Diodes Incorporated DMG7702SFG-13
- Part No.:
- DMG7702SFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMG7702SFG-13.pdf
- Description:
- MOSFET N-CH 30V 12A POWERDI3333
- Quantity:
- Payment:

- Shipping:

Inventory:5,721
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMG7702SFG-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET monolithically integrated with a Schottky diode in a PowerDI3333-8 package, delivering 7.3 mΩ RDS(on) at VGS = 10V, 13.5A drain current, and 0.45V forward diode voltage. It serves as a high-efficiency synchronous rectifier or power switch in DC-DC converters.
For engineers reviewing the DMG7702SFG-13 datasheet, DMG7702SFG-13 pinout, DMG7702SFG-13 application, or DMG7702SFG-13 equivalent, key selection criteria include its integrated Schottky's low Qrr (4.3 nC), low VSD, gate charge profile (Qg = 31.6 nC @ 10V), thermal resistance (RθJA = 58 °C/W with 1-inch copper), and AEC-Q101 qualification for automotive-grade reliability.
Technical Context
This DIOFET combines a trench-gate MOSFET and Schottky diode on a single die to eliminate body diode conduction losses and reduce reverse recovery energy. Its low Qgd/Qg ratio (5.0/31.6 ≈ 16%) minimizes risk of shoot-through during high-frequency switching.
The device operates across –55°C to +150°C junction temperature, supports ±20V gate drive, and achieves 10mΩ RDS(on) at 10V while maintaining 15mΩ at 4.5V - enabling robust operation in 3.3V and 5V control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source blocking voltage compatible with 24V rail and 12V automotive systems. |
| RDS(on) | 7.3 mΩ @ VGS = 10V, ID = 13.5A - Enables <1W conduction loss at 12A continuous current. |
| VSD | 0.45 V @ IS = 1A - Integrated Schottky reduces forward drop by ~0.25V vs. standard body diode, cutting diode conduction loss. |
| Qrr | 4.3 nC - Low reverse recovery charge minimizes switching loss and EMI in hard-switched topologies. |
| RθJA | 58 °C/W (with 1″² copper) - Enables 2.2W steady-state dissipation at +70°C ambient without forced cooling. |
| ID (max) | 16.0 A (pulsed, t<10s) - Supports peak load handling in transient conditions like motor startup or inrush limiting. |
| AEC-Q101 | Qualified - Validated for automotive applications including infotainment power supplies and LED driver modules. |
Pinout & Package
Package: PowerDI3333-8 - thermally enhanced 8-pin surface-mount package with exposed drain pad; footprint occupies only 33% of SO-8 area and delivers 11 °C/W junction-to-case thermal resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source | Common source terminals tied internally; low-inductance parallel connection improves current sharing and thermal spreading. |
| 5, 6, 7, 8 | Drain | Exposed drain pad + four top-side drain pins - optimized for high-current paths and PCB heat sinking via thermal pad. |
| Pin 1 (marked) | Gate | Single gate input; low gate resistance (Rg = 1.6 Ω typical) enables fast turn-on with minimal external gate resistor. |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic DIOFET integration | Eliminates discrete Schottky placement error and parasitic inductance, ensuring precise timing alignment between MOSFET and diode switching. |
| Low Qgd/Qg ratio | 15.8% (5.0/31.6 nC) - reduces Miller plateau duration and improves immunity to dv/dt-induced false turn-on in high-side configurations. |
| Thermally efficient layout | 0.072 g mass and 58 °C/W RθJA enable compact, fanless designs in space-constrained backlighting and portable power modules. |
| AEC-Q101 qualification | Validated for automotive temperature cycling, HTRB, and UHAST - suitable for under-hood and cabin electronics without derating. |
Applications
| Automotive LED Headlamp Driver | USB-C PD Synchronous Rectifier |
|---|---|
|
Use Scenario: High-side switch in constant-current LED driver for adaptive front lighting systems (AFS). IC Role / Device Role / Timing Role: Power switch controlling PWM-modulated current through 3–5 series LEDs at up to 3A per channel. Use Value: Integrated Schottky eliminates external freewheeling diode, reducing BOM count and board area while lowering VSD-related losses by 40% vs. discrete solutions. |
Use Scenario: Secondary-side synchronous rectifier in 20–60W USB-C Power Delivery adapters. IC Role / Device Role / Timing Role: Low-side rectifier replacing Schottky diode in LLC or flyback topology, driven by controller IC with 100ns dead-time margin. Use Value: 7.3 mΩ RDS(on) and 4.3 nC Qrr enable >95% efficiency at 20V/3A output while meeting CoC Tier 2 no-load power requirements. |
| Industrial DC-DC Buck Converter | Laptop Display Backlight Inverter |
|
Use Scenario: High-current (10A) buck converter supplying core voltage to FPGA or SoC in programmable logic controllers. IC Role / Device Role / Timing Role: Bottom-side switch operating at 500 kHz with 4.5V gate drive from integrated controller. Use Value: 15 mΩ RDS(on) @ 4.5V ensures stable regulation under 3.3V logic-level drive, avoiding gate boost circuitry and reducing component count. |
Use Scenario: PWM-controlled current sink for edge-lit LCD backlight using 12–24 white LEDs in series. IC Role / Device Role / Timing Role: Synchronous rectifier in boost-derived current-regulated stage, switching at 100–300 kHz. Use Value: Low VSD (0.45V) and fast trr (13.1 ns) minimize audible noise and ripple in dimmed operation, supporting 10,000:1 PWM contrast ratio. |
Availability
DMG7702SFG-13 is available at Aetrix Electronics and suitable for automotive LED drivers, USB-C PD adapters, industrial DC-DC converters, and laptop display backlight inverters requiring stable component supply and long-term lifecycle support.
Supply support for DMG7702SFG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection devices for automotive, industrial, and consumer markets.
The DMG7702SFG belongs to Diodes' DIOFET product line - engineered specifically to replace discrete MOSFET + Schottky combinations in high-frequency, high-efficiency power conversion where low Qrr, tight VSD tolerance, and AEC-Q101 compliance are mandatory.
FAQ
Is DMG7702SFG-13 recommended for new designs?
No - Diodes Incorporated explicitly marks DMG7702SFG as "NOT RECOMMENDED FOR NEW DESIGN" in its official datasheet (Rev. 7-3, August 2018). This designation indicates the part is in mature phase with no roadmap for future revisions or long-term availability guarantees. Existing designs may continue using it, but new projects should select qualified alternatives.
What is the thermal pad connection requirement for PowerDI3333-8?
The exposed drain pad (pins 5–8) must be soldered to a minimum 1-inch² copper pour on the PCB for rated 2.2W power dissipation. The datasheet specifies this layout uses 2 oz copper and defines RθJA = 58 °C/W under those conditions. Omitting the thermal pad increases RθJA to 145 °C/W, limiting usable power to 0.89W.
Does DMG7702SFG-13 integrate a Schottky diode in antiparallel or series configuration?
The integrated Schottky diode is connected in antiparallel (source-to-drain) with the MOSFET channel, functioning as a low-loss freewheeling path during discontinuous conduction mode. This configuration replaces the intrinsic body diode, delivering VSD = 0.45V instead of ~1.2V, confirmed by Figure 11 and the "DIOFET" process description in the datasheet.
Can DMG7702SFG-13 operate reliably at 150°C junction temperature?
Yes - the device is rated for TJ = –55°C to +150°C and tested per AEC-Q101. Figure 8 shows normalized RDS(on) remains ≤1.6× nominal at 150°C, and Figure 10 confirms VGS(th) stays within 1.0–2.5V across that range. Derating is required: at TA = +70°C, maximum continuous ID drops to 9.5A (VGS = 10V) to maintain TJ ≤ 150°C.
DMG7702SFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 10mOhm @ 13.5A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14.7 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4310 pF @ 15 V
- FET Feature:
- Schottky Diode (Body)
- Power Dissipation (Max):
- 890mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMG7702SFG-13 FAQ
1.How can I place an order for DMG7702SFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMG7702SFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMG7702SFG-13 reliable?
The price and inventory of DMG7702SFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMG7702SFG-13 is usually 5 days.
3.What payment methods are accepted for DMG7702SFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMG7702SFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMG7702SFG-13?
DMG7702SFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMG7702SFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMG7702SFG-13?
For technical support, including DMG7702SFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMG7702SFG-13 requirements.
6.How does Aetrix verify that DMG7702SFG-13 is sourced from the original manufacturer or authorized distributors?
All DMG7702SFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMG7702SFG-13 meets industry standards.
7.What is the process for return or replacement of DMG7702SFG-13?
All DMG7702SFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMG7702SFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMG7702SFG-13 part is unused and in its original packaging.
Return procedure for DMG7702SFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMG7702SFG-13 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
