Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Diodes Incorporated DMN1003UFDE-7

Part No.:
DMN1003UFDE-7
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
6-PowerUDFN
Datasheet:
AetrixDMN1003UFDE-7.pdf
Description:
MOSFET BVDSS: 8V~24V U-DFN2020-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,607

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

DMN1003UFDE-7 from Diodes Incorporated is a 12V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type E) package, optimized for high-efficiency power management with 3 mΩ RDS(ON) at VGS = 4.5V, 22 A continuous drain current at TA = +25°C, and ESD-protected gate. It serves as a low-voltage load switch in portable power rails and battery protection circuits.

For engineers reviewing the DMN1003UFDE-7 datasheet, DMN1003UFDE-7 pinout, DMN1003UFDE-7 application, or DMN1003UFDE-7 equivalent, key selection criteria include gate threshold voltage (0.3–1.0 V), thermal resistance (RθJA = 54 °C/W on 2 oz copper), body diode forward voltage (0.6–1.2 V), and avalanche energy rating (163 mJ).

Technical Context

This MOSFET employs a trench-gate silicon process to achieve ultra-low on-resistance while maintaining fast switching performance: tD(ON) = 6.6 ns, tF = 22.0 ns, and Qg = 27 nC at VGS = 4.5V. Its low VGS(TH) enables direct drive from 1.8 V and 3.3 V logic controllers without level-shifting.

The device integrates an intrinsic body diode with reverse recovery time tRR = 24.3 ns and QRR = 7.4 nC, supporting synchronous rectification and bidirectional current handling in compact DC-DC converters and USB PD power paths.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 12 V - Maximum drain-source blocking voltage for 12 V input rail applications
RDS(ON) 3 mΩ @ VGS = 4.5V - Enables ≤75 mW conduction loss at 15 A, critical for thermally constrained PCBs
ID (TA = +25°C) 22 A - Continuous current capability with FR-4 board and 2 oz copper thermal bias
VGS(TH) 0.3–1.0 V - Ensures reliable turn-on with standard I/O voltages (1.8 V/3.3 V) without gate driver
EAS 163 mJ - Avalanche energy rating supports robust operation under inductive load switching stress
Ciss 2551 pF - Input capacitance determines gate drive strength requirement for <10 ns switching transitions
RθJA 54 °C/W - Thermal resistance measured on optimized 2 oz copper layout, enabling 2.2 W power dissipation

Pinout & Package

Package: U-DFN2020-6 (Type E), 2.0 mm × 2.0 mm × 0.6 mm, exposed drain pad for thermal conduction. Molded green compound, RoHS-compliant matte tin finish on copper leadframe.

Pin/Terminal Circuit Role Design Meaning
1 (S) Source Reference node for gate control; connects to ground or low-side return path
2 (G) Gate Control terminal; ESD-protected; requires ≤±8 V drive relative to source
3 (D) Drain High-current output node; tied to exposed pad for thermal and electrical connection
4 (S) Source Second source connection; paralleled with Pin 1 to reduce source inductance
5 (D) Drain Second drain connection; bonded to exposed pad for low-inductance high-current path
6 (G) Gate Second gate connection; reduces gate loop inductance for high-speed switching

Key Features

Feature Design Value
Low RDS(ON) at low VGS 4 mΩ @ VGS = 2.5V - Supports efficient operation from single-cell Li-ion (2.5–4.2 V) systems
ESD-protected gate HBM rating ≥2 kV - Eliminates need for external gate protection in handheld and wearables
Ultra-thin profile 0.6 mm max height - Enables use in space-constrained modules such as USB-C power delivery adapters
Halogen- and antimony-free <900 ppm Br, <900 ppm Cl, <1000 ppm Sb - Meets IPC-1752A "Green" compliance for automotive and medical OEMs
Moisture sensitivity level MSL Level 1 per J-STD-020 - No bake required before reflow, simplifying SMT assembly

Applications

USB-C Power Delivery Switch Battery Protection Circuit

Use Scenario: Bidirectional 5–20 V power path control between USB-C port and system battery in portable devices.

IC Role / Device Role / Timing Role: Low-side load switch managing charge/discharge direction and overcurrent isolation.

Use Value: 3 mΩ RDS(ON) limits voltage drop to <30 mV at 10 A, preserving bus voltage regulation during 100 W operation.

Use Scenario: Overcurrent and short-circuit protection in single-cell Li-ion battery packs for power tools and medical instruments.

IC Role / Device Role / Timing Role: Primary discharge FET controlled by battery management IC to interrupt fault currents within microseconds.

Use Value: 85 A pulsed drain rating and 163 mJ avalanche energy enable safe interruption of >50 A short-circuit events without device failure.

Point-of-Load DC-DC Converter Automotive Body Control Module

Use Scenario: High-frequency synchronous rectifier in 12 V → 3.3 V buck converter for FPGA or SoC core rails.

IC Role / Device Role / Timing Role: Low-VGS N-channel MOSFET replacing Schottky diode in secondary-side rectification.

Use Value: 24.3 ns reverse recovery time and 7.4 nC QRR minimize switching losses and EMI compared to discrete diodes.

Use Scenario: 12 V load switching for LED lighting, window lift motors, and HVAC actuators in passenger vehicles.

IC Role / Device Role / Timing Role: General-purpose N-channel switch driven directly by microcontroller GPIO pins.

Use Value: 0.3–1.0 V gate threshold ensures full enhancement at 3.3 V MCU outputs, eliminating need for external level shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power-switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN10H320SFD-7 RDS(ON) = 3.2 mΩ @ VGS = 4.5V; higher VDSS = 100 V; larger U-DFN2020-6 footprint Designed for 48 V industrial PoE and higher-voltage battery systems Select when higher breakdown voltage and legacy footprint compatibility are required over lowest RDS(ON)
AO3400A RDS(ON) = 42 mΩ @ VGS = 4.5V; SOT-23 package; no ESD protection Cost-sensitive consumer electronics with relaxed efficiency and reliability requirements Choose only for non-critical 12 V loads where thermal margin exceeds 5× and ESD immunity is not mandated

Compared with DMN1003UFDE-7, DMN10H320SFD-7 trades lower RDS(ON) for higher voltage rating and larger die size, while AO3400A sacrifices 14× higher on-resistance and lacks ESD hardening-making DMN1003UFDE-7 optimal for space-constrained, high-efficiency 12 V power switches requiring robustness.

Availability

DMN1003UFDE-7 is available at Aetrix Electronics and suitable for USB-C power delivery systems, battery protection modules, point-of-load converters, and automotive body control units requiring stable component supply and long-term production continuity.

Supply support for DMN1003UFDE-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

This MOSFET belongs to Diodes' Ultra-Low RDS(ON) U-DFN PowerMOS family, engineered specifically for high-current, low-voltage switching in portable, automotive, and industrial power systems where thermal density and gate-drive simplicity are critical.

FAQ

What is the maximum allowable gate-source voltage for DMN1003UFDE-7?

The absolute maximum gate-source voltage is ±8 V. Exceeding this rating risks permanent gate oxide damage. The device features ESD protection rated to ≥2 kV HBM, but sustained overvoltage beyond ±8 V-even briefly-can cause irreversible gate leakage or threshold shift. Always limit gate drive with clamping diodes or resistor-divider networks when using higher-voltage drivers.

Can DMN1003UFDE-7 be used in parallel configurations?

Yes, it supports paralleling due to its positive temperature coefficient of RDS(ON), which promotes current sharing across multiple devices. However, ensure matched gate drive routing (equal trace length and impedance) and symmetrical PCB thermal layout. Derate total current by 15% versus sum of individual ID ratings to account for layout-induced imbalances.

Does DMN1003UFDE-7 meet AEC-Q101 qualification?

No-DMN1003UFDE-7 is not AEC-Q101 qualified. While manufactured in IATF 16949-certified facilities, it lacks the extended temperature cycling, humidity testing, and failure analysis required for automotive-grade qualification. For AEC-Q101 applications, Diodes offers the pin-compatible DMN10H320SFD-7Q, which is fully qualified to AEC-Q101 Grade 1.

What is the recommended PCB pad layout for thermal performance?

Use the manufacturer-recommended U-DFN2020-6 (Type E) pad layout with a solid 5 mm × 5 mm exposed drain pad connected to ≥2 internal ground planes via ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch). Maintain solder mask defined pads and avoid solder paste slumping to ensure uniform solder joint thickness and minimal thermal resistance to ambient.

DMN1003UFDE-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-PowerUDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
12 V
Current - Continuous Drain (Id) @ 25°C:
22A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Rds On (Max) @ Id, Vgs:
3mOhm @ 15A, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
45 nC @ 8 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
2551 pF @ 6 V
FET Feature:
-
Power Dissipation (Max):
800mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type E)

DMN1003UFDE-7 FAQ

1.How can I place an order for DMN1003UFDE-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN1003UFDE-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN1003UFDE-7 reliable?

The price and inventory of DMN1003UFDE-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN1003UFDE-7 is usually 5 days.

3.What payment methods are accepted for DMN1003UFDE-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN1003UFDE-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN1003UFDE-7?

DMN1003UFDE-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN1003UFDE-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN1003UFDE-7?

For technical support, including DMN1003UFDE-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN1003UFDE-7 requirements.

6.How does Aetrix verify that DMN1003UFDE-7 is sourced from the original manufacturer or authorized distributors?

All DMN1003UFDE-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN1003UFDE-7 meets industry standards.

7.What is the process for return or replacement of DMN1003UFDE-7?

All DMN1003UFDE-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN1003UFDE-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN1003UFDE-7 part is unused and in its original packaging.

Return procedure for DMN1003UFDE-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN1003UFDE-7 Tags

  • DMN1003UFDE-7
  • DMN1003UFDE-7 PDF
  • DMN1003UFDE-7 Datasheet
  • DMN1003UFDE-7 Specifications
  • DMN1003UFDE-7 Images
  • Diodes Incorporated
  • Diodes Incorporated DMN1003UFDE-7
  • Buy DMN1003UFDE-7
  • DMN1003UFDE-7 Price
  • DMN1003UFDE-7 Distributor
  • DMN1003UFDE-7 Supplier
  • DMN1003UFDE-7 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER