Diodes Incorporated DMN1250UFEL-7
- Part No.:
- DMN1250UFEL-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 12-UFQFN Exposed Pad
- Datasheet:
-
DMN1250UFEL-7.pdf
- Description:
- MOSFET 8N-CH 12V 2A U-QFN1515
- Quantity:
- Payment:

- Shipping:

Inventory:3,000
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Product details
Overview
DMN1250UFEL-7 from Diodes Incorporated is an N-channel enhancement-mode MOSFET array integrating eight identical low-voltage switches in a single U-QFN1515-12 package, with RDS(ON) = 280 mΩ at VGS = 4.5 V, VDSS = 12 V, and continuous drain current of 2.0 A at 25°C - designed for compact load switching in multi-rail power management ICs and portable battery-powered systems.
For engineers reviewing the DMN1250UFEL-7 datasheet, DMN1250UFEL-7 pinout, DMN1250UFEL-7 application, or DMN1250UFEL-7 equivalent, key selection criteria include its common-source 8-channel topology, ultra-small 1.5 mm × 1.5 mm footprint, low gate charge (1.3–1.9 nC), thermal resistance (100 °C/W on 2 oz copper), and compliance with RoHS 3, halogen-free, and lead-free requirements.
Technical Context
This device implements eight independent N-channel MOSFETs sharing a common source terminal, enabling parallel or individually controlled switching paths in space-constrained DC-DC converter auxiliary rails, LED driver bias networks, and multi-sensor interface power gating. Its 12 V VDSS rating and 0.4–1.0 V gate threshold support direct interfacing with 1.8 V/3.3 V logic controllers without level shifting.
Thermal performance is optimized for high-density layouts: RθJA drops from 177 °C/W (standard FR-4) to 100 °C/W with 2 oz copper, and normalized RDS(ON) variation remains ≤1.6× across –55°C to +150°C junction temperature - critical for automotive cabin modules and industrial edge nodes operating under wide ambient swings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 12 V - Supports input rails up to 12 V without breakdown; suitable for USB PD, PMIC auxiliary outputs, and 12 V automotive subsystems. |
| RDS(ON) @ 4.5 V | 280 mΩ (typ) - Enables <100 mW conduction loss at 200 mA, minimizing self-heating in always-on sensor bias circuits. |
| Qg | 1.3–1.9 nC - Reduces gate drive power and enables fast switching (>5 MHz PWM) with low-current GPIOs or integrated drivers. |
| ID (cont) | 2.0 A @ 25°C - Sustains full-rated current per channel under standard PCB layout; derates to 1.6 A at 70°C ambient. |
| RθJA | 100 °C/W - Achievable only with 2 oz copper pad; allows 1.25 W power dissipation before reaching 150°C max junction temperature. |
| VGS(TH) | 0.4–1.0 V - Ensures reliable turn-on with 1.2 V core logic or low-dropout regulators; avoids false triggering in noisy environments. |
| Ciss | 146–190 pF - Limits high-frequency gate oscillation risk; compatible with RC snubbers in 1–10 MHz switching applications. |
Pinout & Package
Package: U-QFN1515-12 - 1.5 mm × 1.5 mm, 12-terminal, bottom-exposed thermal pad, lead-free matte tin finish, JEDEC-compliant Level 1 moisture sensitivity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 5, 7, 9, 10, 11, 12 | Drain (D1–D8) | Eight independent drain terminals - each connects to separate load; no internal connection between drains. |
| 2, 4, 6, 8 | Gate (G1–G4) | Four gate inputs controlling two MOSFETs each; G1 controls D1/D2, G2 controls D3/D4, etc. |
| Exposed Pad (EP) | Common Source (S) | Single shared source node soldered to PCB ground plane; primary thermal and electrical return path. |
Key Features
| Feature | Design Value |
|---|---|
| 8-channel integration | Reduces board area by >70% vs. discrete 8-MOSFET solutions; eliminates 8× gate resistor placements and routing congestion. |
| Low RDS(ON) at 2.5 V | 360 mΩ (max) enables use with 2.5 V I/O domains (e.g., FPGA banks, microcontroller peripherals) without gate boosting. |
| Ultra-low Qgd/Qgs ratio | Qgd = 0.1 nC, Qgs = 0.3 nC - minimizes Miller effect, improving switching stability in high-dV/dt environments like motor gate drives. |
| Green compound & UL 94V-0 | Mold compound meets halogen/antimony/beryllium limits (<900 ppm Br/Cl, <1000 ppm Sb/Be); supports eco-design certifications (IEC 61215, IPC-1752). |
| ESD robustness | HBM 150 V, CDM 1000 V - exceeds JEDEC JS-001 Class 1B and JS-002 Class C2, reducing field failure risk during automated assembly. |
Applications
| USB Type-C Port Power Switching | Multi-Sensor Bias Control |
|---|---|
|
Use Scenario: Selectively enable/disable VCONN, CC line pull-up/down, and auxiliary power paths in dual-role USB-C ports. IC Role / Device Role: Eight-channel load switch managing independent 5 V/3.3 V/1.8 V bias rails for CC logic, VCONN sourcing, and sideband use (SBU). Use Value: Single-package solution replaces four dual-channel switches; reduces BOM count by 75% and eliminates timing skew between port lanes. |
Use Scenario: Power-gating analog sensors (temperature, humidity, IMU) in wearables to extend battery life during sleep mode. IC Role / Device Role: Low-leakage (1 µA IDSS) N-MOSFET array isolating sensor supply rails while preserving signal integrity on shared I²C/SPI buses. Use Value: 280 mΩ RDS(ON) ensures <5 mV drop at 20 mA sensor current; enables sub-µA system standby with zero cross-talk. |
| Automotive Cabin Controller | PMIC Auxiliary Rail Management |
|
Use Scenario: Controlling LED backlight dimming, HVAC actuator solenoids, and infotainment button illumination in AEC-Q200-qualified modules. IC Role / Device Role: High-reliability 12 V-tolerant switch array handling multiple 100–500 mA loads with built-in thermal derating up to +125°C ambient. Use Value: 150°C max TJ and 1000 V CDM withstand allow direct placement near MCU heat sources; eliminates need for external thermal sensors. |
Use Scenario: Sequencing and enabling/disabling auxiliary LDO outputs (e.g., DDR termination, camera bias, RF front-end) in multi-output PMICs. IC Role / Device Role: Logic-level-controlled power switch providing precise rail activation timing and fault isolation between PMIC domains. Use Value: Gate threshold range (0.4–1.0 V) matches PMIC's 0.8 V control signals; low Qg prevents control-line loading in dense PMIC layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-channel N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2058UFA-7 | Single-channel, same U-QFN1515-6 package; RDS(ON) = 250 mΩ @ 4.5 V; VDSS = 20 V; higher voltage margin but no channel integration. | Requires 8× placement for same functionality; better for distributed high-side switching where isolation > density is prioritized. | Select when individual thermal monitoring per channel is required or when 20 V rail support is mandatory. |
| FDMA1023NZ | 8-channel, 12 V, RDS(ON) = 320 mΩ @ 4.5 V; larger 2 mm × 2 mm WDFN package; Qg = 2.4 nC; lower ESD (HBM 100 V). | Same functional topology but 78% larger footprint; higher gate drive demand limits use with weak GPIOs. | Select when legacy board space permits larger package or when compatibility with existing FDM-series layout standards is needed. |
Compared with DMN2058UFA-7 and FDMA1023NZ, the DMN1250UFEL-7 uniquely balances ultra-compact size (1.5 mm²), lowest gate charge (1.3–1.9 nC), and tight RDS(ON) tolerance (280–450 mΩ) - making it optimal for next-gen portable electronics where PCB real estate and battery runtime are co-constrained.
Availability
DMN1250UFEL-7 is available at Aetrix Electronics and suitable for USB-C port controllers, multi-sensor wearable subsystems, and automotive cabin control modules requiring stable component supply, long-term lifecycle assurance, and traceable green-material compliance.
Supply support for DMN1250UFEL-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection devices for consumer, industrial, and automotive markets.
The DMN1250UFEL-7 belongs to Diodes' Ultra-Small Signal MOSFET product line, engineered specifically for miniaturized multi-rail power switching in space- and power-constrained applications such as portable medical devices and IoT edge nodes.
FAQ
What is the maximum safe operating temperature for DMN1250UFEL-7?
The absolute maximum junction temperature is +150°C, and the device is rated for continuous operation from –55°C to +150°C. With RθJA = 100°C/W on 2 oz copper, sustained 1.25 W power dissipation will reach this limit - design must ensure ambient + self-heating stays below 150°C using thermal vias and copper pour.
Can DMN1250UFEL-7 be used in high-frequency PWM applications?
Yes - its low Qg (1.3–1.9 nC) and fast switching times (tD(ON) = 1.9–2.7 ns, tF = 1.0 ns) support PWM frequencies up to 10 MHz in low-duty-cycle bias control. However, layout parasitics dominate above 5 MHz; keep gate traces short and use local 100 nF decoupling at each gate.
How are the eight channels configured internally?
The eight N-channel MOSFETs share one common source terminal (exposed thermal pad) and are grouped into four pairs, each controlled by one gate (G1–G4). Drain terminals D1–D8 are fully isolated - no internal connection exists between any drains or gates beyond their assigned pair.
Is the exposed pad electrically connected to the source?
Yes - the exposed pad is the sole common source terminal (S) and must be soldered to a solid PCB ground plane. It is not isolated or floating; omitting thermal pad connection violates the datasheet's minimum pad layout and degrades RθJA by >40%, risking thermal runaway at rated current.
DMN1250UFEL-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 12-UFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 8 N-Channel, Common Gate, Common Source
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 12V
- Current - Continuous Drain (Id) @ 25°C:
- 2A
- Rds On (Max) @ Id, Vgs:
- 450mOhm @ 200mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 1.9nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 190pF @ 6V
- Power - Max:
- 660mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-QFN1515-12
DMN1250UFEL-7 FAQ
1.How can I place an order for DMN1250UFEL-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN1250UFEL-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN1250UFEL-7 reliable?
The price and inventory of DMN1250UFEL-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN1250UFEL-7 is usually 5 days.
3.What payment methods are accepted for DMN1250UFEL-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN1250UFEL-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN1250UFEL-7?
DMN1250UFEL-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN1250UFEL-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN1250UFEL-7?
For technical support, including DMN1250UFEL-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN1250UFEL-7 requirements.
6.How does Aetrix verify that DMN1250UFEL-7 is sourced from the original manufacturer or authorized distributors?
All DMN1250UFEL-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN1250UFEL-7 meets industry standards.
7.What is the process for return or replacement of DMN1250UFEL-7?
All DMN1250UFEL-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN1250UFEL-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN1250UFEL-7 part is unused and in its original packaging.
Return procedure for DMN1250UFEL-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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