Nexperia USA Inc. BUK9Y27-40B,115
- Part No.:
- BUK9Y27-40B,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK9Y27-40B,115.pdf
- Description:
- MOSFET N-CH 40V 34A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:1,793
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9Y27-40B from Nexperia is an AEC-Q101-qualified N-channel TrenchMOS logic-level power MOSFET in LFPAK (SOT669) package, rated for 40 V VDS, 34 A continuous drain current at 25 °C mounting base temperature, and 175 °C maximum junction temperature-designed for automotive 12 V load switching including solenoids, lamps, and motors.
For engineers reviewing the BUK9Y27-40B datasheet, BUK9Y27-40B pinout, BUK9Y27-40B application, or BUK9Y27-40B equivalent, this device supports thermally demanding automotive environments, requires no level-shifting gate drive (VGS(th) = 1.1–2.0 V), delivers low conduction loss (RDS(on) = 22 mΩ typ @ 5 V, 15 A, 25 °C), and features unclamped avalanche ruggedness of 39 mJ.
Technical Context
This MOSFET uses TrenchMOS technology to achieve low RDS(on) with logic-level gate drive compatibility (VGS = 4.5–5 V sufficient for full enhancement). Its thermal design centers on a low 2.53 K/W junction-to-mounting-base thermal resistance, enabling high-power dissipation (59.4 W at Tmb = 25 °C) without external heatsinking in many automotive PCB layouts.
The device integrates a robust body diode (VSD = 0.85–1.2 V @ 15 A, 25 °C; trr = 30 ns) and exhibits stable threshold voltage over temperature (VGS(th) = 0.5 V min @ 175 °C), supporting reliable operation across automotive ambient ranges. Avalanche energy rating (39 mJ, non-repetitive) confirms suitability for inductive load switching with flyback energy management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum drain-source blocking voltage; supports 12 V automotive systems with margin against load-dump transients. |
| ID (continuous) | 34 A @ Tmb = 25 °C - Sustained current capability enables direct control of high-power solenoids or lamp banks without external current limiting. |
| RDS(on) | 22 mΩ typ @ VGS = 5 V, ID = 15 A, Tj = 25 °C - Low conduction loss reduces power dissipation and PCB heating in compact automotive modules. |
| Tj(max) | 175 °C - Enables operation in under-hood environments and supports derating up to 100 °C mounting base temperature (ID = 24 A). |
| QGD | 4.2 nC - Gate-drain charge value determines switching speed and Miller-effect sensitivity; enables fast turn-off with moderate gate drive strength. |
| EAS | 39 mJ (non-repetitive) - Confirmed avalanche energy handling allows safe interruption of inductive currents (e.g., fuel injectors, relays) without snubber circuits. |
| Rth(j-mb) | 2.53 K/W - Thermal resistance from junction to mounting base defines heat transfer efficiency to PCB copper; enables >50 W dissipation with 200 mm² 2-oz copper pad. |
Pinout & Package
Package: LFPAK (SOT669), plastic single-ended surface-mounted package with exposed mounting base connected to drain; optimized for high-current, low-inductance PCB mounting and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond-wire inductance and improve current sharing; directly soldered to PCB ground plane for low-impedance return path. |
| 4 | Gate (G) | Single gate input terminal; designed for logic-level drive (compatible with 3.3 V/5 V microcontrollers); requires <11 nC total gate charge for full switching. |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically connected to drain; serves as primary thermal path and high-current drain connection-must be soldered to large copper area for thermal and electrical integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) = 1.1–2.0 V ensures full enhancement with standard 5 V MCU GPIOs-eliminates need for gate driver ICs in cost-sensitive modules. |
| AEC-Q101 qualification | Validated for automotive critical applications per stress test requirements-supports functional safety architectures requiring component-level reliability evidence. |
| 175 °C junction rating | Enables uninterrupted operation in engine bay locations where ambient exceeds 105 °C; maintains RDS(on) stability up to Tj = 175 °C (57 mΩ max). |
| Low RDS(on) at 4.5 V | RDS(on) ≤ 30 mΩ @ VGS = 4.5 V, 15 A, 25 °C-ensures efficient switching even with marginal supply rail droop during cold-cranking conditions. |
| Unclamped avalanche ruggedness | 39 mJ EAS rating verified per JEDEC JESD24-11-permits direct replacement of mechanical relays in inductive load circuits without external protection diodes. |
Applications
| Automotive Door Module | Fuel Injector Driver |
|---|---|
|
Use Scenario: Controlling power windows, locks, and mirror actuators in centralized door control units. IC Role / Device Role / Timing Role: High-side or low-side power switch managing 12 V DC motor and solenoid loads with PWM duty cycling. Use Value: Low RDS(on) minimizes self-heating during frequent actuation cycles; 175 °C rating ensures reliability despite proximity to vehicle interior trim materials. |
Use Scenario: Driving 12 V electromagnetic fuel injectors in port fuel injection (PFI) systems. IC Role / Device Role / Timing Role: Low-side switch delivering precise 1–5 ms current pulses with fast turn-off (tf = 24 ns) to control fuel quantity. Use Value: Verified 39 mJ avalanche energy safely absorbs inductive kickback without clamping components-reducing BOM count and layout area. |
| LED Headlamp Dimming | Body Control Module (BCM) Load Switch |
|
Use Scenario: PWM dimming of high-brightness LED arrays in adaptive front-lighting systems (AFS). IC Role / Device Role / Timing Role: High-frequency (≥1 kHz) low-side switch modulating current through LED strings. Use Value: Fast switching parameters (td(off) = 40 ns, QGD = 4.2 nC) enable clean PWM edges and minimal dead-time distortion at 20 kHz switching. |
Use Scenario: Centralized power distribution for auxiliary 12 V loads (e.g., HVAC fans, seat heaters, infotainment USB ports) in modern BCMs. IC Role / Device Role / Timing Role: Protected load switch providing overcurrent, overtemperature, and short-circuit detection via external monitoring. Use Value: 34 A continuous rating supports multiple parallel loads; SOT669 footprint allows dense placement while maintaining thermal headroom on multilayer PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 220 A pulsed ID, RDS(on) = 1.6 mΩ @ 10 V - significantly lower on-resistance but requires 10 V gate drive; not logic-level compatible. | Targeted at high-efficiency DC-DC converters-not suitable for direct 5 V MCU drive without level-shifting. | Select only if gate drive voltage ≥8 V is available and ultra-low conduction loss is prioritized over drive simplicity. |
| IRL8721PBF | 30 V, 71 A, RDS(on) = 12 mΩ @ 5 V - lower voltage rating and higher current, but lacks AEC-Q101 qualification and 175 °C rating. | Intended for industrial/commercial power supplies-not validated for automotive temperature cycling or humidity testing. | Acceptable for non-automotive 12 V systems where qualification is not required and VDS margin is sufficient. |
Compared with STL220N4F7AG and IRL8721PBF, BUK9Y27-40B uniquely balances logic-level drivability, automotive qualification, and thermal robustness-making it the only option among the three qualified for under-hood use with direct 5 V MCU control and guaranteed 39 mJ avalanche performance.
Availability
BUK9Y27-40B is available at Aetrix Electronics and suitable for automotive door modules, fuel injector drivers, LED headlamp dimming circuits, and body control module load switching requiring stable component supply and long-term production continuity.
Supply support for BUK9Y27-40B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete, logic, and MOSFET solutions-originally part of Philips and now an independent company headquartered in Nijmegen, Netherlands.
The BUK9Y27-40B belongs to Nexperia's TrenchMOS automotive-qualified power MOSFET product line, engineered specifically for robust, low-loss switching in 12 V automotive subsystems where AEC-Q101 compliance and thermal resilience are mandatory.
FAQ
Is BUK9Y27-40B suitable for high-frequency PWM applications like LED dimming?
Yes. With td(off) = 40 ns, tf = 24 ns, and QGD = 4.2 nC, the device supports clean switching at frequencies up to 100 kHz. Its low output capacitance (Coss = 146–175 pF) and stable RDS(on) over temperature ensure minimal switching loss and consistent dimming linearity in automotive LED headlamps.
Does BUK9Y27-40B require a gate resistor for automotive MCU drive?
A gate resistor (typically 10–47 Ω) is recommended to dampen ringing and limit peak gate current during fast transitions. The datasheet specifies RGS = 50 Ω for avalanche testing, and MCU GPIOs with ~25 mA drive capability can safely switch the device without external buffering when using a 22 Ω series resistor.
Can BUK9Y27-40B replace mechanical relays in automotive applications?
Yes-its 39 mJ unclamped avalanche rating, 34 A continuous current, and AEC-Q101 qualification make it suitable for replacing 12 V automotive relays driving solenoids, fans, and lamps. Unlike relays, it offers silent operation, infinite cycle life, and programmable PWM control without contact wear or bounce.
What PCB layout practices maximize thermal performance for BUK9Y27-40B?
Maximize copper area under the mounting base (drain pad) using ≥2 oz copper, thermal vias (≥8 × 0.3 mm) to inner ground planes, and connection to a solid ground plane. Keep source traces wide and short, and avoid routing sensitive analog traces near the drain pad to minimize coupling from high di/dt switching events.
BUK9Y27-40B,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 34A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V, 10V
- Rds On (Max) @ Id, Vgs:
- 24mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 11 nC @ 5 V
- Vgs (Max):
- ±15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 959 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 59.4W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK9Y27-40B,115 FAQ
1.How can I place an order for BUK9Y27-40B,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9Y27-40B,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9Y27-40B,115 reliable?
The price and inventory of BUK9Y27-40B,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9Y27-40B,115 is usually 5 days.
3.What payment methods are accepted for BUK9Y27-40B,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9Y27-40B,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9Y27-40B,115?
BUK9Y27-40B,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9Y27-40B,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9Y27-40B,115?
For technical support, including BUK9Y27-40B,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9Y27-40B,115 requirements.
6.How does Aetrix verify that BUK9Y27-40B,115 is sourced from the original manufacturer or authorized distributors?
All BUK9Y27-40B,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9Y27-40B,115 meets industry standards.
7.What is the process for return or replacement of BUK9Y27-40B,115?
All BUK9Y27-40B,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK9Y27-40B,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9Y27-40B,115 part is unused and in its original packaging.
Return procedure for BUK9Y27-40B,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9Y27-40B,115 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
