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Nexperia USA Inc. BUK9Y1R6-40HX

Part No.:
BUK9Y1R6-40HX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
-
Datasheet:
AetrixBUK9Y1R6-40HX.pdf
Description:
BUK9Y1R6-40H/SOT669/LFPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,601

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Product details

Overview

BUK9Y1R6-40HX from Nexperia is an AEC-Q101 qualified N-channel logic-level MOSFET with 40 V VDS, 1.6 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, housed in LFPAK56 (SOT669) package. It delivers 120 A continuous drain current at Tmb = 25 °C and supports ultra-high-performance power switching in thermally demanding automotive environments up to 175 °C junction temperature.

For engineers reviewing the BUK9Y1R6-40HX datasheet, BUK9Y1R6-40HX pinout, BUK9Y1R6-40HX application, or BUK9Y1R6-40HX equivalent, key selection criteria include its Trench 9 Superjunction architecture, tight VGS(th) distribution (1.35–2.05 V), low Rth(j-mb) of 0.39 K/W, and robust avalanche energy rating of 158 mJ - all critical for motor, solenoid, and start-stop micro-hybrid control designs.

Technical Context

This MOSFET employs Trench 9 low-ohmic superjunction technology to achieve enhanced power density and efficiency within the LFPAK56 footprint. Its reduced cell pitch enables lower RDS(on) while improving safe operating area (SOA) and unclamped avalanche ruggedness versus standard TrenchMOS.

The LFPAK56 package integrates copper clip construction and gull-wing leads to minimize thermal resistance (Rth(j-mb) typ. 0.39 K/W) and mechanical stress during thermal cycling. Gate threshold voltage is tightly distributed (1.35–2.05 V at Tj = 25 °C), enabling reliable paralleling without current imbalance.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum drain-source blocking voltage compatible with 12 V automotive systems with transient margin.
RDS(on) 1.23 mΩ typ. @ VGS = 10 V, ID = 25 A, Tj = 25 °C - Enables high-efficiency switching with minimal conduction loss in high-current paths.
ID (cont) 120 A @ Tmb = 25 °C - Validated continuous current capability; limited in practice by PCB layout and thermal design.
EAS 158 mJ - Unclamped avalanche energy rating at Tj(init) = 25 °C, supporting robust operation under inductive load turn-off stress.
Rth(j-mb) 0.39 K/W typ. - Low junction-to-mounting-base thermal resistance enables efficient heat transfer to heatsink or PCB copper.
VGS(th) 1.62 V typ. @ ID = 1 mA, Tj = 25 °C - Logic-level gate drive compatibility with 3.3 V/5 V controllers and tight distribution for parallel operation.
QG(tot) 48.9 nC max @ VDS = 20 V, VGS = 10 V - Total gate charge determines driver strength requirement for fast switching with controlled dV/dt.

Pinout & Package

BUK9Y1R6-40HX uses the LFPAK56 (SOT669) surface-mount package: a 4-terminal plastic single-ended package with exposed mounting base connected to drain. Dimensions: 5.8 × 4.41 × 1.01 mm (L × W × H), featuring gull-wing leads and internal copper clip for low-inductance, high-current performance.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3 Source (S) Three parallel source terminals reduce source inductance and improve current sharing in high-frequency switching.
4 Gate (G) Single gate input with 0.9 Ω typical gate resistance - optimized for stable drive with moderate gate resistor values.
Mounting Base (mb) Drain (D) Exposed copper drain pad provides primary thermal path and low-inductance high-current connection to PCB.

Key Features

Feature Design Value
AEC-Q101 qualification Fully qualified for automotive applications with 175 °C rated junction temperature and extended reliability testing.
Trench 9 Superjunction technology Enables 1.23 mΩ RDS(on) in LFPAK56 footprint - 30% lower on-resistance than prior-generation TrenchMOS at same die size.
LFPAK copper clip construction Reduces RDS(on) by ~15% and Rth(j-mb) by ~25% vs. wire-bonded QFN equivalents, increasing current capability and thermal headroom.
Tight VGS(th) limits (1.35–2.05 V) Ensures consistent turn-on behavior across temperature and unit-to-unit variation - critical for reliable MOSFET paralleling.
Gull-wing lead geometry Enables AOI-compatible solder joint inspection and superior board-level reliability under thermal cycling vs. QFN bottom-termination packages.

Applications

Motor Control in Start-Stop Systems Lamp and Solenoid Load Switching

Use Scenario: High-cycle switching of starter motors and idle-stop actuators in 12 V micro-hybrid vehicles.

IC Role / Device Role / Timing Role: Main power switch controlling bidirectional energy flow between battery and motor/solenoid.

Use Value: 158 mJ avalanche rating and 175 °C operation ensure survival during repeated inductive turn-off transients and under-hood thermal stress.

Use Scenario: PWM dimming and on/off control of LED headlamps and HVAC solenoids in automotive body electronics.

IC Role / Device Role / Timing Role: Low-loss, logic-level power switch driven directly by MCU GPIO or dedicated driver ICs.

Use Value: 1.23 mΩ RDS(on) minimizes conduction loss at 10–30 A loads, while tight VGS(th) ensures clean turn-on at 3.3 V logic levels.

Transmission Control Valve Actuation Ultra-High-Performance Power Switching

Use Scenario: Precision current regulation for electro-hydraulic transmission control valves requiring fast, repeatable response.

IC Role / Device Role / Timing Role: High-current, low-RDS(on) switch in closed-loop current-sense feedback paths.

Use Value: Low gate charge (48.9 nC max) and fast switching times (tr = 30.3 ns) support kHz-range PWM control with minimal dead-time distortion.

Use Scenario: Primary switching element in high-efficiency DC-DC converters and battery disconnect circuits in ADAS and infotainment domains.

IC Role / Device Role / Timing Role: High-power synchronous rectifier or main switch in compact, thermally constrained modules.

Use Value: LFPAK56's 0.39 K/W Rth(j-mb) allows >100 A operation with minimal heatsink, reducing system volume and cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N4F7AG 40 V, 0.95 mΩ RDS(on) @ 10 V, but in PowerFLAT 5×6 package; higher QG (65 nC) and no AEC-Q101 documentation publicly available. Higher current capability but less proven in automotive qualification; requires x-ray inspection due to bottom-termination package. Prefer BUK9Y1R6-40HX where AEC-Q101 traceability, visual solder inspection, and thermal reliability are mandatory.
ON Semiconductor NTMFS4C09NT1G 40 V, 1.35 mΩ RDS(on) @ 10 V in SO-8FL package; AEC-Q101 qualified but higher Rth(j-mb) (0.65 K/W) and no copper clip. Lower RDS(on) but inferior thermal performance - limits continuous current to ~85 A at same board conditions. Choose BUK9Y1R6-40HX when thermal headroom, avalanche ruggedness, or high-current stability (>100 A) is required.

Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK9Y1R6-40HX offers the optimal balance of AEC-Q101 assurance, LFPAK56's board-level reliability, and validated 120 A capability - making it preferred for safety-critical, high-cycle automotive power switching where long-term field reliability is non-negotiable.

Availability

BUK9Y1R6-40HX is available at Aetrix Electronics and suitable for automotive body control modules, start-stop micro-hybrid systems, and transmission control units requiring stable component supply across multi-year production cycles.

Supply support for BUK9Y1R6-40HX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors - high-volume, high-reliability discrete, logic, and MOSFET devices for automotive, industrial, and consumer markets.

BUK9Y1R6-40HX belongs to Nexperia's LFPAK56 automotive MOSFET portfolio, engineered specifically for high-current, high-temperature 12 V automotive power switching with emphasis on AEC-Q101 compliance and board-level robustness.

FAQ

What is the maximum continuous drain current rating for BUK9Y1R6-40HX?

The datasheet specifies 120 A continuous drain current at Tmb = 25 °C, validated in application testing. In real-world designs, actual current is constrained by PCB copper area, heatsinking, ambient temperature, and duty cycle - not solely by the device's intrinsic rating. Thermal design must maintain Tj ≤ 175 °C under worst-case operating conditions.

Does BUK9Y1R6-40HX support 3.3 V logic-level gate drive?

Yes - its VGS(th) range is 1.35–2.05 V at 25 °C, and RDS(on) remains low (2.2 mΩ max) even at VGS = 4.5 V. This enables full enhancement with 3.3 V or 5 V microcontroller outputs without external level-shifting, though gate drive strength must support 48.9 nC total charge for fast switching.

How does the LFPAK56 package improve reliability over standard SO-8 or QFN?

LFPAK56 replaces wire bonds with a copper clip connecting die to leads and mounting base, reducing parasitic inductance and thermal resistance. Its gull-wing leads allow optical solder-joint inspection and absorb mechanical stress during thermal cycling - unlike QFN packages that rely on hidden bottom terminations and suffer from solder fatigue failures.

Is avalanche energy rating specified for repetitive operation?

No - the 158 mJ EAS rating is for single-pulse, unclamped avalanche only, limited by peak junction temperature of 175 °C. Repetitive avalanche is not characterized in the datasheet; designers must avoid repeated inductive turn-off events and use snubbers or freewheeling diodes to protect the device in such topologies.

BUK9Y1R6-40HX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
-
Technology:
-
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
120A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
-
Vgs(th) (Max) @ Id:
-
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
+16V, -10V
Input Capacitance (Ciss) (Max) @ Vds:
-
FET Feature:
-
Power Dissipation (Max):
294W (Tc)
Operating Temperature:
-
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
-
Supplier Device Package:
-

BUK9Y1R6-40HX FAQ

1.How can I place an order for BUK9Y1R6-40HX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK9Y1R6-40HX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK9Y1R6-40HX reliable?

The price and inventory of BUK9Y1R6-40HX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9Y1R6-40HX is usually 5 days.

3.What payment methods are accepted for BUK9Y1R6-40HX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9Y1R6-40HX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK9Y1R6-40HX?

BUK9Y1R6-40HX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK9Y1R6-40HX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK9Y1R6-40HX?

For technical support, including BUK9Y1R6-40HX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9Y1R6-40HX requirements.

6.How does Aetrix verify that BUK9Y1R6-40HX is sourced from the original manufacturer or authorized distributors?

All BUK9Y1R6-40HX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9Y1R6-40HX meets industry standards.

7.What is the process for return or replacement of BUK9Y1R6-40HX?

All BUK9Y1R6-40HX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9Y1R6-40HX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK9Y1R6-40HX part is unused and in its original packaging.

Return procedure for BUK9Y1R6-40HX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BUK9Y1R6-40HX Tags

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