Diodes Incorporated DMC2053UFDBQ-7

Overview

DMC2053UFDBQ-7 from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in a single U-DFN2020-6 (Type B) package, integrating an N-channel (20V, 35mΩ @ 4.5V, 4.6A) and P-channel (–20V, 75mΩ @ –4.5V, –3.1A) MOSFET for bidirectional power control. It delivers low on-resistance, low gate charge (3.6nC/5.9nC), and AEC-Q101 qualification for automotive load switching and portable power management.

For engineers reviewing the DMC2053UFDBQ-7 datasheet, DMC2053UFDBQ-7 pinout, DMC2053UFDBQ-7 application, or DMC2053UFDBQ-7 equivalent, this device supports high-efficiency dual-rail power sequencing, battery protection circuits, and space-constrained DC-DC converter synchronous rectification where thermal performance (R_θJA = 110°C/W with copper pad) and low-profile packaging (0.6mm max height) are critical.

Technical Context

This dual MOSFET implements independent N- and P-channel enhancement-mode transistors sharing no internal connection beyond substrate isolation. The N-channel exhibits V_GS(TH) of 0.4–1.0V and R_DS(ON) as low as 24mΩ at V_GS = 4.5V; the P-channel has V_GS(TH) of –0.45 to –1.0V and R_DS(ON) down to 57mΩ at V_GS = –4.5V. Both devices feature low C_iss (369pF / 440pF) and fast switching (t_D(ON) = 2.6ns / 3.2ns).

Thermal design relies on FR-4 PCB mounting with 1-inch² copper plate achieving 110°C/W R_θJA, while its U-DFN2020-6 (Type B) footprint occupies only 4mm². The device operates across –55°C to +150°C junction temperature and supports automotive PPAP with IATF 16949 manufacturing.

Key Specifications

Pinout & Package

U-DFN2020-6 (Type B) is a 2.0mm × 2.0mm × 0.6mm leadless plastic package with exposed thermal pad and NiPdAu-plated terminals. Its bottom-view pinout places Pin 1 (D1) at top-left corner, with symmetrical layout optimized for thermal dissipation and routing simplicity on dense PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Compared with DMC2053UFDBQ-7, DMC2056UFDBQ-7 trades lower cost for higher conduction loss and no automotive qualification, while SI6926ADQ-T1-GE3 offers comparable specs in a non-pin-compatible package lacking AEC-Q101 validation-making DMC2053UFDBQ-7 the sole option for space-constrained, thermally demanding automotive load switching.

Availability

DMC2053UFDBQ-7 is available at Aetrix Electronics and suitable for automotive load switching, USB-C power delivery, and portable power adaptor applications requiring stable component supply, long-term lifecycle support, and AEC-Q101 compliance.

Supply support for DMC2053UFDBQ-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for automotive, industrial, and consumer markets.

The DMC series targets space-constrained, high-efficiency power control applications, with the DMC2053UFDBQ-7 specifically engineered to replace discrete N+P MOSFET pairs in automotive-grade load switches and portable power systems.

FAQ

What is the maximum continuous drain current for each channel at +70°C ambient?

The N-channel supports 3.7A and the P-channel supports –2.5A at TA = +70°C with FR-4 PCB and 1-inch² copper pad per datasheet Note 6. These values reflect thermal derating from the +25°C ratings (4.6A/–3.1A) due to reduced heat dissipation at elevated ambient temperatures.

Does the DMC2053UFDBQ-7 require external gate resistors for stable switching?

No external gate resistor is mandatory-the device's low gate resistance (4.1Ω N, 8.5Ω P) and moderate Qg allow direct driving from standard logic-level PWM controllers. However, a 5–10Ω series resistor is recommended to dampen ringing in high-di/dt applications like synchronous buck converters.

Can the N- and P-channel MOSFETs be operated simultaneously in a totem-pole configuration?

No-simultaneous conduction would cause shoot-through due to lack of integrated dead-time control or cross-conduction protection. The device is intended for complementary but non-overlapping use (e.g., high-side N + low-side P in load switch), not half-bridge totem-pole topologies.

Is the thermal pad on the U-DFN2020-6 (Type B) package electrically connected internally?

No-the exposed thermal pad is not internally connected to any terminal; it must be soldered to a PCB copper pour for thermal conduction only. Electrical isolation is maintained, allowing flexible grounding or floating thermal pad layout per design requirements.