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Diodes Incorporated DMN16M9UCA6-7

Part No.:
DMN16M9UCA6-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
6-SMD, No Lead
Datasheet:
AetrixDMN16M9UCA6-7.pdf
Description:
MOSFET 2N-CH X3-DSN2718-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,396

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Product details

Overview

DMN16M9UCA6-7 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in a 6-pin CSP package (X3-DSN2718-6 Type B), rated for 12 V VSSS, 6.5 mΩ RSS(ON) at VGS = 4.5 V, and 16.6 A continuous source current at TA = +25°C. It serves as a low-profile load switch or battery protection device in space-constrained portable electronics.

For engineers reviewing the DMN16M9UCA6-7 datasheet, DMN16M9UCA6-7 pinout, DMN16M9UCA6-7 application, or DMN16M9UCA6-7 equivalent, key selection criteria include ultra-low on-resistance at low gate drive (2.5–4.5 V), ESD-protected gate, sub-0.25 mm height, and thermal performance under FR-4 PCB mounting conditions.

Technical Context

This MOSFET employs a trench-gate silicon process optimized for simultaneous low RSS(ON) and fast switching, with gate threshold voltage (VGS(TH)) tightly specified between 0.5 V and 1.3 V. Its dynamic parameters-Ciss = 2360 pF, Qg = 35.2 nC, and tF = 3812 ns-are calibrated for efficient operation in high-frequency DC-DC and battery-switching topologies.

The device integrates intrinsic body diode functionality with VSS(diode) = 0.7–1.2 V at IS = 3 A and exhibits normalized RSS(ON) variation of ≤1.5× across −55°C to +150°C junction temperature, enabling stable performance in wide-temperature industrial and automotive cabin applications.

Key Specifications

ParameterValue and Actual Design Meaning
VSSS12 V - Maximum blocking voltage for battery-side switching in single-cell Li-ion systems.
RSS(ON)6.5 mΩ @ VGS = 4.5 V - Enables <100 mW conduction loss at 12 A, critical for thermal budget in thin PCBs.
IS (cont.)16.6 A @ TA = +25°C - Supports high-current load switching without external heatsinking on standard FR-4.
Qg35.2 nC - Determines gate driver power requirement and switching transition time in PWM control loops.
RθJA51.5 °C/W - Measured with minimum recommended pad layout; defines maximum power dissipation before thermal derating.
PackageX3-DSN2718-6 (Type B) - 2.70 × 1.81 × 0.21 mm CSP footprint compatible with fine-pitch automated assembly.

Pinout & Package

Package: X3-DSN2718-6 (Type B), 6-terminal chip-scale package with NiPdAu-plated terminals, moisture sensitivity level 1 per J-STD-020.

Pin/TerminalCircuit RoleDesign Meaning
S1Source 1Primary current return path; electrically tied to S2 and S3 in internal die configuration.
G1Gate 1Main gate input; ESD-protected structure enables robust handling in low-voltage portable manufacturing.
S2Source 2Secondary source connection; parallel routing reduces package inductance and improves current sharing.
G2Gate 2Redundant gate terminal; improves gate drive uniformity and mitigates bond-wire resistance effects.
S3Source 3Third source terminal; enhances thermal spreading and lowers effective RDS(on) in PCB layout.
M2 / MCMarking Code PadNon-functional test pad used for laser marking; not connected to internal circuitry.

Key Features

FeatureDesign Value
Ultra-low profile0.21 mm height enables integration into <0.4 mm total thickness mobile modules and wearables.
Low-voltage gate driveGuaranteed turn-on at VGS ≥ 2.5 V supports direct interface with 3.3 V and 2.8 V microcontroller GPIOs.
ESD-protected gateHBM rating ≥ 2 kV ensures reliability during board assembly and field handling without additional protection circuits.
Halogen- and antimony-freeMeets IPC-4101D/21 and JEDEC JS709B green standards (<900 ppm Br, <900 ppm Cl, <1000 ppm Sb).

Applications

Battery Protection CircuitUSB-C Power Delivery Switch

Use Scenario: Prevents overcurrent and short-circuit damage in single-cell Li-ion battery packs for smartphones and tablets.

IC Role / Device Role / Timing Role: Primary reverse-polarity and overcurrent protection switch placed between battery anode and system load.

Use Value: 6.5 mΩ RSS(ON) minimizes voltage drop and self-heating during 10–15 A peak discharge, extending battery runtime and cycle life.

Use Scenario: Controls power path between USB-C port and system rail in portable accessories and docking stations.

IC Role / Device Role / Timing Role: High-side load switch enabling hot-plug detection and controlled inrush management.

Use Value: Fast tF = 3812 ns and low Qgd = 8.3 nC reduce switching losses during 300 kHz–1 MHz PD negotiation bursts.

Wireless Earbud Charging CaseSmartwatch Battery Management Unit

Use Scenario: Isolates charging circuit from main battery during wireless charging cycles to prevent leakage and cross-talk.

IC Role / Device Role / Timing Role: Bidirectional load switch managing charge current flow between Qi receiver coil and battery cell.

Use Value: 0.21 mm height allows placement beneath compact battery cells; ESD protection eliminates need for external TVS diodes.

Use Scenario: Enables independent monitoring and switching of primary and backup batteries in dual-battery smartwatches.

IC Role / Device Role / Timing Role: Dual-source selector switch supporting seamless switchover during battery replacement or calibration.

Use Value: Stable RSS(ON) across −40°C to +85°C ensures consistent voltage regulation in wrist-worn thermal environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN10H5D0L-7RSS(ON) = 9.5 mΩ @ VGS = 4.5 V; 10 V VSSS; same X3-DSN2718-6 packageLower voltage rating limits use to sub-10 V systems; higher RSS(ON) increases conduction loss by ~46% at 12 ASelect when 10 V max blocking suffices and cost sensitivity outweighs efficiency requirements.
AOZ1280CIIntegrated gate driver, thermal shutdown, and enable logic; SO-8 package; 15 V VSSSRequires external control signals; larger footprint and height preclude ultra-thin designsChoose when system-level protection features (OTP, UVLO) and ease of drive are prioritized over size and raw efficiency.

Compared with DMN10H5D0L-7 and AOZ1280CI, DMN16M9UCA6-7 delivers the lowest RSS(ON) in the smallest form factor, making it optimal for thermally constrained, high-current battery-switching roles where discrete control and minimal bill-of-materials are required.

Availability

DMN16M9UCA6-7 is available at Aetrix Electronics and suitable for battery protection, USB-C power delivery switching, wireless earbud charging cases, and smartwatch battery management units requiring stable component supply and long-term lifecycle support.

Supply support for DMN16M9UCA6-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

This device belongs to Diodes' DSN ultra-thin CSP MOSFET product line, engineered specifically for space- and efficiency-critical power management in portable consumer electronics and wearable devices.

FAQ

What is the maximum continuous drain current for DMN16M9UCA6-7 at 70°C ambient?

At TA = +70°C and VGS = 4.5 V, the continuous source current is 13.2 A. This value is derived from thermal derating based on RθJA = 51.5 °C/W and PD = 2.4 W under minimum pad layout conditions, ensuring safe operation without exceeding TJ = 150°C.

Does DMN16M9UCA6-7 require external gate resistors for typical load-switch applications?

No external gate resistor is required for basic on/off switching at frequencies below 100 kHz. The device's Qg = 35.2 nC and low Ciss/Crss ratio allow clean turn-on with standard 3.3 V MCU GPIOs. A 10 Ω series resistor may be added only if EMI reduction or dV/dt control is needed in high-noise environments.

Can DMN16M9UCA6-7 be used in bidirectional current flow applications?

Yes-the MOSFET's intrinsic body diode supports reverse current flow from source to drain when VSS < 0 V, enabling use in battery charging paths and OR-ing configurations. However, forward conduction through the body diode incurs ~0.7–1.2 V drop; synchronous rectification requires external control of a second FET.

Is the X3-DSN2718-6 package compatible with standard reflow profiles for lead-free soldering?

Yes-this package is qualified for IPC/JEDEC J-STD-020 Level 1 moisture sensitivity and supports standard SnAgCu reflow profiles with peak temperatures up to 260°C. The NiPdAu terminal finish ensures reliable wetting and intermetallic formation without voiding or dewetting on OSP- or ENIG-finished PCBs.

DMN16M9UCA6-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-SMD, No Lead
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
-
Rds On (Max) @ Id, Vgs:
-
Vgs(th) (Max) @ Id:
1.3V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
35.2nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
2360pF @ 6V
Power - Max:
2.4W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X3-DSN2718-6

DMN16M9UCA6-7 FAQ

1.How can I place an order for DMN16M9UCA6-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN16M9UCA6-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN16M9UCA6-7 reliable?

The price and inventory of DMN16M9UCA6-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN16M9UCA6-7 is usually 5 days.

3.What payment methods are accepted for DMN16M9UCA6-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN16M9UCA6-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN16M9UCA6-7?

DMN16M9UCA6-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN16M9UCA6-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN16M9UCA6-7?

For technical support, including DMN16M9UCA6-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN16M9UCA6-7 requirements.

6.How does Aetrix verify that DMN16M9UCA6-7 is sourced from the original manufacturer or authorized distributors?

All DMN16M9UCA6-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN16M9UCA6-7 meets industry standards.

7.What is the process for return or replacement of DMN16M9UCA6-7?

All DMN16M9UCA6-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN16M9UCA6-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN16M9UCA6-7 part is unused and in its original packaging.

Return procedure for DMN16M9UCA6-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN16M9UCA6-7 Tags

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