Diodes Incorporated DMC3032LSD-13

Overview

DMC3032LSD-13 from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in a single SO-8 package, integrating an N-channel (30V, 32mΩ @ 10V, 8.1A) and P-channel (−30V, 39mΩ @ −10V, −7A) device for bidirectional power control. It delivers low on-resistance, fast switching (t_D(OFF) = 13.9ns N-ch / 50.1ns P-ch), and AEC-Q101 qualification-enabling compact load switching in automotive body electronics and industrial power rails.

For engineers reviewing the DMC3032LSD-13 datasheet, DMC3032LSD-13 pinout, DMC3032LSD-13 application, or DMC3032LSD-13 equivalent, key selection criteria include dual-channel R_DS(ON) matching at 4.5V/−4.5V, thermal resistance (R_θJA = 50°C/W), gate charge asymmetry (Q_g = 9.2nC N-ch / 21.1nC P-ch), and SO-8 lead-free packaging compliance with J-STD-020 Level 1 moisture sensitivity.

Technical Context

This dual MOSFET implements independent N- and P-channel enhancement-mode transistors sharing a common SO-8 thermal pad structure, enabling synchronous half-bridge or complementary load-switch configurations without external isolation. Its gate threshold voltages are asymmetric (V_GS(TH) = +1.45V typ for Q1, −1.7V typ for Q2), requiring separate drive logic for optimal turn-on timing.

The device uses copper lead frame with matte tin annealing and green molding compound (UL 94V-0), supporting reflow soldering per MIL-STD-202 Method 208. Thermal performance is specified for FR-4 PCB mounting with minimum recommended pad layout, delivering 2.5W power dissipation at T_A = +25°C.

Key Specifications

Pinout & Package

Package: SO-8 (Surface-mount, 8-pin, 4.9mm × 6.0mm × 1.45mm height), molded green plastic (UL 94V-0), matte tin–annealed copper lead frame, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Compared with DMC2038LSD-7 and SI6926ADQ-T1-GE3, the DMC3032LSD-13 offers optimal balance of low R_DS(ON), moderate gate charge, and AEC-Q101 qualification-making it preferred for cost-sensitive automotive and industrial load switching where 30V rating suffices.

Availability

DMC3032LSD-13 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC outputs, USB-C power delivery systems, and medical portable device power path management requiring stable component supply across multi-year production cycles.

Supply support for DMC3032LSD-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the US.

The DMC series targets high-efficiency power management in space-constrained applications, emphasizing low R_DS(ON), AEC-Q101 reliability, and green packaging for automotive and industrial markets.

FAQ

What is the maximum continuous drain current for each channel at +85°C ambient?

The N-channel (Q1) supports 5.1A and the P-channel (Q2) supports −4.5A at T_A = +85°C with device mounted on FR-4 PCB using minimum recommended pad layout. Derating follows linear interpolation between +25°C and +85°C ratings, and junction temperature must remain ≤150°C under all operating conditions.

Can DMC3032LSD-13 be used in a synchronous buck converter topography?

No-it lacks integrated bootstrap diode and gate driver circuitry required for high-side N-MOSFET drive in buck converters. While the N-channel device can serve as low-side switch, the P-channel is unsuitable as high-side switch due to its higher R_DS(ON) and slower t_D(OFF); dedicated buck controllers with external drivers are required.

Is the thermal pad (pins 7–8) electrically isolated or internally connected?

The exposed thermal pad is internally connected to both D1 (N-ch drain) and D2 (P-ch drain). It must be soldered to a PCB copper pour tied to the system's high-side and low-side drain nodes-or left floating only if both drains are at identical potential. Floating the pad degrades thermal performance by >40%.

Does the device meet IPC/JEDEC J-STD-020 moisture sensitivity level requirements?

Yes-DMC3032LSD-13 is rated MSL Level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30°C/85% RH without baking prior to reflow. The SO-8 package uses green molding compound with controlled moisture diffusion characteristics verified through preconditioning tests.