Diodes Incorporated DMC62D2SV-7

Overview

DMC62D2SV-7 from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in SOT563 package, integrating one N-channel (60V, 1.7Ω @ 10V) and one P-channel (-60V, 4Ω @ -10V) device. It delivers low on-resistance, fast switching, and ultra-small footprint for dual-polarity power control in space-constrained DC-DC converters and load switches.

For engineers reviewing the DMC62D2SV-7 datasheet, DMC62D2SV-7 pinout, DMC62D2SV-7 application, or DMC62D2SV-7 equivalent, this dual-channel discrete MOSFET supports high-efficiency power management where compact size, low gate threshold voltage (1.0–2.5V for Q1, –1 to –3V for Q2), and matched thermal performance across channels are critical selection criteria.

Technical Context

This complementary pair operates with independent gate control: Q1 (N-ch) requires positive V_GS up to +20V, while Q2 (P-ch) accepts negative V_GS down to –20V. Both devices share identical SOT563 thermal resistance (R_θJA = 261°C/W on minimal pad, 158°C/W on recommended layout) and operate across –55°C to +150°C junction temperature range.

Dynamic performance is characterized by low input capacitance (C_iss ≈ 41pF/40pF), fast turn-on delay (6.9ns/4ns), and low total gate charge (1.04nC/1.1nC at rated V_GS). Body diode recovery is specified with t_RR = 19ns (Q1) and 26.6ns (Q2), enabling use in synchronous rectification and bidirectional current paths.

Key Specifications

Pinout & Package

Package: SOT563 - ultra-compact 6-pin surface-mount package (1.6 × 1.6 × 0.6 mm), lead-free, RoHS-compliant, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET switching applications.

Compared with DMC2038LVT-7 and DMC2048UV-7, the DMC62D2SV-7 offers optimal balance of low R_DS(ON), fast switching, and compact size for 24–48V portable and embedded power control-making it preferred where PCB area and dynamic losses are primary constraints.

Availability

DMC62D2SV-7 is available at Aetrix Electronics and suitable for USB-C power delivery, IoT sensor bias control, and industrial PLC I/O protection requiring stable component supply and long-term production continuity.

Supply support for DMC62D2SV-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and connectivity solutions for industrial, computing, and automotive markets.

The DMC62D2SV belongs to Diodes' "Ultra-Small Signal & Power MOSFET" product line, engineered specifically for space-constrained, high-efficiency DC-DC conversion and load switching in portable and embedded systems.

FAQ

What is the maximum continuous drain current for each channel at +70°C ambient?

At TA = +70°C, the N-channel (Q1) supports 380mA continuous drain current with VGS = 10V, while the P-channel (Q2) supports –250mA with VGS = –10V. These values reflect thermal derating per the datasheet's maximum ratings table and assume mounting on FR-4 with 2oz copper and minimum recommended pad layout.

Can DMC62D2SV-7 be used in automotive applications?

DMC62D2SV-7 is not AEC-Q101 qualified. While its –55°C to +150°C operating range meets automotive temperature requirements, Diodes explicitly states that automotive-grade versions require separate qualification, PPAP capability, and IATF 16949 manufacturing-none of which apply to this standard commercial-grade part.

What is the gate charge mismatch between Q1 and Q2, and how does it affect PWM symmetry?

Q1 total gate charge is 1.04nC at VGS = 10V; Q2 is 1.1nC at VGS = –10V-a 5.8% difference. This small mismatch has negligible impact on PWM symmetry in typical applications, as both devices exhibit nearly identical tR/tF (5.8ns/4ns and 14.3ns/13.8ns), ensuring consistent edge timing under matched gate drive conditions.

Is the SOT563 package thermally enhanced compared to standard SOT-23 or SC-70?

Yes-the SOT563 uses an exposed copper leadframe and optimized internal die attach to achieve RθJA = 158°C/W on recommended PCB layout (vs. ~200–250°C/W for standard SOT-23). Its 1.6mm × 1.6mm footprint also allows tighter thermal coupling to ground planes than larger packages, improving power dissipation in dense layouts.