Nexperia USA Inc. BUK9Y30-75B/C2,115

Overview

BUK9Y30-75B/C2,115 from Nexperia is a logic-level N-channel TrenchMOS FET in LFPAK (SOT669) package, rated for 75 V V_DS, 34 A continuous drain current at T_mb = 25 °C, and 175 °C junction temperature. It delivers 25 mΩ R_DS(on) at V_GS = 5 V and T_j = 25 °C, and is AEC-Q101 qualified for automotive critical power switching in 12 V/24 V/42 V systems.

For engineers reviewing the BUK9Y30-75B/C2,115 datasheet, BUK9Y30-75B/C2,115 pinout, BUK9Y30-75B/C2,115 application, or BUK9Y30-75B/C2,115 equivalent, key selection criteria include logic-level gate drive compatibility (V_GS(th) = 1.1–2.0 V), avalanche ruggedness (78 mJ unclamped), thermal resistance (R_th(j-mb) = 1.8 K/W), and SOT669 mounting-base thermal interface design.

Technical Context

This device uses TrenchMOS technology to achieve low conduction losses and high thermal robustness. Its gate threshold voltage (V_GS(th)) ranges from 0.5 V at T_j = 175 °C to 2.3 V at T_j = –55 °C, enabling stable turn-on across automotive temperature extremes. The integrated source-drain diode supports freewheeling in inductive loads with V_SD = 0.85 V at I_S = 25 A and T_j = 25 °C.

Dynamic performance is defined by Q_G(tot) = 19 nC, Q_GD = 9 nC, and C_iss = 1550–2070 pF, supporting efficient switching in motor control and load management circuits. Avalanche capability is validated per non-repetitive conditions (ID = 34 A, V_sup ≤ 75 V, R_GS = 50 Ω), with energy rating of 78 mJ at T_j(init) = 25 °C.

Key Specifications

Pinout & Package

Package: LFPAK (SOT669), plastic single-ended surface-mounted package with exposed mounting base connected to drain for enhanced thermal and electrical performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Compared with STL220N4F7AG and NTMFS4C09NT1G, the BUK9Y30-75B/C2,115 uniquely combines 75 V rating, AEC-Q101 qualification, logic-level gate drive, and SOT669 thermal performance-making it the only option for 24 V/42 V automotive load switching where reliability, temperature range, and gate simplicity are jointly critical.

Availability

BUK9Y30-75B/C2,115 is available at Aetrix Electronics and suitable for automotive body control modules, engine management system load drivers, and commercial vehicle 24 V/42 V power distribution requiring stable component supply and long-term lifecycle support.

Supply support for BUK9Y30-75B/C2,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.

The BUK9Y series belongs to Nexperia's automotive-qualified TrenchMOS logic-level power FET product line, engineered specifically for robust, thermally efficient switching in 12 V–42 V automotive power networks and safety-critical electronic control units.

FAQ

What is the maximum continuous drain current for BUK9Y30-75B/C2,115 at 100 °C mounting base temperature?

At T_mb = 100 °C and V_GS = 5 V, the maximum continuous drain current is 24 A, as specified in Table 4 (Limiting Values). This reflects thermal derating from the 34 A rating at 25 °C, consistent with the normalized ID vs. T_mb curve in Figure 1.

Is BUK9Y30-75B/C2,115 suitable for high-frequency PWM motor control above 50 kHz?

Yes - with Q_G(tot) = 19 nC, Q_GD = 9 nC, and t_f = 83 ns, the device supports efficient switching up to ~100 kHz in hard-switched topologies. However, gate drive strength (≥1 A peak) and PCB layout (minimized loop inductance) are essential to maintain efficiency and avoid oscillation.

Does the mounting base (drain) require electrical isolation from the PCB ground plane?

No - the mounting base is electrically connected to the drain terminal and must be routed as a high-voltage node. It should be isolated from other nets (especially source and gate) using adequate creepage/clearance; thermal connection to a large copper pour is recommended for heat dissipation but no galvanic isolation is needed unless system topology demands drain-referenced grounding.

Can BUK9Y30-75B/C2,115 replace older BUK9Y30-75B versions in existing designs?

Yes - the /C2,115 suffix denotes tape-and-reel packaging per ordering code BUK9Y30-75B/C2,115; electrically and thermally identical to BUK9Y30-75B. Pinout, ratings, and SOA (Figure 4) are unchanged per Rev. 04 datasheet, enabling drop-in replacement without redesign.