Nexperia USA Inc. BUK9Y3R5-40E,115
- Part No.:
- BUK9Y3R5-40E,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK9Y3R5-40E,115.pdf
- Description:
- MOSFET N-CH 40V 100A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:1,422
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Product details
Overview
BUK9Y3R5-40E from Nexperia is an AEC-Q101-qualified N-channel logic-level MOSFET in LFPAK56 (SOT669) package, rated for 40 V VDS, 3.8 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, and 175 °C junction operation. It delivers 100 A continuous drain current at Tmb = 25 °C and supports ultra-high-performance power switching in 12 V automotive systems including transmission control and solenoid drivers.
For engineers reviewing the BUK9Y3R5-40E datasheet, BUK9Y3R5-40E pinout, BUK9Y3R5-40E application, or BUK9Y3R5-40E equivalent, key selection criteria include its true logic-level gate (VGS(th) > 0.5 V at 175 °C), repetitive avalanche rating, 0.9 K/W junction-to-mounting-base thermal resistance, and LFPAK56 package's high-power density and PCB thermal efficiency.
Technical Context
This MOSFET employs TrenchMOS technology to achieve low RDS(on) with robust switching performance: QGD = 8.6 nC and tf = 29.5 ns enable fast, controlled turn-off in high-frequency PWM applications. Its gate threshold remains functional up to 175 °C, ensuring reliable drive in thermally demanding under-hood environments.
The device integrates a source-drain diode with VSD = 0.82–1.2 V at IS = 25 A and Tj = 25 °C, and supports unclamped single-pulse avalanche energy EAS = 135 mJ - critical for inductive load commutation without external snubbers in motor and solenoid circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V maximum drain-source voltage - defines safe operating ceiling in 12 V automotive battery systems with load dump transients. |
| RDS(on) | 2.9–3.8 mΩ at VGS = 5 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 50 A, reducing heatsink requirements. |
| ID (continuous) | 100 A at Tmb = 25 °C - limited by LFPAK56 package thermal capability, not silicon die. |
| EAS | 135 mJ non-repetitive avalanche energy - allows safe inductive energy absorption during switch-off without external protection. |
| Rth(j-mb) | 0.9 K/W junction-to-mounting-base thermal resistance - enables direct thermal coupling to copper pour or heatsink for high-power density layout. |
| VGS(th) | ≥0.5 V at Tj = 175 °C - ensures gate turn-on remains functional under extreme under-hood temperatures. |
| QGD | 8.6 nC gate-drain charge - determines Miller plateau duration and influences switching loss and dV/dt immunity in hard-switched topologies. |
Pinout & Package
LFPAK56 (SOT669) is a 4-lead surface-mount plastic package with exposed mounting base connected to drain, optimized for high-current automotive power switching. Its low-profile design (max height 1.20 mm) and large copper area support efficient PCB heat spreading.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond wire inductance and improve current sharing - critical for high di/dt motor/solenoid switching. |
| 4 | Gate (G) | Single gate input with low input capacitance (Ciss = 3852–5137 pF) - compatible with standard 5 V logic drivers without gate boosters. |
| Mounting Base | Drain (D) | Exposed copper pad electrically and thermally connected to drain - serves as primary current path and thermal interface to PCB copper pour or heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive-grade reliability across temperature, humidity, and mechanical stress - required for engine bay and transmission control modules. |
| Repetitive avalanche rating | Rated for repeated inductive switching events without degradation - eliminates need for external clamping in solenoid and lamp driver designs. |
| 175 °C maximum junction temperature | Enables operation in high-ambient under-hood locations where ambient exceeds 125 °C - reduces derating and improves system power density. |
| True logic-level gate | VGS(th) ≥ 0.5 V at 175 °C ensures consistent turn-on with standard 5 V microcontroller GPIOs even at peak thermal stress. |
| Low RDS(on) × QG figure of merit | 3.8 mΩ × 30.2 nC = 115 mΩ·nC - balances conduction and switching losses for high-efficiency 10–100 kHz PWM in motor drives. |
Applications
| Transmission Control Module | Engine Start/Stop Solenoid Driver |
|---|---|
|
Use Scenario: High-current switching of hydraulic valve actuators in automatic transmission control units, operating continuously at 12 V with transient spikes up to 40 V. IC Role / Device Role / Timing Role: Main power switch controlling solenoid coil current; handles 50–80 A pulsed loads with 10–100 ms on-time and fast turn-off to prevent coil saturation. Use Value: Low RDS(on) minimizes resistive heating during sustained engagement; avalanche rating absorbs back-EMF without snubber components. |
Use Scenario: Driving starter solenoid coils in engine start-stop systems, where rapid, reliable actuation is required within 50 ms after ignition command. IC Role / Device Role / Timing Role: High-side or low-side power switch interfacing directly with 5 V MCU outputs; must withstand 12 V battery transients and reverse polarity events. Use Value: True logic-level gate ensures full enhancement at cold cranking voltages (~6.5 V); 175 °C rating maintains function during extended stop periods with hot soak. |
| Electric Power Steering (EPS) Motor Phase Switch | 12 V Automotive Lighting Control |
|
Use Scenario: Half-bridge phase leg in brushless DC motor drivers for EPS systems, switching at 20–50 kHz with peak currents >60 A. IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter topology; requires fast, low-loss switching and robust body diode recovery (trr = 26 ns). Use Value: Low QGD and fast fall time (tf = 29.5 ns) reduce switching losses; Crss = 222–304 pF limits Miller-induced shoot-through risk. |
Use Scenario: PWM dimming and on/off control of LED headlamps and interior lighting, handling up to 15 A steady-state current with thermal cycling. IC Role / Device Role / Timing Role: Low-side load switch driven by CAN/LIN microcontroller; must survive load dump (ISO 7637-2 Pulse 5a) and reverse battery connection. Use Value: 40 V VDS rating covers 12 V system transients; integrated source-drain diode provides freewheeling path for inductive LED drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 2.2 mΩ RDS(on) at VGS = 10 V; requires 10 V gate drive for full enhancement; no AEC-Q101 certification stated in public datasheet. | Higher RDS(on) at 5 V gate drive - unsuitable for direct 5 V MCU drive in thermally constrained modules. | Select only if gate drive is 10 V and AEC-Q101 compliance is not required for the target application tier. |
| ON Semiconductor NTMFS4C09NT1G | 40 V, 3.2 mΩ RDS(on) at VGS = 10 V; AEC-Q101 qualified; LFPAK56 package; VGS(th) min = 1.2 V at 25 °C but not specified at 175 °C. | Lacks published VGS(th) guarantee at 175 °C - may exhibit inconsistent turn-on in high-temp engine bay deployments. | Preferable for 10 V gate drive systems; verify thermal margin at max junction temperature before use in transmission control. |
Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK9Y3R5-40E uniquely guarantees logic-level operation (VGS(th) ≥ 0.5 V) at 175 °C and includes repetitive avalanche rating - making it the only option qualified for high-reliability, thermally aggressive automotive power switching where gate drive voltage headroom is limited.
Availability
BUK9Y3R5-40E is available at Aetrix Electronics and suitable for automotive transmission control, engine start-stop solenoid drivers, and electric power steering motor phases requiring stable component supply, long-term lifecycle assurance, and AEC-Q101-compliant traceability.
Supply support for BUK9Y3R5-40E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.
The BUK9Y series is Nexperia's AEC-Q101-qualified logic-level MOSFET product line designed specifically for thermally demanding 12 V automotive power switching applications - emphasizing ruggedness, low RDS(on), and guaranteed high-temperature gate functionality.
FAQ
Is BUK9Y3R5-40E suitable for high-side switching configurations?
No - the LFPAK56 package connects the mounting base to drain, and pins 1–3 are source-only. High-side switching requires isolated gate drive and careful level-shifting; this device is optimized for low-side or half-bridge low-side use where source is referenced to ground or a known potential. Its pinout does not support bootstrap or floating gate drive without external isolation.
What is the maximum allowable PCB copper area for the mounting base?
The mounting base (drain) has no strict upper limit on copper area - larger thermal pads improve heat dissipation. Nexperia recommends minimum 200 mm² of 2 oz copper connected via ≥6 thermal vias (0.3 mm diameter, spaced ≤2 mm apart) to internal or backside ground planes. Excessive copper beyond thermal needs does not degrade electrical performance.
Does BUK9Y3R5-40E require a gate resistor for automotive PWM applications?
Yes - a gate resistor (typically 5–22 Ω) is required to control dV/dt, suppress ringing, and limit peak gate current. The datasheet specifies td(off) = 43.2 ns and tf = 29.5 ns with RG(ext) = 5 Ω; increasing resistance slows switching to reduce EMI but increases switching losses. Layout parasitics also influence optimal value.
Can BUK9Y3R5-40E replace older BUK9Y3R7-40E in existing designs?
Yes - both share identical LFPAK56 package, pinout, and AEC-Q101 qualification. BUK9Y3R5-40E offers lower RDS(on) (3.8 mΩ vs. 3.7 mΩ typical, 4.0 mΩ max for BUK9Y3R7-40E), improved thermal resistance (0.9 K/W vs. 1.0 K/W), and tighter VGS(th) specification at high temperature. No layout or drive changes are needed for drop-in replacement.
BUK9Y3R5-40E,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V
- Rds On (Max) @ Id, Vgs:
- 3.6mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 30.2 nC @ 5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5137 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 167W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK9Y3R5-40E,115 FAQ
1.How can I place an order for BUK9Y3R5-40E,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9Y3R5-40E,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9Y3R5-40E,115 reliable?
The price and inventory of BUK9Y3R5-40E,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9Y3R5-40E,115 is usually 5 days.
3.What payment methods are accepted for BUK9Y3R5-40E,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9Y3R5-40E,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9Y3R5-40E,115?
BUK9Y3R5-40E,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9Y3R5-40E,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9Y3R5-40E,115?
For technical support, including BUK9Y3R5-40E,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9Y3R5-40E,115 requirements.
6.How does Aetrix verify that BUK9Y3R5-40E,115 is sourced from the original manufacturer or authorized distributors?
All BUK9Y3R5-40E,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9Y3R5-40E,115 meets industry standards.
7.What is the process for return or replacement of BUK9Y3R5-40E,115?
All BUK9Y3R5-40E,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK9Y3R5-40E,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9Y3R5-40E,115 part is unused and in its original packaging.
Return procedure for BUK9Y3R5-40E,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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