Diodes Incorporated DMC3035LSD-13

Overview

DMC3035LSD-13 from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in a single SOP-8L package, integrating an N-channel (30 V, 6.9 A, 35 mΩ @ 10 V) and P-channel (−30 V, −5 A, 65 mΩ @ −10 V) device for half-bridge or H-bridge switching. It supports automotive-grade reliability (AEC-Q101 qualified), operates from −55 °C to +150 °C, and delivers low gate charge (Qg ≤ 8.6 nC) for efficient PWM control in DC-DC converters.

For engineers reviewing the DMC3035LSD-13 datasheet, DMC3035LSD-13 pinout, DMC3035LSD-13 application, or DMC3035LSD-13 equivalent, key selection criteria include verified R_DS(on) at 4.5 V (51 mΩ N-ch / 98 mΩ P-ch), thermal resistance (R_θJA = 62.5 °C/W), dual-channel timing alignment, and RoHS-compliant "Green" packaging with matte tin terminals.

Technical Context

This dual MOSFET integrates matched N- and P-channel silicon on a single die substrate within an SOP-8L thermally enhanced leadframe. Its complementary topology enables synchronous rectification and bidirectional current control without external level-shifting circuitry, leveraging matched V_GS(th) (±1.0–2.1 V) and tightly coupled thermal behavior (shared junction-to-ambient path).

The device uses planar trench-gate process technology to achieve low input capacitance (C_iss = 384 pF N-ch / 336 pF P-ch) and fast switching (Q_gd = 2.5 nC both channels), supporting >500 kHz operation in buck-boost and motor drive inverters while maintaining <1 μA off-state leakage under rated V_DS.

Key Specifications

Pinout & Package

Package: SOP-8L (Surface-Mount Small Outline Package, 8-lead, 5.0 × 6.0 mm body, 1.27 mm pitch, 1.75 mm max height). Molded green compound, UL 94V-0 rated, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Compared with DMC2035LSD-13 and SI6954DQ-T1-GE3, the DMC3035LSD-13 uniquely balances 30 V robustness, 4.5 V logic compatibility, and thermal coupling-making it optimal for space-constrained 12–24 V automotive and industrial half-bridges where efficiency and reliability must coexist.

Availability

DMC3035LSD-13 is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, and USB-C power delivery systems requiring stable component supply across multi-year production cycles.

Supply support for DMC3035LSD-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the US.

The DMC series targets high-reliability power management applications, specifically engineered for automotive and industrial environments where AEC-Q101 qualification, thermal stability, and compact dual-channel integration are critical.

FAQ

What is the maximum continuous drain current for each channel at 70 °C ambient?

The N-channel supports 5.8 A and the P-channel supports −4.2 A at T_A = 70 °C, as specified in the Absolute Maximum Ratings table. This derating accounts for thermal resistance (R_θJA = 62.5 °C/W) and 2 oz copper PCB layout. Operation beyond these values requires forced-air cooling or larger copper area to maintain T_j ≤ 150 °C.

Does the DMC3035LSD-13 integrate internal body diodes, and what are their forward voltage characteristics?

Yes-each channel includes a monolithic body diode. The N-channel diode has V_SD = 0.5–1.2 V at I_S = 1 A (V_GS = 0 V); the P-channel diode has V_SD = −0.5 to −1.2 V at I_S = −2.6 A. These diodes support freewheeling in inductive loads and are characterized for reverse recovery time (t_rr) in application notes AN-4001 and AN-4002.

Can the DMC3035LSD-13 be used in synchronous rectification for a 12 V to 5 V buck converter?

Yes-its 30 V V_DSS, low R_DS(on) at 5 V gate drive (61 mΩ N-ch / 115 mΩ P-ch), and matched switching parameters enable >92 % efficiency at 3 A output. Layout must minimize common-source inductance between S1 and S2, and gate drive must observe minimum dead time (≥50 ns) to prevent shoot-through per Figure 3 in DS31312.

Is the SOP-8L package thermally enhanced, and how should the exposed pad be handled?

The SOP-8L package uses a standard leadframe with no exposed thermal pad; thermal performance relies on soldering all eight leads to 2 oz copper pads per the recommended footprint (X = 0.60 mm, Y = 1.55 mm). The plastic body provides 62.5 °C/W R_θJA on a 2″ × 2″ FR4 board-no additional thermal vias or heatsinking is required for ≤2 W dissipation.