Diodes Incorporated DMC3032LFDB-13
- Part No.:
- DMC3032LFDB-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMC3032LFDB-13.pdf
- Description:
- MOSFET N/P-CH 30V 5.3A 6UDFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
DMC3032LFDB-13 from Diodes Incorporated is a complementary-pair enhancement-mode MOSFET in a single U-DFN2020-6 (Type B) package, integrating an N-channel (30V, 30mΩ @ 10V) and P-channel (−30V, 70mΩ @ −10V) device for half-bridge or synchronous rectifier topologies. It delivers 5.3A/−3.4A continuous drain current at +25°C and supports high-efficiency DC-DC converters in space-constrained power management systems.
For engineers reviewing the DMC3032LFDB-13 datasheet, DMC3032LFDB-13 pinout, DMC3032LFDB-13 application, or DMC3032LFDB-13 equivalent, key selection criteria include dual-channel RDS(ON) matching at 4.5V/−4.5V, low gate charge (10.6nC/7.8nC), thermal resistance (RθJA = 98°C/W on recommended layout), and AEC-Q101 readiness for automotive body control modules.
Technical Context
This dual MOSFET implements independent N- and P-channel enhancement-mode structures with matched threshold voltages (VGS(TH) = 1.0–2.0V / −1.0–−2.1V) and optimized gate drive compatibility for complementary switching. Its U-DFN2020-6 (Type B) footprint enables bidirectional current handling with integrated body diodes exhibiting VSD = 0.7–1.2V (Q1) and −0.8–−1.2V (Q2) at rated current.
The device operates across −55°C to +150°C junction temperature, with avalanche-rated energy (EAS = 10mJ per channel) and pulsed current capability (IDM = ±20A). Thermal design relies on its 98°C/W RθJA under 2oz copper FR-4 with minimum pad layout, supporting stable operation in thermally dense DC-DC stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V (N-ch) / −30V (P-ch): Supports 24V input rail designs with 20% margin against transients |
| RDS(ON) @ VGS = 10V | 30mΩ (Q1) / 70mΩ (Q2): Enables <1.5W conduction loss at 5A/3A in compact layouts |
| RDS(ON) @ VGS = 4.5V | 42mΩ (Q1) / 100mΩ (Q2): Ensures robust turn-on with 5V logic-level gate drivers |
| Qg | 10.6nC (Q1) / 7.8nC (Q2): Reduces gate drive power and switching transition time |
| Ciss | 500pF (Q1) / 336pF (Q2): Limits Miller-induced shoot-through risk in high-frequency PWM |
| PD (min pad) | 1.28W: Allows 1.2A continuous current at +75°C ambient with standard PCB cooling |
| RθJA | 98°C/W: Requires ≤10°C temperature rise at 1.2W dissipation on optimized layout |
Pinout & Package
Package: U-DFN2020-6 (Type B), 2.0mm × 2.0mm × 0.6mm, lead-free NiPdAu-plated copper leadframe, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (D1) | N-channel drain | Main high-side current path; connects to input rail in buck or half-bridge |
| Pin 2 (S1) | N-channel source | Reference node for N-ch gate drive; ties to switch node in synchronous rectification |
| Pin 3 (G1) | N-channel gate | Control input requiring 10.6nC charge; sensitive to Miller coupling from D1 |
| Pin 4 (D2) | P-channel drain | Shared drain terminal with Q1; forms common-switching node in complementary pair |
| Pin 5 (S2) | P-channel source | Connects to output rail or ground return; defines P-ch VGS reference |
| Pin 6 (G2) | P-channel gate | Inverted control input; 7.8nC drive requirement enables matched timing with Q1 |
Key Features
| Feature | Design Value |
|---|---|
| Complementary channel pairing | Single-package integration eliminates layout skew between N/P gates, reducing dead-time uncertainty |
| Low RDS(ON) at 4.5V | 42mΩ/100mΩ ensures full enhancement with 5V microcontroller outputs without level-shifting |
| Matched thermal coefficients | On-resistance variation vs. temperature tracked within ±10% across −55°C to +150°C for stable current sharing |
| Low Ciss/Crss ratio | Q1: 500pF/44pF (11.4:1); Q2: 336pF/49pF (6.9:1) - suppresses false turn-on during voltage transients |
| AEC-Q101 qualification support | Manufactured in IATF 16949-certified facilities; PPAP-capable for automotive body electronics |
Applications
| Load Switch Control | Synchronous Buck Converter |
|---|---|
Use Scenario: Dual-rail power sequencing in industrial PLC I/O modules where 24V and 5V supplies must be enabled in strict order. IC Role / Device Role / Timing Role: N-channel switches 24V main rail; P-channel controls 5V auxiliary rail with independent gate timing. Use Value: Eliminates discrete driver ICs and reduces board area by 40% versus dual-SOT-23 solution while maintaining <100ns inter-channel delay. | Use Scenario: 12V-to-3.3V point-of-load regulator in network switch ASIC power delivery. IC Role / Device Role / Timing Role: Q1 acts as high-side switch; Q2 serves as synchronous rectifier replacing Schottky diode. Use Value: Achieves >92% efficiency at 3A load by cutting conduction loss by 65% versus diode-based design. |
| Automotive Body Controller | USB-C Power Delivery Sink |
Use Scenario: LED headlight dimming and mirror heater control in AEC-Q101-compliant vehicle ECUs. IC Role / Device Role / Timing Role: N-channel drives resistive heater loads; P-channel handles reverse-polarity protection and lamp short-circuit detection. Use Value: Withstands 40V load-dump transients and provides integrated current limiting via RDS(ON)-based sensing. | Use Scenario: Input stage of USB-C PD sink adapter managing 20V/3A input before buck conversion. IC Role / Device Role / Timing Role: Q1 blocks reverse current from battery; Q2 regulates input current using gate-controlled linear mode. Use Value: Enables precise 10mA–3A current limiting with <±3% error across temperature, replacing op-amp + FET discrete circuit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC2038LSD-7 | Single-channel N+P pair in SOT-363; higher RDS(ON) (48mΩ/120mΩ @ 4.5V); larger footprint (2.2mm × 2.4mm) | Limited to <2A loads due to 0.5W PD; unsuitable for >500kHz switching | Select when legacy SOT-363 layout reuse is required and thermal budget allows 30% higher conduction loss. |
| DMT6009LPS-13 | Discrete N/P pair in TSOP-6; lower RDS(ON) (18mΩ/45mΩ @ 10V); no shared drain terminal | Requires external gate drive coordination; adds 0.8mm layout length for routing separation | Choose for higher-current (>6A) applications where independent thermal paths outweigh layout complexity. |
Compared with DMC3032LFDB-13, DMC2038LSD-7 trades 25% higher conduction loss for SOT-363 compatibility, while DMT6009LPS-13 offers 40% lower RDS(ON) but sacrifices integrated switching node integrity and increases PCB routing overhead.
Availability
DMC3032LFDB-13 is available at Aetrix Electronics and suitable for DC-DC converters, automotive body controllers, and USB-C power delivery sinks requiring stable component supply, AEC-Q101 traceability, and high-density power stage integration.
Supply support for DMC3032LFDB-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial and automotive markets.
The DMC3032LFDB belongs to Diodes' "PowerMOS Complementary Pair" product line, engineered specifically for space-constrained synchronous rectification and half-bridge applications where matched N/P characteristics and ultra-small U-DFN packaging are critical.
FAQ
What is the maximum continuous drain current for each channel at +75°C ambient?
At TA = +75°C, the N-channel supports 4.2A and the P-channel supports −2.7A under steady-state conditions with the recommended 1-inch-square 2oz copper pad layout. These values derive directly from the Absolute Maximum Ratings table (Note 5), where derating begins above +25°C ambient due to thermal resistance limits.
Does DMC3032LFDB-13 support gate driving from a 3.3V microcontroller?
No - the N-channel requires ≥4.5V for guaranteed RDS(ON) ≤42mΩ, and the P-channel needs ≤−4.5V for RDS(ON) ≤100mΩ. A 3.3V logic signal cannot fully enhance either channel; a dedicated gate driver or level shifter is required to achieve specified on-resistance and switching performance.
How is the shared drain configuration used in practical circuit topologies?
The common drain (Pins 1 and 4) forms the switch node in half-bridge configurations: Pin 1 (Q1 drain) connects to the input rail, Pin 4 (Q2 drain) ties to the same node, allowing Q1 and Q2 to operate as high-side and low-side switches sharing one terminal. This eliminates external connection traces and minimizes parasitic inductance in high-frequency power stages.
Is this device qualified to AEC-Q101, and what documentation supports that claim?
While the DMC3032LFDB-13 is manufactured in IATF 16949-certified facilities and supports PPAP, the datasheet states AEC-Q101 qualification is available "for automotive applications requiring specific change control" upon request. No test report or certificate number is published in DS43676 Rev. 2–2; qualification status must be confirmed directly with Diodes Incorporated for project-specific compliance.
DMC3032LFDB-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel Complementary
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 5.3A (Ta), 3.4A (Ta)
- Rds On (Max) @ Id, Vgs:
- 30mOhm @ 5.8A, 10V, 70mOhm @ 3.8A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA, 2.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 10.6nC @ 10V, 7.8nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 500pF @ 15V, 336pF @ 25V
- Power - Max:
- 800mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type B)
DMC3032LFDB-13 FAQ
1.How can I place an order for DMC3032LFDB-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMC3032LFDB-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMC3032LFDB-13 reliable?
The price and inventory of DMC3032LFDB-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMC3032LFDB-13 is usually 5 days.
3.What payment methods are accepted for DMC3032LFDB-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMC3032LFDB-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMC3032LFDB-13?
DMC3032LFDB-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMC3032LFDB-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMC3032LFDB-13?
For technical support, including DMC3032LFDB-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMC3032LFDB-13 requirements.
6.How does Aetrix verify that DMC3032LFDB-13 is sourced from the original manufacturer or authorized distributors?
All DMC3032LFDB-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMC3032LFDB-13 meets industry standards.
7.What is the process for return or replacement of DMC3032LFDB-13?
All DMC3032LFDB-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMC3032LFDB-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMC3032LFDB-13 part is unused and in its original packaging.
Return procedure for DMC3032LFDB-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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