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Diodes Incorporated DMN1014UFDF-7

Part No.:
DMN1014UFDF-7
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixDMN1014UFDF-7.pdf
Description:
MOSFET N-CH 12V 8A 6UDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,348

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Product details

Overview

DMN1014UFDF-7 from Diodes Incorporated is a 12V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, optimized for low RDS(ON) (12 mΩ typ @ VGS = 4.5V), fast switching (tF = 4.4 ns), and low gate threshold (VGS(TH) = 0.3–1.0 V), enabling high-efficiency power management in space-constrained battery-powered systems.

For engineers reviewing the DMN1014UFDF-7 datasheet, DMN1014UFDF-7 pinout, DMN1014UFDF-7 application, or DMN1014UFDF-7 equivalent, this device is selected for compact DC-DC converter topologies requiring sub-1V gate drive compatibility, thermal performance under 76°C/W RθJA (with copper pad), and AEC-Q200-readiness via IATF 16949 manufacturing.

Technical Context

This MOSFET employs a trench-gate silicon process to achieve low on-resistance while maintaining robust switching characteristics: Qg = 6.4 nC at VGS = 4.5V and Ciss = 515 pF at VDS = 6V support efficient gate driving in synchronous buck stages. Its 0.6 mm profile and 4 mm² footprint are engineered for ultra-thin portable electronics.

The device integrates a body diode with VSD = 0.72 V (typ) at IS = 2A and tRR = 9.5 ns, enabling reliable freewheeling in high-frequency converters. Thermal design is supported by RθJC = 15.5°C/W and operation across –55°C to +150°C junction temperature range.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 12 V - Maximum drain-source blocking voltage for 3.3V/5V logic-level systems.
RDS(ON) 12 mΩ (typ) @ VGS = 4.5V - Enables ≤100 mW conduction loss at 2.9 A continuous current.
ID (max) 8.0 A @ TA = +25°C - Supports high-current load switches in battery protection circuits.
Qg 6.4 nC - Low gate charge reduces driver power and enables >1 MHz switching in point-of-load regulators.
tF 4.4 ns - Fast fall time minimizes switching transition losses in synchronous rectification.
RθJA 76°C/W - Achieved with 1-inch² copper pad; allows 1.0 W dissipation at TA = +70°C.
VGS(TH) 0.3–1.0 V - Ensures turn-on with single-cell Li-ion (2.5–4.2 V) or 3.3V MCU GPIOs.

Pinout & Package

Package: U-DFN2020-6 (Type F), 2.0 × 2.0 × 0.6 mm, bottom-exposed thermal pad, NiPdAu-plated terminals, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal; accepts 0.3–1.0 V threshold; requires <6.4 nC charge for full enhancement.
2 (S) Source Reference node for gate drive; connects to power ground or low-side switch return path.
3 (D) Drain High-side output node; rated for 12 V blocking and 40 A pulsed current (380 µs).
4 (S) Source (redundant) Second source terminal; paralleled internally to reduce package inductance and improve current sharing.
5 (D) Drain (redundant) Second drain terminal; lowers RDS(ON) contribution from bond wire resistance.
6 (EP) Exposed Pad Thermal and electrical connection to PCB ground plane; mandatory for achieving RθJA = 76°C/W.

Key Features

Feature Design Value
Ultra-low profile (0.6 mm height) Enables integration into <1.0 mm Z-height modules such as wearable battery packs and hearing aids.
4 mm² PCB footprint Reduces board area by >50% vs. SO-8 or TSOP-6 packages, critical for multi-MOSFET PMIC layouts.
Low VGS(TH) with tight distribution Ensures consistent turn-on across temperature (±0.1 V variation from –55°C to +150°C) without external bias.
Fast switching with low Qgd/Qgs ratio Qgd = 1.9 nC / Qgs = 0.3 nC supports clean Miller plateau control in hard-switched converters.
Halogen- and antimony-free "Green" construction Meets IPC-1752A Class 3 reporting requirements and automotive OEM material declarations (e.g., GM GPDS, Ford WERS).

Applications

Battery Protection Circuit USB-C Power Delivery Switch

Use Scenario: Bidirectional overvoltage/overcurrent protection in single-cell Li-ion battery packs for IoT sensors.

IC Role / Device Role / Timing Role: Low-side N-channel switch controlling charge/discharge path with integrated reverse-blocking capability.

Use Value: 12 mΩ RDS(ON) limits voltage drop to <30 mV at 2.5 A, preserving battery runtime and enabling accurate coulomb counting.

Use Scenario: 5–20 V input path selection in USB-C PD sink applications with dual-role port negotiation.

IC Role / Device Role / Timing Role: High-speed power switch enabling <10 µs fault response during VBUS short-circuit events.

Use Value: 4.4 ns fall time and 40 A pulsed rating allow immediate current shutoff before eFuse trip thresholds are exceeded.

Compact DC-DC Synchronous Buck Converter Low-Power Load Switch for Wearables

Use Scenario: 1.8 V output stage in PMIC for Bluetooth LE SoCs operating from 3.6 V nominal battery supply.

IC Role / Device Role / Timing Role: High-side synchronous rectifier driven by integrated controller with 4.5 V gate bias.

Use Value: 6.4 nC Qg and 515 pF Ciss enable >2 MHz operation with <15% gate drive loss at 1 A load.

Use Scenario: Always-on rail isolation in smart earbuds, disconnecting charging IC when main battery is depleted.

IC Role / Device Role / Timing Role: Logic-level controlled load switch activated by 3.3 V microcontroller GPIO.

Use Value: 0.3 V minimum VGS(TH) guarantees turn-on even at end-of-discharge (2.8 V battery), preventing brownout lockup.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2004LK3-7 RDS(ON) = 20 mΩ @ VGS = 2.5V; larger U-DFN2020-6 (Type K) package; higher Qg = 9.5 nC Higher conduction loss at light loads; less suitable for <3.3 V gate drive Select when higher avalanche energy (EAS = 12 mJ) is required for inductive load snubbing.
AO3414 RDS(ON) = 21 mΩ @ VGS = 2.5V; SOT-23 package; RθJA = 200°C/W (no thermal pad) Lower power density; unsuitable for >500 mW continuous dissipation Select only for prototyping or ultra-low-cost consumer devices where thermal derating is acceptable.

Compared with DMN2004LK3-7 and AO3414, DMN1014UFDF-7 delivers superior power density (12 mΩ in 0.6 mm height), lower gate drive demand (6.4 nC), and verified thermal performance (76°C/W with copper pad), making it optimal for production-grade space- and efficiency-constrained designs.

Availability

DMN1014UFDF-7 is available at Aetrix Electronics and suitable for battery management systems, USB-C power delivery modules, and compact DC-DC converters requiring stable component supply, long-term lifecycle assurance, and traceable green-material compliance.

Supply support for DMN1014UFDF-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in IATF 16949-certified facilities.

This device belongs to Diodes' Ultra-Low RDS(ON) Logic-Level MOSFET product line, designed specifically for high-efficiency, space-constrained power conversion in portable and battery-powered electronics.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The DMN1014UFDF-7 supports 6.0 A continuous drain current at TA = +70°C when mounted on an FR-4 board with a 1-inch² copper pad (PD = 1.0 W, RθJA = 76°C/W). This rating assumes no additional airflow or heatsinking and accounts for thermal derating above 25°C ambient.

Is the exposed pad electrically connected to the source terminal?

Yes, the exposed pad (Pin 6) is internally connected to the source terminals (Pins 2 and 4). It must be soldered to a PCB ground plane or source net to achieve specified thermal resistance and ensure mechanical reliability per J-STD-020 Level 1 moisture sensitivity handling.

Can this MOSFET be used in automotive applications?

While not AEC-Q101 qualified out-of-box, the DMN1014UFDF-7 is manufactured in IATF 16949-certified facilities and supports PPAP documentation upon request. Diodes Incorporated offers AEC-Q200-compliant variants (e.g., DMN1014UFDFQ-7) for automotive battery management and infotainment power rails.

What is the recommended gate resistor value for 1 MHz switching?

A 2 Ω gate resistor is validated in the datasheet for 1 MHz operation (tD(ON) = 3.0 ns, tF = 4.4 ns). For higher EMI immunity, a 4.7 Ω resistor may be used-this increases tF to ~8 ns but maintains <5% efficiency penalty at 2 A load in buck converters.

DMN1014UFDF-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
12 V
Current - Continuous Drain (Id) @ 25°C:
8A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Rds On (Max) @ Id, Vgs:
16mOhm @ 2A, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
6.4 nC @ 4.5 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
515 pF @ 6 V
FET Feature:
-
Power Dissipation (Max):
700mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type F)

DMN1014UFDF-7 FAQ

1.How can I place an order for DMN1014UFDF-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN1014UFDF-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN1014UFDF-7 reliable?

The price and inventory of DMN1014UFDF-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN1014UFDF-7 is usually 5 days.

3.What payment methods are accepted for DMN1014UFDF-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN1014UFDF-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN1014UFDF-7?

DMN1014UFDF-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN1014UFDF-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN1014UFDF-7?

For technical support, including DMN1014UFDF-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN1014UFDF-7 requirements.

6.How does Aetrix verify that DMN1014UFDF-7 is sourced from the original manufacturer or authorized distributors?

All DMN1014UFDF-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN1014UFDF-7 meets industry standards.

7.What is the process for return or replacement of DMN1014UFDF-7?

All DMN1014UFDF-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN1014UFDF-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN1014UFDF-7 part is unused and in its original packaging.

Return procedure for DMN1014UFDF-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN1014UFDF-7 Tags

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