Diodes Incorporated DMC3028LSD-13

Overview

DMC3028LSD-13 from Diodes Incorporated is a complementary dual enhancement-mode MOSFET in SO-8 package, integrating one N-channel (30V, 28mΩ @ 10V) and one P-channel (–30V, 25mΩ @ –10V) device. It delivers 7.1A/–7.4A continuous drain current at 25°C and supports high-efficiency half-bridge and H-bridge motor control circuits.

For engineers reviewing the DMC3028LSD-13 datasheet, DMC3028LSD-13 pinout, DMC3028LSD-13 application, or DMC3028LSD-13 equivalent, key selection criteria include verified R_DS(on) at 4.5V/–4.5V, body diode recovery performance (Q_rr = 4.4nC / 10nC), thermal resistance (R_θJA = 60–100°C/W), and SO-8 dual-die layout compatibility with standard PCB footprints.

Technical Context

This dual MOSFET implements independent N- and P-channel silicon dies in a single SO-8 thermally enhanced leadframe. The N-channel Q1 features 12S transconductance and fast switching (t_r = 3.1ns, t_f = 9.7ns), while the P-channel Q2 provides higher g_fs (18.6S) and optimized gate charge balance for synchronous buck or bridge-leg operation.

Thermal design is constrained by junction-to-ambient resistance varying from 60°C/W (two active die) to 100°C/W (single die), with derating based on FR4 PCB copper coverage. Safe operating area (SOA) curves confirm pulsed capability up to 34A/–36A with 300μs pulse width and 2% duty cycle.

Key Specifications

Pinout & Package

Package: SO-8 (Surface-Mount, 8-pin, molded plastic, UL 94V-0 rated). Dual-die construction with isolated N- and P-channel dies sharing common source terminals per channel.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary dual MOSFET applications.

Compared with DMC2038LSD-13, DMC3028LSD-13 delivers 22% lower conduction loss at 6A; versus SI6926DQ-T1-GE3, its optimized pinout reduces gate loop inductance by 30%, improving noise immunity in motor drive applications.

Availability

DMC3028LSD-13 is available at Aetrix Electronics and suitable for motor control, backlighting, DC-DC converters, and power management functions requiring stable component supply across industrial and automotive production programs.

Supply support for DMC3028LSD-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the Philippines.

This device belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, space-constrained power conversion and motor drive applications where thermal performance and switching fidelity are critical.

FAQ

What is the maximum safe operating temperature for DMC3028LSD-13 in continuous operation?

The device supports junction temperatures from –55°C to +150°C. For continuous operation with both channels active, thermal derating begins at 25°C ambient, with maximum power dissipation limited to 1.8W (N-ch) and 1.4W (P-ch) on a 25mm × 25mm 1oz Cu PCB-corresponding to ~115°C junction at 70°C ambient.

Can DMC3028LSD-13 be used in a synchronous buck converter with 3.3V gate drive?

Yes-both channels specify R_DS(on) at V_GS = 4.5V (45mΩ N-ch, 41mΩ P-ch), confirming usable conduction with 3.3V logic-level drivers. However, gate charge requirements (Q_g = 5.2nC/16.4nC at 4.5V) demand careful driver sizing to maintain <100ns rise/fall times.

How does the body diode performance compare between Q1 and Q2?

Q1 exhibits faster reverse recovery (trr = 11.5ns, Q_rr = 4.4nC) than Q2 (trr = 16.2ns, Q_rr = 10nC) due to differing doping profiles. This asymmetry must be accounted for in synchronous rectification timing-Q2 requires longer dead time to avoid cross-conduction in bridge configurations.

Is the SO-8 package thermally enhanced, and how is heat dissipated?

Yes-the SO-8 package uses an exposed copper leadframe with thermal pad under the drain terminals (D1 and D2). Heat flows primarily through the drain leads into PCB copper; R_θJL is 51°C/W (Q1) and 46°C/W (Q2), enabling efficient conduction cooling when soldered to ≥1in² of 1oz Cu pour with thermal vias.