

FAQ

Is BUK9M9R5-40HX pin-compatible with other LFPAK33 MOSFETs?

Yes - BUK9M9R5-40HX uses the standardized SOT1210 footprint with identical 0.65 mm lead pitch and mounting base layout. Pin 1–3 are source, Pin 4 is gate, and the exposed base is drain, matching all Nexperia and compatible LFPAK33 N-channel MOSFETs.

What is the maximum recommended PCB copper area for thermal performance?

The datasheet specifies a minimum 3.2 mm × 2.0 mm mounting pad (Fig. 18) with 6 thermal vias (0.3 mm diameter, 0.65 mm pitch). For 40 A continuous operation, Nexperia recommends ≥200 mm² of 2-oz copper connected to the mounting base via ≥8 thermal vias.

Does BUK9M9R5-40HX require a gate resistor for automotive 12 V applications?

A gate resistor is recommended: 5 Ω external resistance is used in the datasheet's switching time characterization (Fig. 3, Fig. 13). This value balances EMI suppression and switching speed - lower values increase dV/dt stress; higher values degrade efficiency in PWM applications.

Can BUK9M9R5-40HX be used in synchronous rectification without external diode control?

Yes - its integrated source-drain diode has soft recovery (S = 0.63) and low Qr = 14 nC, enabling self-synchronous operation in low-frequency (<200 kHz) buck converters. For >300 kHz, active gate control is advised to minimize body diode conduction loss.

BUK9M9R5-40HX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-1210, 8-LFPAK33 (5-Lead)
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
40A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
9.5mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
24 nC @ 10 V
Vgs (Max):
+16V, -10V
Input Capacitance (Ciss) (Max) @ Vds:
1537 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
55W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK33

BUK9M9R5-40HX FAQ

1.How can I place an order for BUK9M9R5-40HX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK9M9R5-40HX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK9M9R5-40HX reliable?

The price and inventory of BUK9M9R5-40HX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M9R5-40HX is usually 5 days.

3.What payment methods are accepted for BUK9M9R5-40HX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M9R5-40HX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK9M9R5-40HX?

BUK9M9R5-40HX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK9M9R5-40HX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK9M9R5-40HX?

For technical support, including BUK9M9R5-40HX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M9R5-40HX requirements.

6.How does Aetrix verify that BUK9M9R5-40HX is sourced from the original manufacturer or authorized distributors?

All BUK9M9R5-40HX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M9R5-40HX meets industry standards.

7.What is the process for return or replacement of BUK9M9R5-40HX?

All BUK9M9R5-40HX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M9R5-40HX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK9M9R5-40HX part is unused and in its original packaging.

Return procedure for BUK9M9R5-40HX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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