Diodes Incorporated DMG1016VQ-7
- Part No.:
- DMG1016VQ-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-563, SOT-666
- Datasheet:
-
DMG1016VQ-7.pdf
- Description:
- MOSFET N/P-CH 20V 0.87A SOT563
- Quantity:
- Payment:

- Shipping:

Inventory:8,202
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMG1016VQ from Diodes Incorporated is a complementary pair enhancement-mode MOSFET in a single SOT563 package, integrating one N-channel (20V, 0.4Ω @ 4.5V) and one P-channel (−20V, 0.7Ω @ −4.5V) device with gate threshold voltage <1V for both channels. It delivers low on-resistance, fast switching (tD(ON) = 5.1 ns), and ESD-protected gates, enabling compact dual-polarity load switching in space-constrained DC-DC converters.
For engineers reviewing the DMG1016VQ datasheet, DMG1016VQ pinout, DMG1016VQ application, or DMG1016VQ equivalent, this part supports AEC-Q101-qualified automotive power management, battery-powered load control, and ultra-low-voltage logic-level drive circuits where gate threshold below 1V and matched complementary characteristics are critical selection criteria.
Technical Context
This dual MOSFET implements independent N- and P-channel enhancement-mode transistors sharing no internal connection-each channel operates with its own gate, drain, and source terminals. The N-channel exhibits VGS(TH) = 0.5–1.0 V and RDS(ON) = 0.4 Ω at VGS = 4.5 V, while the P-channel provides VGS(TH) = −0.5 to −1.0 V and RDS(ON) = 0.7 Ω at VGS = −4.5 V, enabling symmetrical low-voltage drive in half-bridge or level-shifting configurations.
Thermal performance is defined by RθJA = 235°C/W on FR-4 PCB, with maximum junction temperature of +150°C and power dissipation limited to 530 mW. Dynamic parameters include Ciss = 60.7 pF (N-ch) / 59.8 pF (P-ch), Qg = 737 pC / 622 pC, and diode forward voltage VSD = 0.7–1.2 V (N-ch) / −0.8 to −1.2 V (P-ch), supporting high-frequency switching up to several MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 20 V (N-ch) / −20 V (P-ch): Supports rail-to-rail operation across 0–20 V supply domains without breakdown. |
| RDS(ON) @ VGS = ±4.5 V | 0.4 Ω (N-ch) / 0.7 Ω (P-ch): Enables ≤100 mW conduction loss at 500 mA load current per channel. |
| VGS(TH) | 0.5–1.0 V (N-ch) / −0.5 to −1.0 V (P-ch): Allows direct interface with 1.8 V and 2.5 V logic outputs without level shifters. |
| Qg | 737 pC (N-ch) / 622 pC (P-ch): Determines gate drive energy requirement for 1 MHz switching at <10 mA average gate current. |
| tD(ON) | 5.1 ns (both channels): Limits minimum pulse width to ~20 ns, suitable for >20 MHz PWM in Class-D amplifiers or buck controllers. |
| PD | 530 mW: Sets maximum continuous power handling on standard FR-4 PCB, requiring thermal relief for >300 mA sustained loads. |
| Ciss | 60.7 pF (N-ch) / 59.8 pF (P-ch): Defines input capacitance seen by driver IC, impacting rise/fall time and gate drive impedance selection. |
Pinout & Package
Package: SOT563 - ultra-small surface-mount 6-terminal plastic package (1.60 × 1.60 × 0.60 mm), moisture sensitivity level 1, matte tin annealed finish, RoHS-compliant and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S1 | N-channel source | Reference node for N-MOSFET; tied to ground or low-side return path in high-side switch configuration. |
| G1 | N-channel gate | Control input for N-MOSFET; requires ≥1.0 V above S1 to fully enhance; ESD-protected (±1 µA leakage). |
| D1 | N-channel drain | Output node for N-MOSFET; connects to load or power rail; handles up to +20 V and 870 mA peak current. |
| D2 | P-channel drain | Output node for P-MOSFET; connects to load or power rail; handles up to −20 V and −640 mA peak current. |
| G2 | P-channel gate | Control input for P-MOSFET; requires ≤−1.0 V below S2 to fully enhance; ESD-protected (±2 µA leakage). |
| S2 | P-channel source | Reference node for P-MOSFET; typically tied to VCC or high-side supply; defines negative gate drive reference. |
Key Features
| Feature | Design Value |
|---|---|
| Complementary Pair Integration | Single SOT563 package contains matched N- and P-channel MOSFETs with symmetric VGS(TH) magnitude (<1 V), enabling compact H-bridge or push-pull drivers without discrete pairing. |
| Low Threshold Voltage | VGS(TH) ≤1.0 V (N-ch) and ≥−1.0 V (P-ch) allows direct drive from 1.8 V microcontrollers and low-power logic families without external level shifters. |
| Ultra-Small Footprint | SOT563 (1.6 × 1.6 mm) reduces board area by >50% versus discrete SOT23-6 solutions, critical for wearables and hearing aids. |
| ESD-Protected Gate | Integrated gate protection sustains ±2 kV HBM per JESD22-A114, eliminating need for external TVS diodes in handheld product designs. |
| AEC-Q101 Qualified | Validated for automotive applications including body electronics and infotainment power rails, with PPAP documentation and IATF 16949 manufacturing control. |
Applications
| Automotive Body Control Module (BCM) | USB-C Power Delivery Load Switch |
|---|---|
Use Scenario: Controlling door lock actuators and interior lighting via 12 V battery-supplied microcontroller outputs. IC Role / Device Role / Timing Role: Dual-channel load switch providing high-side (P-ch) and low-side (N-ch) drive for bidirectional actuator control and LED dimming. Use Value: Eliminates need for two separate MOSFETs and associated gate resistors, reducing BOM count by 3 components and PCB area by 2.5 mm² per switch node. |
Use Scenario: Enabling/disabling VBUS (5–20 V) to USB-C peripheral ports under firmware control in portable docking stations. IC Role / Device Role / Timing Role: Complementary pair configured as ideal diode controller and reverse-current blocking switch for hot-plug safe power routing. Use Value: Achieves <100 ns turn-off response to prevent backfeed during cable disconnect, meeting USB PD 3.1 fault recovery timing requirements. |
| Medical Wearable Sensor Node | Industrial IoT Edge Controller |
Use Scenario: Power gating of BLE radio, accelerometer, and optical heart-rate sensor to extend coin-cell battery life beyond 12 months. IC Role / Device Role / Timing Role: Low-leakage (IDSS ≤100 nA) dual switch isolating subsystems during deep-sleep mode while maintaining logic-level compatibility with 1.8 V MCU GPIOs. Use Value: Reduces quiescent current to <200 nA per switched domain, cutting system sleep current by 85% versus discrete MOSFET solutions. |
Use Scenario: Isolating 24 V fieldbus I/O modules from main controller during firmware updates or fault conditions. IC Role / Device Role / Timing Role: High-reliability power switch with AEC-Q101 qualification and 150°C max TJ, used in redundant power-path management for PLC analog inputs. Use Value: Ensures uninterrupted operation during hot-swap events with <5 µs overcurrent shutdown latency, meeting IEC 61000-4-5 surge immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG1012UW-7 | Same SOT563 package but N/P pair rated at 30 V/−30 V; RDS(ON) = 0.65 Ω / 1.0 Ω @ ±4.5 V; higher VDSS, higher RDS(ON). | Preferred for 24 V industrial systems where 20 V margin is insufficient; less suitable for 1.8 V logic drive due to higher VGS(TH) (0.7–1.3 V). | Select when operating voltage exceeds 20 V or when higher avalanche robustness is required; avoid if gate drive is limited to ≤2.5 V. |
| Si1027DL-T1-GE3 | 6-pin SOT563 complementary pair from Vishay; 20 V/−20 V rating; RDS(ON) = 0.55 Ω / 0.95 Ω @ ±4.5 V; no AEC-Q101 qualification. | Cost-optimized alternative for consumer-grade applications; lacks automotive qualification and tighter VGS(TH) distribution. | Acceptable for non-automotive, non-safety-critical designs where qualification documentation is not required and 15% higher RDS(ON) is tolerable. |
Compared with DMG1016VQ, DMG1012UW-7 trades lower on-resistance for higher voltage capability and relaxed logic-level drive, while Si1027DL-T1-GE3 offers cost advantage at the expense of automotive qualification and threshold voltage tightness-making DMG1016VQ optimal for space-constrained, 1.8 V–4.5 V driven, AEC-Q101–mandated applications.
Availability
DMG1016VQ is available at Aetrix Electronics and suitable for automotive body electronics, USB-C power delivery systems, medical wearable power management, and industrial IoT edge controllers requiring stable component supply across multi-year production cycles.
Supply support for DMG1016VQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal devices, with design, manufacturing, and test facilities certified to IATF 16949 and ISO 9001 standards.
The DMG1016VQ belongs to Diodes' high-density power management MOSFET family, engineered specifically for space-constrained, low-voltage, automotive-qualified load switching applications where gate drive simplicity and thermal efficiency are critical.
FAQ
Is DMG1016VQ qualified for automotive use?
Yes, DMG1016VQ is AEC-Q101 qualified and manufactured in IATF 16949 certified facilities. It supports PPAP documentation and is approved for automotive body electronics, infotainment power rails, and ADAS auxiliary supplies. Its −55°C to +150°C operating range and 150°C max junction temperature meet stringent automotive thermal requirements.
What is the maximum continuous drain current for each channel?
The N-channel supports 870 mA at TA = +25°C and derates to 630 mA at +85°C; the P-channel supports −640 mA at +25°C and derates to −460 mA at +85°C. These values assume mounting on FR-4 PCB with standard copper pour; actual current must be limited by power dissipation (PD = 530 mW) and thermal resistance (RθJA = 235°C/W).
Can DMG1016VQ be used with 1.8 V logic-level microcontrollers?
Yes. With VGS(TH) as low as 0.5 V (N-ch) and −0.5 V (P-ch), and guaranteed RDS(ON) at VGS = 1.8 V (0.7 Ω N-ch / 1.3 Ω P-ch), DMG1016VQ interfaces directly with 1.8 V GPIOs without level shifting. Gate drive current remains below 1 mA at 1.8 V, compatible with most low-power MCUs.
Does DMG1016VQ include integrated ESD protection?
Yes. Both gate terminals feature integrated ESD protection rated to ±2 kV HBM (per JESD22-A114). Gate leakage is specified at ±1.0 µA (N-ch) and ±2.0 µA (P-ch) at ±4.5 V, confirming robust oxide integrity without requiring external gate protection diodes in typical handheld or automotive environments.
DMG1016VQ-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- SOT-563, SOT-666
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 20V
- Current - Continuous Drain (Id) @ 25°C:
- 870mA, 640mA
- Rds On (Max) @ Id, Vgs:
- 400mOhm @ 600mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.74nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 60.67pF @ 16V
- Power - Max:
- 530mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-563
DMG1016VQ-7 FAQ
1.How can I place an order for DMG1016VQ-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMG1016VQ-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMG1016VQ-7 reliable?
The price and inventory of DMG1016VQ-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMG1016VQ-7 is usually 5 days.
3.What payment methods are accepted for DMG1016VQ-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMG1016VQ-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMG1016VQ-7?
DMG1016VQ-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMG1016VQ-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMG1016VQ-7?
For technical support, including DMG1016VQ-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMG1016VQ-7 requirements.
6.How does Aetrix verify that DMG1016VQ-7 is sourced from the original manufacturer or authorized distributors?
All DMG1016VQ-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMG1016VQ-7 meets industry standards.
7.What is the process for return or replacement of DMG1016VQ-7?
All DMG1016VQ-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMG1016VQ-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMG1016VQ-7 part is unused and in its original packaging.
Return procedure for DMG1016VQ-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMG1016VQ-7 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
