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Diodes Incorporated DMC25D0UVT-13

Part No.:
DMC25D0UVT-13
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
SOT-23-6 Thin, TSOT-23-6
Datasheet:
AetrixDMC25D0UVT-13.pdf
Description:
MOSFET N/P-CH 25V/30V TSOT23
Quantity:
Payment:
Payment
Shipping:
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Inventory:8,223

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Product details

Overview

DMC25D0UVT-13 from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in TSOT26 package, integrating one N-channel (25V, 4Ω @ 4.5V) and one P-channel (–30V, 80mΩ @ –12V) device for bidirectional power control. It delivers low RDS(ON), fast switching, and ESD-protected gate (>6kV HBM), targeting compact DC-DC converters and load-switching functions in space-constrained industrial and consumer power modules.

For engineers reviewing the DMC25D0UVT-13 datasheet, DMC25D0UVT-13 pinout, DMC25D0UVT-13 application, or DMC25D0UVT-13 equivalent, key selection criteria include dual-channel voltage polarity support, thermal resistance (RθJA = 101°C/W), gate charge asymmetry (Qg = 0.4nC / 21nC), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This dual MOSFET implements independent N- and P-channel enhancement-mode transistors sharing a common source configuration in a single TSOT26 package. The N-channel device operates with VGS(TH) = 0.65–1.5V and supports 0.4A continuous drain current at 4.5V drive, while the P-channel uses VGS(TH) = –0.5 to –1.5V and handles –3.2A at –10V gate bias.

Thermal design is constrained by RθJA = 101°C/W (steady-state) and RθJC = 37°C/W, requiring careful PCB copper layout per FR-4 2oz specification. Dynamic performance includes asymmetric gate capacitance (Ciss = 26.2pF / 854pF) and turn-off delay disparity (tD(OFF) = 7.7ns / 61.4ns), necessitating matched gate-drive timing in synchronous buck or half-bridge topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS (Q1/Q2) 25V / –30V - Defines maximum blocking voltage for high-side N-channel and low-side P-channel operation in buck or load-switch configurations.
RDS(ON) 4Ω @ 4.5V (Q1), 80mΩ @ –12V (Q2) - Determines conduction loss in 12V/5V rail switching; Q2 dominates power loss in P-channel high-side applications.
ID Continuous 0.4A (Q1), –3.2A (Q2) - Sets maximum steady-state current capability; Q2 enables higher-load P-channel switching where gate drive voltage exceeds supply.
Qg 0.4nC (Q1), 21nC (Q2) - Drives gate driver sizing: Q2 requires ~50× more charge than Q1, demanding asymmetric drive strength for balanced switching transitions.
Ciss 26.2pF (Q1), 854pF (Q2) - Impacts high-frequency switching efficiency and EMI; Q2's large input capacitance limits usable PWM frequency without excessive gate drive loss.
TJ Range –55°C to +150°C - Enables operation in extended-temperature environments such as automotive under-hood or industrial motor-control enclosures.
AEC-Q101 Qualified - Confirms suitability for automotive power management systems requiring stress-tested reliability beyond standard commercial grade.

Pinout & Package

Package: TSOT26 - 6-pin thermally enhanced surface-mount package with exposed drain pad (Q1 Drain, Q2 Drain), molded green compound, UL 94V-0 rated, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (G1) N-channel gate Control input for Q1; requires ≥4.5V to achieve 4Ω RDS(ON); ESD-protected to >6kV HBM.
Pin 2 (S1/S2) Common source node Shared source connection between Q1 and Q2; forms return path for bidirectional current flow in half-bridge or load-switch topologies.
Pin 3 (D1) N-channel drain Exposed pad (top-side); primary heat dissipation path; connects to high-side output or input rail in buck converter.
Pin 4 (G2) P-channel gate Control input for Q2; driven negative relative to source; threshold –0.5V to –1.5V enables logic-level compatibility with inverted drive.
Pin 5 (D2) P-channel drain Exposed pad (top-side); second thermal path; used for low-side switching or reverse-polarity protection where Q2 sinks current to ground.
Pin 6 (S1/S2) Common source node Second connection to shared source; ensures low-inductance return path; must be routed with minimum loop area for EMI control.

Key Features

Feature Design Value
Complementary channel pairing Single-package integration of matched N- and P-channel MOSFETs eliminates inter-device timing skew and reduces PCB footprint by >40% vs discrete solutions.
Low RDS(ON) asymmetry Q1 (4Ω) and Q2 (80mΩ) optimized for different roles: Q1 for low-current control logic, Q2 for high-current power path-enabling efficient rail switching without external current balancing.
ESD-protected gate (Q1) Robust >6kV Human Body Model rating on N-channel gate allows direct interface with microcontroller GPIOs without external transient suppression.
AEC-Q101 qualification Validated for automotive temperature cycling, humidity, and mechanical shock-supports use in infotainment power rails and body-control modules.
Green packaging Halogen- and antimony-free molding compound (<900ppm Br/Cl, <1000ppm Sb) meets EU RoHS 2 and automotive ELV directives for sustainable manufacturing.

Applications

DC-DC Buck Converter Reverse-Polarity Protection

Use Scenario: 12V-to-5V step-down conversion in automotive accessory modules with tight thermal constraints.

IC Role / Device Role / Timing Role: Q1 acts as high-side synchronous rectifier; Q2 serves as low-side switch with gate driven by dedicated controller; complementary timing minimizes shoot-through risk.

Use Value: Combined RDS(ON) and low Qg reduce conduction and switching losses, achieving >92% efficiency at 1A load with minimal heatsinking.

Use Scenario: Protecting USB-C PD ports and battery management ICs from accidental reverse connection in portable medical devices.

IC Role / Device Role / Timing Role: Q2 configured as high-side P-channel switch; Q1 disabled or used for status monitoring; source tied to input, drain to protected load.

Use Value: 80mΩ RDS(ON) at –12V ensures <100mV drop at 1.25A, preserving voltage headroom for sensitive analog front-ends.

Load Switch for Industrial I/O Hot-Swap Controller Interface

Use Scenario: Enabling/disabling 3.3V sensor rails in programmable logic controllers with inrush current limiting.

IC Role / Device Role / Timing Role: Q1 used as controlled enable switch; Q2 provides active pull-down during shutdown to prevent floating nodes; common-source architecture simplifies gate drive sequencing.

Use Value: Fast tF = 3.7ns (Q1) and tR = 3.3ns (Q2) allow sub-microsecond switching, supporting dynamic power gating in real-time control loops.

Use Scenario: Isolating backplane slots in modular test equipment during live insertion/removal.

IC Role / Device Role / Timing Role: Q2 functions as main power switch; Q1 monitors VGS or leakage to detect fault conditions; shared thermal pad enables accurate junction temperature feedback.

Use Value: RθJC = 37°C/W allows direct thermal coupling to heatsink, enabling sustained 2.6A operation at TA = 85°C without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMC2038LSD-7 Higher VDSS (30V/–30V), lower RDS(ON) (2.2Ω/45mΩ), but larger TSOT26 footprint and no AEC-Q101 rating. Preferred for 24V industrial systems needing tighter RDS(ON) tolerance, but unsuitable for automotive qualified designs. Select when higher voltage margin and lower conduction loss outweigh qualification requirements.
SI6926ADQ-T1-GE3 Same TSOT26 package, but Q1/Q2 RDS(ON) = 3.5Ω/60mΩ at 4.5V/–4.5V; lacks ESD protection on N-channel gate. Better suited for cost-sensitive consumer power banks where gate robustness is secondary to BOM count reduction. Choose for non-automotive applications where gate ESD immunity is managed externally and thermal budget permits higher RDS(ON).

Compared with DMC25D0UVT-13, DMC2038LSD-7 offers superior voltage rating and conduction efficiency but sacrifices automotive qualification, while SI6926ADQ-T1-GE3 reduces gate drive complexity at the expense of ESD resilience and thermal performance-making DMC25D0UVT-13 optimal for AEC-Q101-compliant, thermally constrained dual-rail systems.

Availability

DMC25D0UVT-13 is available at Aetrix Electronics and suitable for DC-DC converters, reverse-polarity protection circuits, and industrial load-switching applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability.

Supply support for DMC25D0UVT-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for automotive, industrial, and consumer markets.

The DMC series targets space-constrained power switching applications, with DMC25D0UVT-13 specifically engineered to deliver AEC-Q101-qualified complementary MOSFET performance in ultra-thin TSOT26 packaging for next-generation automotive body electronics and portable power systems.

FAQ

What is the maximum continuous drain current for each channel at 25°C?

The N-channel (Q1) supports 0.4A continuous drain current at VGS = 4.5V and TA = 25°C, while the P-channel (Q2) delivers –3.2A at VGS = –10V under identical conditions. Derating applies above 25°C per RθJA = 101°C/W; at 85°C ambient, Q2 is limited to approximately –2.6A.

Can DMC25D0UVT-13 be used in a synchronous buck converter?

Yes-its complementary N/P-channel structure supports synchronous rectification: Q1 as high-side switch and Q2 as low-side switch. However, gate drive must account for asymmetric Qg (0.4nC vs 21nC) and VGS(TH) polarity; a dedicated dual-output gate driver with independent voltage rails is required to avoid shoot-through and ensure clean transitions.

Is the TSOT26 package lead-free and RoHS compliant?

Yes-DMC25D0UVT-13 uses matte tin annealed over copper leadframe and fully complies with EU Directive 2011/65/EU (RoHS 2). It contains no intentionally added lead, bromine, chlorine, or antimony above defined thresholds (<900ppm Br/Cl, <1000ppm Sb), meeting Diodes Incorporated's "Green" product definition.

How does the ESD protection on the N-channel gate impact system-level design?

The N-channel gate features >6kV Human Body Model ESD protection, allowing direct connection to microcontroller GPIOs without external TVS diodes in most board-level environments. This reduces BOM count and layout area but does not eliminate need for system-level ESD protection on exposed connectors or cables feeding into the MOSFET-controlled circuit.

DMC25D0UVT-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
SOT-23-6 Thin, TSOT-23-6
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
N and P-Channel
FET Feature:
-
Drain to Source Voltage (Vdss):
25V, 30V
Current - Continuous Drain (Id) @ 25°C:
400mA, 3.2A
Rds On (Max) @ Id, Vgs:
4Ohm @ 400mA, 4.5V
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.7nC @ 8V
Input Capacitance (Ciss) (Max) @ Vds:
26.2pF @ 10V
Power - Max:
1.2W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TSOT-23-6

DMC25D0UVT-13 FAQ

1.How can I place an order for DMC25D0UVT-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMC25D0UVT-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMC25D0UVT-13 reliable?

The price and inventory of DMC25D0UVT-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMC25D0UVT-13 is usually 5 days.

3.What payment methods are accepted for DMC25D0UVT-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMC25D0UVT-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMC25D0UVT-13?

DMC25D0UVT-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMC25D0UVT-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMC25D0UVT-13?

For technical support, including DMC25D0UVT-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMC25D0UVT-13 requirements.

6.How does Aetrix verify that DMC25D0UVT-13 is sourced from the original manufacturer or authorized distributors?

All DMC25D0UVT-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMC25D0UVT-13 meets industry standards.

7.What is the process for return or replacement of DMC25D0UVT-13?

All DMC25D0UVT-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMC25D0UVT-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMC25D0UVT-13 part is unused and in its original packaging.

Return procedure for DMC25D0UVT-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMC25D0UVT-13 Tags

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