Diodes Incorporated DMC2041UFDB-7

Overview

DMC2041UFDB from Diodes Incorporated is a complementary-pair enhancement-mode MOSFET in a single U-DFN2020-6 (Type B) package, integrating an N-channel (20V, 40mΩ @ 4.5V, 4.7A) and P-channel (–20V, 90mΩ @ –4.5V, –3.2A) device for bidirectional power control. It delivers low R_DS(ON), ESD-protected gates, and 0.6mm profile-enabling compact load switching in portable power adaptors and dual-rail power management circuits.

For engineers reviewing the DMC2041UFDB datasheet, DMC2041UFDB pinout, DMC2041UFDB application, or DMC2041UFDB equivalent, this dual-MOSFET supports high-efficiency synchronous rectification, battery protection, and USB-C power path control where space-constrained board layout and gate-drive compatibility with 2.5V–4.5V logic are critical selection criteria.

Technical Context

This dual MOSFET integrates independent N- and P-channel devices sharing no internal connection beyond common thermal substrate-each with discrete gate terminals, source terminals, and drain terminals. The N-channel exhibits V_GS(TH) of 0.35–1.4V and 713pF C_iss; the P-channel has V_GS(TH) of –0.35 to –1.4V and 881pF C_iss, enabling matched low-voltage drive capability across both polarities.

Thermal performance is defined by R_θJA = 92°C/W (steady-state) on 1"×1" FR-4 with 2oz copper, and R_θJC = 30°C/W. Safe operating area (SOA) is characterized for single-pulse durations down to 100μs, supporting transient current handling up to 30A (N-ch) and –18A (P-ch) at V_DS = 10V/–10V.

Key Specifications

Pinout & Package

Package: U-DFN2020-6 (Type B), 2.0mm × 2.0mm × 0.6mm, lead-free, halogen-free, NiPdAu-plated terminals, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary dual-MOSFET applications.

Compared with DMC2041UFDB, DMC2038UFDB offers lower R_DS(ON) at cost of higher switching losses, while SIZ250DT provides higher voltage headroom and broader SOA-making DMC2041UFDB optimal for space-constrained 20V-class portable power where balanced conduction/switching efficiency is prioritized.

Availability

DMC2041UFDB is available at Aetrix Electronics and suitable for USB-C power path control, battery protection circuits, and portable power adaptor load switching requiring stable component supply and full RoHS compliance.

Supply support for DMC2041UFDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The DMC2041UFDB belongs to Diodes' U-DFN Dual-MOSFET product line, engineered specifically for miniaturized, high-efficiency power-switching in portable and battery-powered electronics where footprint, thermal performance, and logic-level drive compatibility are critical.

FAQ

What is the maximum continuous drain current for each channel at +70°C ambient?

At T_A = +70°C, the N-channel supports 3.8A and the P-channel supports –2.5A under steady-state conditions. These values reflect derating from the +25°C ratings (4.7A and –3.2A) due to thermal resistance limitations and are validated per JEDEC test board conditions (1"×1" FR-4, 2oz copper).

Does DMC2041UFDB include integrated gate protection diodes?

Yes-the internal schematic shows discrete ESD protection diodes (D1, D2) connected between each gate and source terminal. These provide HBM ESD robustness exceeding 2kV and eliminate the need for external gate clamp components in most consumer and industrial applications.

Can the N-channel and P-channel be operated simultaneously in a synchronous buck configuration?

No-DMC2041UFDB is not designed for synchronous rectification in a single-phase buck converter because its N- and P-channel drains are unconnected and lack shared source/drain nodes required for half-bridge topology. It supports independent load switching or complementary high-/low-side control only.

What is the recommended PCB pad layout for U-DFN2020-6 (Type B)?

The official Diodes pad layout specifies X1 = 0.600mm, Y1 = 1.000mm, G1 = 0.450mm, and thermal pad dimensions of X2 = 1.650mm × Y2 = 2.300mm. A 0.150mm solder mask opening around each terminal and 0.225mm stencil aperture thickness ensure reliable reflow and thermal transfer to the PCB ground plane.