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Diodes Incorporated DMN1250UFEL-7

Part No.:
DMN1250UFEL-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
12-UFQFN Exposed Pad
Datasheet:
AetrixDMN1250UFEL-7.pdf
Description:
MOSFET 8N-CH 12V 2A U-QFN1515
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,000

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Product details

Overview

DMN1250UFEL-7 from Diodes Incorporated is an N-channel enhancement-mode MOSFET array integrating eight identical low-voltage switches in a single U-QFN1515-12 package, with RDS(ON) = 280 mΩ at VGS = 4.5 V, VDSS = 12 V, and continuous drain current of 2.0 A at 25°C - designed for compact load switching in multi-rail power management ICs and portable battery-powered systems.

For engineers reviewing the DMN1250UFEL-7 datasheet, DMN1250UFEL-7 pinout, DMN1250UFEL-7 application, or DMN1250UFEL-7 equivalent, key selection criteria include its common-source 8-channel topology, ultra-small 1.5 mm × 1.5 mm footprint, low gate charge (1.3–1.9 nC), thermal resistance (100 °C/W on 2 oz copper), and compliance with RoHS 3, halogen-free, and lead-free requirements.

Technical Context

This device implements eight independent N-channel MOSFETs sharing a common source terminal, enabling parallel or individually controlled switching paths in space-constrained DC-DC converter auxiliary rails, LED driver bias networks, and multi-sensor interface power gating. Its 12 V VDSS rating and 0.4–1.0 V gate threshold support direct interfacing with 1.8 V/3.3 V logic controllers without level shifting.

Thermal performance is optimized for high-density layouts: RθJA drops from 177 °C/W (standard FR-4) to 100 °C/W with 2 oz copper, and normalized RDS(ON) variation remains ≤1.6× across –55°C to +150°C junction temperature - critical for automotive cabin modules and industrial edge nodes operating under wide ambient swings.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 12 V - Supports input rails up to 12 V without breakdown; suitable for USB PD, PMIC auxiliary outputs, and 12 V automotive subsystems.
RDS(ON) @ 4.5 V 280 mΩ (typ) - Enables <100 mW conduction loss at 200 mA, minimizing self-heating in always-on sensor bias circuits.
Qg 1.3–1.9 nC - Reduces gate drive power and enables fast switching (>5 MHz PWM) with low-current GPIOs or integrated drivers.
ID (cont) 2.0 A @ 25°C - Sustains full-rated current per channel under standard PCB layout; derates to 1.6 A at 70°C ambient.
RθJA 100 °C/W - Achievable only with 2 oz copper pad; allows 1.25 W power dissipation before reaching 150°C max junction temperature.
VGS(TH) 0.4–1.0 V - Ensures reliable turn-on with 1.2 V core logic or low-dropout regulators; avoids false triggering in noisy environments.
Ciss 146–190 pF - Limits high-frequency gate oscillation risk; compatible with RC snubbers in 1–10 MHz switching applications.

Pinout & Package

Package: U-QFN1515-12 - 1.5 mm × 1.5 mm, 12-terminal, bottom-exposed thermal pad, lead-free matte tin finish, JEDEC-compliant Level 1 moisture sensitivity.

Pin/Terminal Circuit Role Design Meaning
1, 3, 5, 7, 9, 10, 11, 12 Drain (D1–D8) Eight independent drain terminals - each connects to separate load; no internal connection between drains.
2, 4, 6, 8 Gate (G1–G4) Four gate inputs controlling two MOSFETs each; G1 controls D1/D2, G2 controls D3/D4, etc.
Exposed Pad (EP) Common Source (S) Single shared source node soldered to PCB ground plane; primary thermal and electrical return path.

Key Features

Feature Design Value
8-channel integration Reduces board area by >70% vs. discrete 8-MOSFET solutions; eliminates 8× gate resistor placements and routing congestion.
Low RDS(ON) at 2.5 V 360 mΩ (max) enables use with 2.5 V I/O domains (e.g., FPGA banks, microcontroller peripherals) without gate boosting.
Ultra-low Qgd/Qgs ratio Qgd = 0.1 nC, Qgs = 0.3 nC - minimizes Miller effect, improving switching stability in high-dV/dt environments like motor gate drives.
Green compound & UL 94V-0 Mold compound meets halogen/antimony/beryllium limits (<900 ppm Br/Cl, <1000 ppm Sb/Be); supports eco-design certifications (IEC 61215, IPC-1752).
ESD robustness HBM 150 V, CDM 1000 V - exceeds JEDEC JS-001 Class 1B and JS-002 Class C2, reducing field failure risk during automated assembly.

Applications

USB Type-C Port Power Switching Multi-Sensor Bias Control

Use Scenario: Selectively enable/disable VCONN, CC line pull-up/down, and auxiliary power paths in dual-role USB-C ports.

IC Role / Device Role: Eight-channel load switch managing independent 5 V/3.3 V/1.8 V bias rails for CC logic, VCONN sourcing, and sideband use (SBU).

Use Value: Single-package solution replaces four dual-channel switches; reduces BOM count by 75% and eliminates timing skew between port lanes.

Use Scenario: Power-gating analog sensors (temperature, humidity, IMU) in wearables to extend battery life during sleep mode.

IC Role / Device Role: Low-leakage (1 µA IDSS) N-MOSFET array isolating sensor supply rails while preserving signal integrity on shared I²C/SPI buses.

Use Value: 280 mΩ RDS(ON) ensures <5 mV drop at 20 mA sensor current; enables sub-µA system standby with zero cross-talk.

Automotive Cabin Controller PMIC Auxiliary Rail Management

Use Scenario: Controlling LED backlight dimming, HVAC actuator solenoids, and infotainment button illumination in AEC-Q200-qualified modules.

IC Role / Device Role: High-reliability 12 V-tolerant switch array handling multiple 100–500 mA loads with built-in thermal derating up to +125°C ambient.

Use Value: 150°C max TJ and 1000 V CDM withstand allow direct placement near MCU heat sources; eliminates need for external thermal sensors.

Use Scenario: Sequencing and enabling/disabling auxiliary LDO outputs (e.g., DDR termination, camera bias, RF front-end) in multi-output PMICs.

IC Role / Device Role: Logic-level-controlled power switch providing precise rail activation timing and fault isolation between PMIC domains.

Use Value: Gate threshold range (0.4–1.0 V) matches PMIC's 0.8 V control signals; low Qg prevents control-line loading in dense PMIC layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-channel N-channel MOSFET switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2058UFA-7 Single-channel, same U-QFN1515-6 package; RDS(ON) = 250 mΩ @ 4.5 V; VDSS = 20 V; higher voltage margin but no channel integration. Requires 8× placement for same functionality; better for distributed high-side switching where isolation > density is prioritized. Select when individual thermal monitoring per channel is required or when 20 V rail support is mandatory.
FDMA1023NZ 8-channel, 12 V, RDS(ON) = 320 mΩ @ 4.5 V; larger 2 mm × 2 mm WDFN package; Qg = 2.4 nC; lower ESD (HBM 100 V). Same functional topology but 78% larger footprint; higher gate drive demand limits use with weak GPIOs. Select when legacy board space permits larger package or when compatibility with existing FDM-series layout standards is needed.

Compared with DMN2058UFA-7 and FDMA1023NZ, the DMN1250UFEL-7 uniquely balances ultra-compact size (1.5 mm²), lowest gate charge (1.3–1.9 nC), and tight RDS(ON) tolerance (280–450 mΩ) - making it optimal for next-gen portable electronics where PCB real estate and battery runtime are co-constrained.

Availability

DMN1250UFEL-7 is available at Aetrix Electronics and suitable for USB-C port controllers, multi-sensor wearable subsystems, and automotive cabin control modules requiring stable component supply, long-term lifecycle assurance, and traceable green-material compliance.

Supply support for DMN1250UFEL-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection devices for consumer, industrial, and automotive markets.

The DMN1250UFEL-7 belongs to Diodes' Ultra-Small Signal MOSFET product line, engineered specifically for miniaturized multi-rail power switching in space- and power-constrained applications such as portable medical devices and IoT edge nodes.

FAQ

What is the maximum safe operating temperature for DMN1250UFEL-7?

The absolute maximum junction temperature is +150°C, and the device is rated for continuous operation from –55°C to +150°C. With RθJA = 100°C/W on 2 oz copper, sustained 1.25 W power dissipation will reach this limit - design must ensure ambient + self-heating stays below 150°C using thermal vias and copper pour.

Can DMN1250UFEL-7 be used in high-frequency PWM applications?

Yes - its low Qg (1.3–1.9 nC) and fast switching times (tD(ON) = 1.9–2.7 ns, tF = 1.0 ns) support PWM frequencies up to 10 MHz in low-duty-cycle bias control. However, layout parasitics dominate above 5 MHz; keep gate traces short and use local 100 nF decoupling at each gate.

How are the eight channels configured internally?

The eight N-channel MOSFETs share one common source terminal (exposed thermal pad) and are grouped into four pairs, each controlled by one gate (G1–G4). Drain terminals D1–D8 are fully isolated - no internal connection exists between any drains or gates beyond their assigned pair.

Is the exposed pad electrically connected to the source?

Yes - the exposed pad is the sole common source terminal (S) and must be soldered to a solid PCB ground plane. It is not isolated or floating; omitting thermal pad connection violates the datasheet's minimum pad layout and degrades RθJA by >40%, risking thermal runaway at rated current.

DMN1250UFEL-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
12-UFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Technology:
MOSFET (Metal Oxide)
Configuration:
8 N-Channel, Common Gate, Common Source
FET Feature:
-
Drain to Source Voltage (Vdss):
12V
Current - Continuous Drain (Id) @ 25°C:
2A
Rds On (Max) @ Id, Vgs:
450mOhm @ 200mA, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
1.9nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
190pF @ 6V
Power - Max:
660mW
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-QFN1515-12

DMN1250UFEL-7 FAQ

1.How can I place an order for DMN1250UFEL-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN1250UFEL-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN1250UFEL-7 reliable?

The price and inventory of DMN1250UFEL-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN1250UFEL-7 is usually 5 days.

3.What payment methods are accepted for DMN1250UFEL-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN1250UFEL-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN1250UFEL-7?

DMN1250UFEL-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN1250UFEL-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN1250UFEL-7?

For technical support, including DMN1250UFEL-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN1250UFEL-7 requirements.

6.How does Aetrix verify that DMN1250UFEL-7 is sourced from the original manufacturer or authorized distributors?

All DMN1250UFEL-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN1250UFEL-7 meets industry standards.

7.What is the process for return or replacement of DMN1250UFEL-7?

All DMN1250UFEL-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN1250UFEL-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN1250UFEL-7 part is unused and in its original packaging.

Return procedure for DMN1250UFEL-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN1250UFEL-7 Tags

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