Diodes Incorporated DMC3732UVT-13

Overview

DMC3732UVT from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in a single TSOT26 package, integrating an N-channel (30V, 460mΩ @ 4.5V) and P-channel (–30V, 1000mΩ @ –4.5V) device for bidirectional power control. It delivers 1.1A/–0.7A continuous drain current at +25°C and supports DC-DC converters, backlighting, and dual-rail power management with low R_DS(ON), fast switching (t_F = 20ns), and 0.9nC/1.0nC gate charge.

For engineers reviewing the DMC3732UVT datasheet, DMC3732UVT pinout, DMC3732UVT application, or DMC3732UVT equivalent, this page provides verified electrical parameters, thermal performance data (R_θJA = 230°C/W on FR-4), TSOT26 terminal mapping, and real-world use cases in compact power stages where space-constrained complementary switching is required.

Technical Context

This dual MOSFET implements independent N- and P-channel enhancement-mode transistors sharing no internal connection-each channel operates with its own gate, source, and drain terminals. The N-channel exhibits V_GS(TH) = 0.45–0.95V and R_DS(ON) = 290–730mΩ across 1.8–4.5V drive; the P-channel has V_GS(TH) = –0.5 to –1.1V and R_DS(ON) = 0.72–2.0Ω across –1.8 to –4.5V drive.

Both devices feature low input capacitance (C_iss = 40.8pF / 54pF), minimal reverse transfer capacitance (C_rss = 4.6pF / 5.8pF), and operate over –55°C to +150°C junction temperature. Thermal resistance is specified for two PCB layouts: 230°C/W (minimum pad) and 150°C/W (1-inch² copper plate).

Key Specifications

Pinout & Package

Package: TSOT26 - ultra-thin surface-mount package (2.9mm × 1.6mm × 0.6mm), RoHS-compliant, matte tin-plated copper leadframe, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Compared with DMC3732UVT, DMC2038UVT-7 trades efficiency for cost in low-power roles, while DMN3026LSD-13 offers superior current handling at the expense of integration, board area, and gate-drive design effort-making DMC3732UVT optimal for space-constrained 1A-class dual-rail systems.

Availability

DMC3732UVT-13 is available at Aetrix Electronics and suitable for LED backlighting, USB-C power delivery switching, and compact DC-DC converter designs requiring stable component supply, consistent parametric performance, and long-term industrial lifecycle support.

Supply support for DMC3732UVT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs, with design centers in Asia, Europe, and the U.S., and manufacturing in China, Taiwan, and Thailand.

The DMC3732UVT belongs to Diodes' PowerMOS™ complementary pair portfolio, engineered specifically for high-density power management in portable and industrial equipment where footprint, thermal efficiency, and logic-level drive compatibility are critical.

FAQ

What is the maximum safe operating junction temperature for DMC3732UVT?

The absolute maximum junction temperature is +150°C, validated across all operating conditions per the datasheet's Safe Operating Area (SOA) curves. Continuous operation at this limit requires strict thermal design: 150°C/W R_θJA rating applies only with 1-inch² copper; standard FR-4 layouts must limit power dissipation to 0.54W to stay within 230°C/W thermal resistance and avoid exceeding TJ(max).

Can DMC3732UVT be used in automotive applications?

The standard DMC3732UVT is not AEC-Q101 qualified, but Diodes offers the pin-compatible DMC3732UVTQ variant, which undergoes full automotive qualification including temperature cycling, humidity testing, and HTOL. For non-safety-critical cabin modules (e.g., infotainment backlighting), the standard part may be used with customer-specific validation-but DMC3732UVTQ is mandatory for under-hood or ADAS-related deployments.

How does the TSOT26 package affect PCB layout for thermal performance?

TSOT26's small footprint (2.9mm × 1.6mm) demands optimized thermal vias: at least four 0.3mm-diameter vias under the exposed drain pads (pins 1 and 4), filled or capped, connecting to inner-layer ground or power planes. The datasheet specifies two R_θJA values-230°C/W assumes minimum recommended pad layout, while 150°C/W requires 1-inch² copper-so layout directly dictates achievable power handling.

Is there cross-conduction risk between the N- and P-channel devices?

No internal connection exists between the N- and P-channel dies-they share only the package substrate. Cross-conduction is solely governed by external gate drive timing. The low Q_gd (0.3nC/0.1nC) and fast t_F/t_R (20ns/15.9ns) enable tight dead-time control (<50ns) with standard gate drivers, preventing shoot-through in half-bridge configurations when properly sequenced.