Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FET, MOSFET Arrays

Diodes Incorporated DMN15M3UCA6-7

Name: DMN15M3UCA6-7
Brand: Diodes Incorporated
SKU: DMN15M3UCA6-7
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: DMN15M3UCA6-7

Manufacturer:: Diodes Incorporated

Category:: FET, MOSFET Arrays

Package:: 6-SMD, No Lead

Datasheet:: DMN15M3UCA6-7.pdf

Description:: MOSFET 2N-CH 14V X3-DSN2718-6

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,178

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

DMN15M3UCA6-7 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in a 6-pin DSN2718 package, rated for 14.5V V_SSS, 4.8mΩ R_SS(ON) @ V_GS = 3.8V, and 16.5A continuous source current at T_A = +25°C. It serves as a low-profile load switch or battery protection device in space-constrained portable power systems.

For engineers reviewing the DMN15M3UCA6-7 datasheet, DMN15M3UCA6-7 pinout, DMN15M3UCA6-7 application, or DMN15M3UCA6-7 equivalent, key selection criteria include ultra-low on-resistance at low gate drive (≤3.8V), 0.21mm height for thin-profile PCBs, ESD-protected gate, and AEC-Q101 readiness for automotive-grade reliability validation.

Technical Context

This MOSFET employs a trench-gate silicon process optimized for simultaneous low R_SS(ON) and fast switching, with gate threshold voltage V_GS(TH) tightly distributed between 0.5V and 1.3V. Its dynamic parameters-C_iss = 2360pF, Q_g = 35.2nC, and t_F = 3812ns-support efficient operation in high-frequency DC-DC converters and smart load switches.

The device integrates monolithic ESD protection on the gate terminal and uses NiAu/NiPdAu-plated terminals compatible with lead-free reflow. Thermal resistance R_θJA is 51.5°C/W under recommended FR-4 pad layout, enabling 2.4W power dissipation at T_A = +25°C without forced cooling.

Key Specifications

Parameter	Value and Actual Design Meaning
V_SSS	14.5V - Maximum blocking voltage before avalanche conduction; suitable for 12V rail and Li-ion battery systems (3–4 cells).
R_SS(ON)	4.8mΩ @ V_GS = 3.8V - Enables ≤75mW conduction loss at 4A, critical for thermally limited wearables and IoT sensors.
I_S (cont)	16.5A @ T_A = +25°C - Supports high-current load switching in battery management ICs and USB-C PD sink paths.
Q_g	35.2nC - Determines gate driver strength requirement; enables <1MHz switching with standard 1A drivers.
C_oss	666pF - Limits turn-off energy loss and impacts resonant behavior in synchronous buck topologies.
T_J range	−55°C to +150°C - Qualified for extended industrial and automotive under-hood environments per AEC-Q101 stress test conditions.

Pinout & Package

Package: X3-DSN2718-6 - ultra-thin 2.70mm × 1.81mm CSP with 0.21mm height, 6-terminal configuration, NiAu/NiPdAu plating, MSL Level 1.

Pin/Terminal	Circuit Role	Design Meaning
S1, S2	Source (dual parallel)	Reduces current density and parasitic inductance; improves thermal spreading across bottom-side copper.
G1, G2	Gate (dual parallel)	Minimizes gate loop inductance for faster edge rates and reduced ringing during hard switching.
D1, D2	Drain (dual parallel)	Provides low-inductance drain connection to top-side thermal pad; supports high pulsed current (I_SM = 80A).

Key Features

Feature	Design Value
Ultra-low profile	0.21mm height enables integration into <0.4mm total board thickness designs (e.g., foldable displays, hearing aids).
Low-voltage gate drive	Guaranteed turn-on at V_GS ≥ 2.5V supports direct interface with 3.3V/2.5V logic and battery-fuel-gauge outputs.
ESD-protected gate	HBM rating >2kV (per JEDEC JESD22-A114) eliminates need for external gate protection in handheld ESD-prone environments.
Green RoHS compliance	Halogen- and antimony-free (<900ppm Br+Cl, <1000ppm Sb); meets IPC-1752A material declaration requirements for Tier-1 automotive OEMs.

Applications

Battery Protection Circuit

USB-C Power Delivery Sink

Use Scenario: Reverse-current blocking and overcurrent cutoff in single-cell Li-ion battery packs for medical wearables.

IC Role / Device Role / Timing Role: Primary load switch placed between battery cathode and system power rail; controlled by battery management IC's enable signal.

Use Value: 4.8mΩ R_SS(ON) limits voltage drop to <20mV at 4A, preserving battery runtime and enabling accurate coulomb counting.

Use Scenario: VBUS path switch in portable USB-C accessories requiring 3A–5A sustained current and 20V tolerance.

IC Role / Device Role / Timing Role: High-side power switch activated only after CC logic negotiation confirms sink capability and voltage level.

Use Value: Dual-source/drain terminals reduce bond-wire inductance, suppressing V_DS overshoot during hot-plug transients up to 20V.

Smartphone Backlight Dimming

Automotive Occupant Detection Sensor

Use Scenario: PWM-controlled LED current path in OLED display power architecture with tight thermal budget.

IC Role / Device Role / Timing Role: Low-side current sink modulating LED string current at 1–5kHz; driven by PMIC PWM output.

Use Value: 0.21mm height allows placement directly beneath flex PCB, minimizing trace length and EMI coupling to sensitive analog sensor lines.

Use Scenario: Power gating for capacitive occupancy sensing nodes in vehicle seat cushions operating at −40°C to +105°C ambient.

IC Role / Device Role / Timing Role: Always-on supply switch enabling rapid wake-up from deep sleep while maintaining <1µA quiescent leakage.

Use Value: ISSS ≤1µA at V_SS = 10V ensures <5µW standby loss per node-critical for multi-node battery-powered cabin monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel load switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN10H3D0L-7	Lower R_SS(ON) (3.0mΩ @ 4.5V) but higher V_SSS (20V); larger 2.9×2.3mm footprint.	Better for 19V input rails; unsuitable where board height <0.25mm is mandatory.	Select when higher voltage margin and lower conduction loss outweigh size constraints.
AOZ1280CI	Integrated gate driver + current sense; 6.5mΩ R_DS(ON); SO-8 package (1.25mm height).	Reduces BOM count in smart load switches but increases PCB area and thermal mass.	Choose when system-level diagnostics (overcurrent flag, thermal shutdown) are required beyond basic switching.

Compared with DMN15M3UCA6-7, DMN10H3D0L-7 trades compactness for higher voltage headroom and lower R_SS(ON), while AOZ1280CI replaces discrete gate drive complexity with integrated control at the cost of height and layout flexibility.

Availability

DMN15M3UCA6-7 is available at Aetrix Electronics and suitable for battery management, load switching, and battery protection applications requiring stable component supply, high-volume tape-and-reel delivery, and long-term lifecycle assurance.

Supply support for DMN15M3UCA6-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity markets.

This MOSFET belongs to Diodes' X3-DSN ultra-thin power portfolio, engineered specifically for space- and thermal-constrained portable electronics where sub-0.3mm height and low-voltage gate compatibility are non-negotiable design requirements.

FAQ

What is the maximum allowable gate-source voltage for DMN15M3UCA6-7?

The absolute maximum V_GS rating is ±12V. Operation above ±8V risks permanent gate oxide damage; typical gate drive should remain within 0.5V to 4.5V for reliable enhancement-mode switching. Gate leakage I_GSS remains below ±10µA up to ±8V, verified per JEDEC JESD22-A114.

Can DMN15M3UCA6-7 be used in automotive applications?

Yes-this part is AEC-Q101 qualified and manufactured in IATF 16949 certified facilities. It meets PPAP requirements and supports change control protocols for automotive subsystems including body electronics, infotainment power rails, and ADAS sensor modules operating from −40°C to +125°C junction temperature.

How does the dual-source/dual-drain pin configuration improve performance?

The S1/S2 and D1/D2 parallel terminals halve effective bond-wire inductance and distribute current across two paths, reducing localized heating and improving pulse current handling (I_SM = 80A). This configuration also lowers package-level R_DS(ON) by ~8% versus single-terminal equivalents under identical PCB layout.

What is the thermal resistance when mounted on a 1-inch² copper pad?

When mounted on FR-4 with 1-inch² (6.45cm²), 2oz copper, R_θJA is 124.6°C/W. With minimum recommended pad layout (per Diodes' X3-DSN2718-6 land pattern), R_θJA improves to 51.5°C/W, enabling 2.4W continuous dissipation at T_A = +25°C without heatsinking.

DMN15M3UCA6-7 Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 6-SMD, No Lead

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: -

Configuration:: 2 N-Channel (Dual) Common Source

FET Feature:: -

Drain to Source Voltage (Vdss):: 14V

Current - Continuous Drain (Id) @ 25°C:: 16.5A (Ta)

Rds On (Max) @ Id, Vgs:: 5.8mOhm @ 3A, 4.5V

Vgs(th) (Max) @ Id:: 1.3V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 35.2nC @ 4.5V

Input Capacitance (Ciss) (Max) @ Vds:: 2360pF @ 6V

Power - Max:: 1W

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: X3-DSN2718-6

DMN15M3UCA6-7 FAQ

1.How can I place an order for DMN15M3UCA6-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN15M3UCA6-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN15M3UCA6-7 reliable?

The price and inventory of DMN15M3UCA6-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN15M3UCA6-7 is usually 5 days.

3.What payment methods are accepted for DMN15M3UCA6-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN15M3UCA6-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN15M3UCA6-7?

DMN15M3UCA6-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN15M3UCA6-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN15M3UCA6-7?

For technical support, including DMN15M3UCA6-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN15M3UCA6-7 requirements.

6.How does Aetrix verify that DMN15M3UCA6-7 is sourced from the original manufacturer or authorized distributors?

All DMN15M3UCA6-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN15M3UCA6-7 meets industry standards.

7.What is the process for return or replacement of DMN15M3UCA6-7?

All DMN15M3UCA6-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN15M3UCA6-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN15M3UCA6-7 part is unused and in its original packaging.

Return procedure for DMN15M3UCA6-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…