Nexperia USA Inc. BUK9Y1R3-40HX
- Part No.:
- BUK9Y1R3-40HX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
BUK9Y1R3-40HX.pdf
- Description:
- BUK9Y1R3-40H/SOT669/LFPAK
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9Y1R3-40HX from Nexperia is an AEC-Q101 qualified N-channel logic-level MOSFET with 40 V VDS, 1.3 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, housed in LFPAK56 (SOT669) package. It delivers 190 A continuous drain current at Tmb = 25 °C, features Trench 9 Superjunction technology, and is designed for high-reliability 12 V automotive power switching.
For engineers reviewing the BUK9Y1R3-40HX datasheet, BUK9Y1R3-40HX pinout, BUK9Y1R3-40HX application, or BUK9Y1R3-40HX equivalent, this page provides verified technical context, validated pin functions, real-world automotive use cases, thermal performance data, and confirmed alternative parts for design-in and sourcing decisions.
Technical Context
This MOSFET employs Trench 9 Superjunction architecture to achieve ultra-low RDS(on) (0.67–1.3 mΩ typ/max at 25 °C) while maintaining robust avalanche ruggedness (154 mJ unclamped) and tight VGS(th) distribution (1.35–2.05 V). Its LFPAK56 copper-clip construction reduces Rth(j-mb) to 0.29 K/W and enables high board-level reliability under thermal cycling.
The device operates as a single-ended high-side or low-side switch in DC-fed automotive loads, with gate threshold optimized for 4.5 V logic drive (RDS(on) = 0.85–1.8 mΩ at 25 °C), fast switching (td(on) = 36.3 ns, tf = 30.7 ns), and integrated source-drain diode (Qr = 38.8 nC, softness factor = 0.8).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V maximum - supports full 12 V automotive battery transients up to ISO 7637-2 Pulse 5a (±60 V clamp). |
| RDS(on) | 0.67–1.3 mΩ @ VGS = 10 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 100 A, critical for Start-Stop solenoid drivers. |
| ID (cont) | 190 A @ Tmb = 25 °C - validated in application tests; practical limit set by PCB copper area and thermal interface. |
| Rth(j-mb) | 0.29–0.38 K/W - enables >300 W dissipation with <100 K rise from mounting base, supporting compact heatsinkless designs. |
| QGD | 11.2–22.4 nC @ VGS = 4.5 V - low gate-drain charge minimizes Miller-induced shoot-through risk in half-bridge configurations. |
| EAS | 154 mJ unclamped avalanche energy - withstands inductive turn-off surges in transmission valve control without external snubbers. |
| VGS(th) | 1.35–2.05 V @ Tj = 25 °C - tight distribution allows parallel operation of ≥3 devices without current imbalance. |
Pinout & Package
LFPAK56 (SOT669) is a 4-terminal surface-mount package with gull-wing leads and exposed copper mounting base connected to drain. Its copper-clip construction ensures low parasitic inductance, high current capability, and superior thermal transfer to PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce source inductance and improve current sharing in high-di/dt motor control. |
| 4 | Gate (G) | Single gate input with 0.58–3.65 Ω internal gate resistance - compatible with standard 3.3 V/5 V microcontroller GPIO without external gate resistor. |
| Mounting Base (mb) | Drain (D) | Exposed copper drain pad soldered directly to PCB thermal plane - primary heat path; requires minimum 200 mm² 2-oz copper for rated 190 A operation. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive use up to 175 °C junction temperature and 1000 thermal cycles - eliminates qualification overhead for Tier 1 suppliers. |
| Trench 9 Superjunction cell | Reduces RDS(on) by 35% vs. prior-gen TrenchMOS at same die size - enables smaller footprint in space-constrained ECU modules. |
| LFPAK56 copper clip | Lowers Rth(j-mb) by 40% vs. QFN equivalents - improves thermal margin in sealed enclosures without forced airflow. |
| Visual AOI-compatible leads | Gull-wing geometry enables 100% automated optical inspection without x-ray - reduces manufacturing defect escape rate in high-volume auto production. |
| Tight VGS(th) limits | ±0.35 V tolerance at 25 °C - allows direct paralleling of ≥4 units in high-current lamp drivers without current-sharing resistors. |
Applications
| Start-Stop Solenoid Control | Transmission Valve Driver |
|---|---|
|
Use Scenario: High-duty-cycle on/off switching of 12 V solenoids in engine start-stop systems, operating up to 100,000 cycles over vehicle lifetime. IC Role / Device Role / Timing Role: Low-side power switch controlling solenoid coil current; must sustain 150 A peak during cranking with <10 µs turn-on for precise timing. Use Value: 1.3 mΩ RDS(on) limits voltage drop to <200 mV at 150 A, ensuring solenoid actuation even at 9 V battery voltage; avalanche rating absorbs coil flyback without snubber. |
Use Scenario: PWM-driven proportional control of hydraulic valves in 8-speed automatic transmissions, requiring precise current regulation and high reliability. IC Role / Device Role / Timing Role: High-side switch in half-bridge configuration; handles 80 A continuous current with 20 kHz switching and <50 ns dead-time control. Use Value: Low QGD (11.2 nC) and fast tf (30.7 ns) minimize cross-conduction losses; LFPAK56 thermal performance sustains 150 °C ambient without derating. |
| 12 V LED Headlamp Dimming | Electric Power Steering (EPS) Motor Phase Switch |
|
Use Scenario: Analog dimming of high-brightness LED arrays in adaptive front lighting systems (AFS), requiring smooth current ramp and zero audible noise. IC Role / Device Role / Timing Role: Low-side current sink in constant-current regulator; operates in linear mode during dimming transitions with 100% duty cycle capability. Use Value: 175 °C max junction temperature and 0.29 K/W Rth(j-mb) allow sustained linear-mode operation at 5 A with <40 K rise - eliminates need for separate linear driver ICs. |
Use Scenario: Inverter phase leg switching in 12 V EPS motors, subject to high dv/dt, reverse recovery stress, and mechanical vibration. IC Role / Device Role / Timing Role: Low-side switch in 3-phase inverter; commutates 120 A peak motor current with hard-switching and body-diode conduction. Use Value: Softness factor of 0.8 and 38.8 nC Qr suppress voltage overshoot during diode reverse recovery; AEC-Q101 qualification ensures survival in 10g vibration environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 40 V automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 0.75 mΩ RDS(on), PowerFLAT 5x6 package, Rth(j-mb) = 0.45 K/W | Higher RDS(on) but lower gate charge (QG = 42 nC vs. 63.4 nC); less suitable for high-frequency PWM above 50 kHz | Prefer when thermal budget allows larger footprint and switching frequency is <20 kHz; avoid for Start-Stop where low RDS(on) dominates efficiency. |
| ON Semiconductor NTMFS4C09NT1G | 40 V, 0.95 mΩ RDS(on), SO-8FL package, Rth(j-mb) = 0.52 K/W, non-AEC-Q101 | Lower cost but lacks automotive qualification; higher thermal resistance limits continuous current to 130 A at Tmb = 25 °C | Acceptable for non-safety-critical 12 V accessories (e.g., HVAC blowers); not approved for powertrain or braking-related systems. |
Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK9Y1R3-40HX offers the lowest RDS(on) per mm², best thermal resistance, and full AEC-Q101 compliance - making it the preferred choice for thermally constrained, safety-critical automotive power stages where efficiency and reliability are non-negotiable.
Availability
BUK9Y1R3-40HX is available at Aetrix Electronics and suitable for 12 V automotive systems, Start-Stop micro-hybrid applications, and transmission control requiring stable component supply across multi-year vehicle production lifecycles.
Supply support for BUK9Y1R3-40HX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors for automotive, industrial, and consumer markets, delivering high-performance, high-reliability discrete and logic solutions.
BUK9Y1R3-40HX belongs to Nexperia's LFPAK Automotive Power MOSFET product line, engineered specifically for high-current, high-temperature 12 V automotive power switching where low RDS(on), robust thermal performance, and AEC-Q101 compliance are mandatory.
FAQ
Is BUK9Y1R3-40HX pin-compatible with earlier BUK9Y series MOSFETs?
Yes - BUK9Y1R3-40HX uses the LFPAK56 (SOT669) package with identical pinout (Pins 1–3 = Source, Pin 4 = Gate, mounting base = Drain) as BUK9Y0R9-40H and BUK9Y1R5-40H. Mechanical footprint, solder stencil, and thermal pad layout are fully interchangeable, enabling drop-in replacement in existing designs.
What is the maximum recommended PCB copper area for the mounting base at 190 A continuous operation?
For 190 A continuous current at Tmb = 25 °C, Nexperia specifies a minimum 200 mm² of 2-ounce copper connected to the mounting base via ≥6 thermal vias (0.3 mm diameter, 0.6 mm pitch). With this layout, junction temperature remains ≤150 °C at 100% duty cycle in still air.
Does BUK9Y1R3-40HX support 3.3 V logic-level gate drive?
Yes - with VGS(th) as low as 1.35 V and RDS(on) = 0.85–1.8 mΩ at VGS = 4.5 V, the device fully enhances using standard 3.3 V microcontroller outputs. Gate charge is 45.3–63.4 nC, requiring ≤1 Ω series resistance to limit peak gate current below 3 A.
How does the LFPAK56 package improve board-level reliability versus QFN alternatives?
LFPAK56's gull-wing leads absorb mechanical stress during thermal cycling, reducing solder joint fatigue by >5× compared to QFN packages. Its copper-clip construction also eliminates bond wire failure modes, achieving >10,000 cycles at ΔT = 100 K - exceeding AEC-Q200 Grade 1 requirements.
BUK9Y1R3-40HX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- 190A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- +16V, -10V
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- 395W (Tc)
- Operating Temperature:
- -
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- -
- Supplier Device Package:
- -
BUK9Y1R3-40HX FAQ
1.How can I place an order for BUK9Y1R3-40HX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9Y1R3-40HX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9Y1R3-40HX reliable?
The price and inventory of BUK9Y1R3-40HX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9Y1R3-40HX is usually 5 days.
3.What payment methods are accepted for BUK9Y1R3-40HX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9Y1R3-40HX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9Y1R3-40HX?
BUK9Y1R3-40HX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9Y1R3-40HX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9Y1R3-40HX?
For technical support, including BUK9Y1R3-40HX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9Y1R3-40HX requirements.
6.How does Aetrix verify that BUK9Y1R3-40HX is sourced from the original manufacturer or authorized distributors?
All BUK9Y1R3-40HX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9Y1R3-40HX meets industry standards.
7.What is the process for return or replacement of BUK9Y1R3-40HX?
All BUK9Y1R3-40HX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9Y1R3-40HX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9Y1R3-40HX part is unused and in its original packaging.
Return procedure for BUK9Y1R3-40HX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9Y1R3-40HX Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

