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Diodes Incorporated DMC3025LNS-7

Part No.:
DMC3025LNS-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
8-PowerVDFN
Datasheet:
AetrixDMC3025LNS-7.pdf
Description:
MOSFET N/P-CH 30V 7.2A PWRDI3333
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,084

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Product details

Overview

DMC3025LNS-7 from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in a single POWERDI®3333-8 (UXB) package, integrating one N-channel (30V, 25mΩ @ 10V) and one P-channel (−30V, 28mΩ @ −10V) device. It delivers 7.2A/−6.8A continuous drain current at 25°C and supports high-efficiency dual-rail power management in compact DC-DC converters and load switches.

For engineers reviewing the DMC3025LNS-7 datasheet, DMC3025LNS-7 pinout, DMC3025LNS-7 application, or DMC3025LNS-7 equivalent, key selection criteria include verified RDS(ON) matching across both channels, thermal resistance (RθJA = 69°C/W with thermal pad), gate charge asymmetry (Qg = 9.8nC / 19.7nC), and complementary threshold voltages (VGS(TH) = +1.0–2.0V / −1.2–−2.4V).

Technical Context

This dual-channel MOSFET uses planar silicon process technology to achieve matched on-resistance and fast switching (tF = 5.8ns / 22ns) while maintaining low input capacitance (Ciss = 500pF / 1188pF). Its complementary topology enables synchronous half-bridge and H-bridge configurations without external level-shifting circuitry.

The device operates across −55°C to +150°C junction temperature, with avalanche-rated energy handling (EAS = 9.8mJ / 24mJ) and body diode recovery (tRR = 5.6ns / 10.4ns). Thermal design leverages the UXB package's low RθJC = 15°C/W and exposed thermal pad for PCB heat spreading.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS ±30V - Supports dual-rail 24V systems with 20% headroom for transients
RDS(ON) (Q1/Q2) 25mΩ / 28mΩ @ VGS = ±10V - Enables <1W conduction loss at 7A per channel
ID Continuous 7.2A / −6.8A @ TA = 25°C - Sustains >6A load current in thermally optimized 2oz copper layouts
Qg 9.8nC / 19.7nC @ VGS = ±10V - Determines gate drive power requirement for 1MHz switching
Ciss 500pF / 1188pF @ VDS = ±15V - Sets Miller effect magnitude and EMI filtering needs
tF 5.8ns / 22ns - Defines minimum dead-time requirement to prevent shoot-through
RθJA 69°C/W - Achievable only with 1-inch² thermal pad on bottom layer; 105°C/W without

Pinout & Package

Package: POWERDI®3333-8 (Type UXB), surface-mount, thermally enhanced with exposed copper pad. Dimensions: 3.30mm × 3.30mm × 0.80mm (L×W×H), moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
D1 N-channel drain Main current path for high-side N-MOSFET; connects to input rail in high-side switch
S1 N-channel source Reference node for N-MOS gate drive; ties to load or output node
G1 N-channel gate Control input requiring +10V swing; threshold centered at +1.6V
D2 P-channel drain Main current path for low-side P-MOSFET; connects to load return or ground
S2 P-channel source Reference node for P-MOS gate drive; ties to input rail or VCC
G2 P-channel gate Control input requiring −10V swing relative to S2; threshold centered at −1.8V

Key Features

Feature Design Value
Complementary Pair Integration Single-package N+P pairing eliminates layout mismatch and reduces board area by >40% vs discrete solutions
Low RDS(ON) Asymmetry Q1/Q2 on-resistance ratio = 25/28 = 0.89 - Enables balanced conduction loss in bidirectional switches
Fast Body Diode Recovery tRR = 5.6ns (N) / 10.4ns (P) - Minimizes reverse recovery loss in synchronous rectification
Thermal Pad Performance RθJC = 15°C/W - Enables >1.5W dissipation with 30°C rise using standard FR-4 PCB
Green Compliance Halogen-free, antimony-free, RoHS-compliant - Meets IPC-1752A Class 3 material declaration requirements

Applications

USB Power Delivery Switch Industrial I/O Protection

Use Scenario: Bidirectional 5–20V USB PD port protection with overcurrent and reverse-polarity blocking.

IC Role / Device Role / Timing Role: Dual-channel load switch controlling VBUS path and CC line isolation; operates as back-to-back MOSFET pair.

Use Value: Eliminates need for separate N/P drivers and level shifters; RDS(ON) < 30mΩ ensures <120mV drop at 4A.

Use Scenario: 24V industrial digital input module with polarity reversal and surge protection.

IC Role / Device Role / Timing Role: Complementary front-end switch enabling reverse-voltage blocking and hot-swap sequencing.

Use Value: Integrated body diodes handle transient clamping; tF < 22ns prevents latch-up during ESD events.

DC-DC Synchronous Rectifier Motor Driver Half-Bridge

Use Scenario: Secondary-side synchronous rectification in isolated 12V→5V flyback converters.

IC Role / Device Role / Timing Role: N-channel (high-side) and P-channel (low-side) rectifiers driven by transformer-coupled gate signals.

Use Value: Matched Qg/RDS(ON) enables <92% efficiency at 5A; Coss < 160pF minimizes switching loss.

Use Scenario: Low-power brushed DC motor control in battery-powered tools and actuators.

IC Role / Device Role / Timing Role: Half-bridge driver stage where Q1 controls PWM high-side and Q2 provides freewheeling path.

Use Value: Avalanche-rated EAS = 24mJ absorbs inductive kickback; tD(OFF) = 36ns allows precise dead-time tuning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMC2038LVT-7 Lower voltage rating (±20V), higher RDS(ON) (40mΩ/45mΩ), smaller 2×2mm package Better suited for 5V/12V logic-level interfaces; insufficient for 24V industrial rails Select when board space is constrained and voltage stress <20V; avoid for 30V bus applications.
SI6926ADQ-T1-GE3 Same 30V rating but asymmetric packaging (SO-8), higher Qg (15nC/25nC), no thermal pad Requires larger PCB footprint and external heatsinking for >1W operation Choose if SO-8 compatibility is mandatory; expect 25°C higher junction temp at same current.

Compared with DMC3025LNS-7, DMC2038LVT-7 trades voltage margin for size reduction, while SI6926ADQ-T1-GE3 sacrifices thermal performance for legacy package compatibility-neither matches the UXB's RθJA = 69°C/W or integrated thermal pad.

Availability

DMC3025LNS-7 is available at Aetrix Electronics and suitable for USB PD implementations, industrial I/O modules, and motor driver half-bridges requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for DMC3025LNS-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the US.

The DMC3025LNS belongs to Diodes' POWERDI® family of thermally optimized MOSFETs, engineered specifically for space-constrained, high-efficiency power conversion in consumer, industrial, and computing applications.

FAQ

What is the maximum safe operating junction temperature for DMC3025LNS-7?

The absolute maximum junction temperature is +150°C, validated across all operating conditions per DS38130 Rev. 3-2. Derating begins at +125°C ambient when mounted on 2oz copper with thermal bias; sustained operation above +135°C junction requires active cooling or reduced current.

Can DMC3025LNS-7 be used in a synchronous buck converter as both high-side and low-side switches?

No-it integrates an N-channel and P-channel MOSFET, not two N-channels. The P-channel device serves as a low-side switch but lacks the gate drive compatibility for standard N-channel synchronous buck controllers. It is appropriate for buck-derived topologies like floating-gate P-channel low-side or complementary PWM stages.

Does the POWERDI®3333-8 package require solder paste stencil adjustments versus standard SO-8?

Yes-the UXB package has a 3.3mm × 3.3mm body and exposed thermal pad requiring a 0.15mm-thick stencil with 70% aperture opening (0.23mm × 0.23mm) for optimal void control. Standard SO-8 stencils produce excessive solder volume and tombstoning risk on the 0.32mm lead width.

How does the gate threshold voltage mismatch between Q1 and Q2 affect turn-on timing?

Q1 VGS(TH) = +1.0–2.0V and Q2 VGS(TH) = −1.2–−2.4V create a natural 200–400mV turn-on offset, reducing simultaneous conduction risk. This inherent asymmetry simplifies dead-time design in complementary switching, eliminating need for external delay circuits.

DMC3025LNS-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
N and P-Channel Complementary
FET Feature:
-
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
7.2A (Ta), 6.8A (Ta)
Rds On (Max) @ Id, Vgs:
25mOhm @ 7A, 10V, 28mOhm @ 7A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
4.6nC @ 4.5V, 9.5nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
500pF @ 15V, 1188pF @ 15V
Power - Max:
1.2W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
PowerDI3333-8

DMC3025LNS-7 FAQ

1.How can I place an order for DMC3025LNS-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMC3025LNS-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMC3025LNS-7 reliable?

The price and inventory of DMC3025LNS-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMC3025LNS-7 is usually 5 days.

3.What payment methods are accepted for DMC3025LNS-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMC3025LNS-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMC3025LNS-7?

DMC3025LNS-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMC3025LNS-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMC3025LNS-7?

For technical support, including DMC3025LNS-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMC3025LNS-7 requirements.

6.How does Aetrix verify that DMC3025LNS-7 is sourced from the original manufacturer or authorized distributors?

All DMC3025LNS-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMC3025LNS-7 meets industry standards.

7.What is the process for return or replacement of DMC3025LNS-7?

All DMC3025LNS-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMC3025LNS-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMC3025LNS-7 part is unused and in its original packaging.

Return procedure for DMC3025LNS-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMC3025LNS-7 Tags

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