My Inquiry
My Account
Nexperia USA Inc. BUK9Y3R0-40E,115
- Part No.:
- BUK9Y3R0-40E,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK9Y3R0-40E,115.pdf
- Description:
- MOSFET N-CH 40V 100A LFPAK56
- Quantity:
- Payment:
- Shipping:
Inventory:3,434
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9Y3R0-40E from Nexperia is an AEC-Q101-qualified N-channel logic-level MOSFET in LFPAK56 (SOT669) package, rated for 40 V VDS, 3.0 mΩ RDS(on) at 5 V VGS and 25 A, 175 °C junction temperature, and repetitive avalanche capability - deployed in automotive start-stop micro-hybrid power switching.
For engineers reviewing the BUK9Y3R0-40E datasheet, BUK9Y3R0-40E pinout, BUK9Y3R0-40E application, or BUK9Y3R0-40E equivalent, key selection criteria include its true logic-level gate (VGS(th) > 0.5 V at 175 °C), low thermal resistance (0.77 K/W Rth(j-mb)), and 100 A continuous drain current at Tmb = 25 °C.
Technical Context
This MOSFET uses TrenchMOS technology to achieve low RDS(on) with robust thermal performance and high-current capability. Its gate threshold voltage remains functional up to 175 °C, enabling reliable operation in thermally demanding under-hood environments without external level-shifting circuitry.
The device integrates a source-drain diode with 30 ns reverse recovery time and 25 nC recovered charge, supporting synchronous rectification and freewheeling in high-frequency automotive DC-DC and motor control topologies. Mounting base (drain-connected) enables direct thermal coupling to heatsinks or PCB copper planes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V maximum - supports full 12 V automotive battery transient tolerance (e.g., load dump up to 40 V). |
| RDS(on) | 2.47 mΩ typ @ VGS = 5 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 20 A, critical for high-efficiency solenoid/motor drivers. |
| ID (cont) | 100 A @ Tmb = 25 °C - limited by package thermal capacity, not silicon, allowing high peak-to-average current ratios. |
| QGD | 10.7 nC - low gate-drain charge minimizes Miller-induced switching oscillation and improves hard-switching robustness in transmission control H-bridges. |
| Rth(j-mb) | 0.77 K/W - enables efficient heat transfer from junction to mounting surface, reducing thermal derating in compact engine bay layouts. |
| EAS | 193.8 mJ non-repetitive avalanche energy - provides single-pulse fault tolerance during inductive load turn-off in lighting or starter circuits. |
Pinout & Package
LFPAK56 (SOT669) is a 4-lead plastic surface-mount package with exposed mounting base (drain-connected) for enhanced thermal and electrical performance. Dimensions: 5.8 × 4.4 × 1.0 mm (L × W × H), with 1.27 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond-wire inductance and improve current sharing in high-di/dt applications like solenoid actuation. |
| 4 | Gate (G) | Single gate input with 1.4–2.1 V VGS(th) at 25 °C - compatible with 3.3 V/5 V microcontroller GPIO without external driver. |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically connected to drain - serves as primary thermal path and high-current return path; requires soldered thermal pad on PCB. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive-grade reliability including temperature cycling, humidity, and mechanical shock - suitable for safety-critical power stages. |
| True logic-level gate | VGS(th) > 0.5 V at 175 °C ensures turn-on margin even at maximum junction temperature, eliminating need for gate boosters in 12 V systems. |
| Repetitive avalanche rated | Rated for repeated unclamped inductive switching events - enables robust design in transmission valve control without snubber networks. |
| 175 °C maximum junction temperature | Supports operation in engine compartment locations where ambient exceeds 125 °C - reduces need for forced cooling or oversized heatsinks. |
| Low QG(tot) | 35.5 nC total gate charge - enables fast switching with moderate gate drive strength (e.g., TC4427), lowering driver cost and board space. |
Applications
| Start-Stop Micro-Hybrid Control | Automotive Transmission Valve Driver |
|---|---|
|
Use Scenario: High-cycle switching of 12 V solenoids controlling engine stop/start clutch engagement and hydraulic pressure modulation. IC Role / Device Role / Timing Role: Primary power switch in half-bridge or high-side configuration, handling 50–100 A pulsed loads with <10 µs turn-off time. Use Value: Low RDS(on) and 175 °C rating prevent thermal shutdown during frequent start events; avalanche rating absorbs inductive kickback without external clamping. |
Use Scenario: Driving electro-hydraulic valves in automatic transmissions requiring precise PWM-controlled current up to 40 A. IC Role / Device Role / Timing Role: Low-side switch in current-regulated loop, operating at 1–20 kHz PWM with tight dead-time control. Use Value: Fast 34 ns fall time and low QGD minimize shoot-through risk; 30 ns diode trr supports synchronous freewheeling for efficiency. |
| 12 V LED Headlamp Dimming | Engine Cooling Fan Power Stage |
|
Use Scenario: High-current PWM dimming of multi-LED arrays (up to 80 W) in adaptive front-lighting systems (AFS). IC Role / Device Role / Timing Role: High-side or low-side switch modulating 6–10 A at 200–1000 Hz, with rapid transient response to beam-steering commands. Use Value: 2.47 mΩ RDS(on) limits conduction loss to <150 mW at 8 A, enabling compact thermal design; 100 ms SOA supports inrush current during cold start. |
Use Scenario: Controlling brushless DC fan motors (12 V, 15–30 A) in engine bay cooling systems with variable speed profiles. IC Role / Device Role / Timing Role: Inverter half-bridge switch in 3-phase driver, handling 100 A peak currents during stall conditions. Use Value: Repetitive avalanche rating and 718 A peak drain current (tp ≤ 10 µs) tolerate motor lock-up faults without failure; 0.77 K/W Rth(j-mb) maintains Tj < 150 °C at full load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 1.8 mΩ RDS(on), 200 A ID, H2PAK-2 package, 1.2 K/W Rth(j-mb) | Higher current rating but larger footprint and higher thermal resistance - better for high-power fans, less suitable for space-constrained solenoid modules. | Select when peak current > 120 A is required and PCB area allows larger package; verify gate drive compatibility with lower VGS(th) (1.0 V typ). |
| IRF100P4D2 | 40 V, 3.2 mΩ RDS(on), 100 A ID, TO-252 package, 1.5 K/W Rth(j-mb), non-AEC-Q101 | Same voltage/current class but lacks automotive qualification and has inferior thermal performance - acceptable for industrial 12 V systems only. | Choose only for non-automotive applications where AEC-Q101 compliance is unnecessary and thermal margin is sufficient; avoid in engine bay deployments. |
Compared with STL220N4F7AG and IRF100P4D2, BUK9Y3R0-40E offers optimal balance of automotive qualification, thermal efficiency (0.77 K/W), and compact LFPAK56 footprint - making it preferred for space- and reliability-constrained start-stop and transmission control modules.
Availability
BUK9Y3R0-40E is available at Aetrix Electronics and suitable for automotive start-stop systems, transmission control units, and engine cooling fan drivers requiring stable component supply across extended product lifecycles.
Supply support for BUK9Y3R0-40E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.
BUK9Y3R0-40E belongs to Nexperia's LFPAK automotive MOSFET portfolio, engineered specifically for thermally aggressive 12 V automotive power switching - emphasizing AEC-Q101 compliance, avalanche ruggedness, and low RDS(on) at logic-level gate drive.
FAQ
Is BUK9Y3R0-40E suitable for high-frequency PWM applications above 100 kHz?
Yes - with 34 ns fall time, 44 ns rise time, and 10.7 nC QGD, it supports efficient switching up to 200 kHz in DC-DC converters and LED drivers. However, gate drive strength must be ≥2 A peak to fully leverage fast transitions; layout parasitics become critical above 100 kHz.
What is the maximum allowable PCB copper area for the mounting base to achieve 0.77 K/W thermal resistance?
To achieve the specified 0.77 K/W Rth(j-mb), the mounting base must be soldered to ≥200 mm² of 2 oz (70 µm) copper on an internal layer, with ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch) connecting to a solid ground plane. Smaller pads increase Rth linearly - e.g., 100 mm² raises it to ~1.1 K/W.
Does the source-drain diode support synchronous rectification in buck converters?
Yes - the integrated body diode has 30 ns trr and 25 nC Qr, enabling use in synchronous rectification at ≤100 kHz. However, for >100 kHz or high-efficiency designs, external Schottky diodes are recommended due to forward voltage (0.81 V at 25 A) and recovery losses.
Can BUK9Y3R0-40E replace older BUK9Y3R5-40E in existing designs?
Yes - both share identical LFPAK56 package, pinout, and 40 V rating, but BUK9Y3R0-40E offers 3.0 mΩ vs. 3.5 mΩ RDS(on), reducing conduction loss by ~14%. No layout or gate drive changes are needed; verify thermal margin improvement in high-duty-cycle applications.
BUK9Y3R0-40E,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V
- Rds On (Max) @ Id, Vgs:
- 2.5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 35.5 nC @ 5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5962 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 194W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK9Y3R0-40E,115 FAQ
1.How can I place an order for BUK9Y3R0-40E,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9Y3R0-40E,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9Y3R0-40E,115 reliable?
The price and inventory of BUK9Y3R0-40E,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9Y3R0-40E,115 is usually 5 days.
3.What payment methods are accepted for BUK9Y3R0-40E,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9Y3R0-40E,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9Y3R0-40E,115?
BUK9Y3R0-40E,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9Y3R0-40E,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9Y3R0-40E,115?
For technical support, including BUK9Y3R0-40E,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9Y3R0-40E,115 requirements.
6.How does Aetrix verify that BUK9Y3R0-40E,115 is sourced from the original manufacturer or authorized distributors?
All BUK9Y3R0-40E,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9Y3R0-40E,115 meets industry standards.
7.What is the process for return or replacement of BUK9Y3R0-40E,115?
All BUK9Y3R0-40E,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK9Y3R0-40E,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9Y3R0-40E,115 part is unused and in its original packaging.
Return procedure for BUK9Y3R0-40E,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9Y3R0-40E,115 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
