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Diodes Incorporated DMN2009UCA4-7
- Part No.:
- DMN2009UCA4-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 4-XFBGA, DSBGA
- Datasheet:
-
DMN2009UCA4-7.pdf
- Description:
- MOSFET 20V 10.3A X4-DSN1717
- Quantity:
- Payment:
- Shipping:
Inventory:7,467
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Product details
Overview
DMN2009UCA4 from Diodes Incorporated is an N-channel enhancement-mode MOSFET optimized for low on-resistance (7 mΩ typ. @ VGS = 4.5 V) and fast switching in compact battery management and load-switching circuits, rated for 20 V VSSS, 10.3 A continuous source current at 25°C, and operating across –55°C to +150°C.
For engineers reviewing the DMN2009UCA4 datasheet, DMN2009UCA4 pinout, DMN2009UCA4 application, or DMN2009UCA4 equivalent, this device is selected for space-constrained, high-efficiency power path control where ultra-low profile packaging and gate ESD protection are critical design requirements.
Technical Context
This MOSFET uses a trench-gate silicon process to achieve sub-10 mΩ RSS(ON) at low gate drive voltages (down to 2.5 V), enabling direct interface with 3.3 V logic controllers. Its dual-source/dual-gate internal structure supports symmetrical bidirectional conduction in load switch configurations.
The X4-DSN1717-4 package integrates NiAu-plated terminals and a 0.120 mm typical height, delivering low thermal resistance (RθJA = 65 °C/W with recommended pad layout) while maintaining J-STD-020 Level 1 moisture sensitivity for standard SMT reflow compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VSSS | 20 V - Maximum source-source blocking voltage for battery-side isolation in 2S Li-ion systems. |
| RSS(ON) | 7 mΩ typ. @ VGS = 4.5 V - Enables <100 mW conduction loss at 3.5 A, critical for portable thermal budget. |
| IS (cont.) | 10.3 A @ TA = 25°C - Supports high-current USB PD or e-fuse applications without external heatsinking. |
| Qg | 17.5 nC - Low total gate charge reduces driver power and enables efficient 1–2 MHz switching in DC-DC pre-regulators. |
| VGS(TH) | 0.35–1.4 V - Ensures reliable turn-on with weak gate drivers and improves noise immunity in noisy automotive environments. |
| Ciss | 1780 pF - Predictable input capacitance simplifies gate drive loop stability analysis in closed-loop load switches. |
Pinout & Package
Package: X4-DSN1717-4 - ultra-thin (0.120 mm typ.), 1.75 mm × 1.75 mm CSP with NiAu finish, footprint-compatible with industry-standard 0606-size land patterns.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S1 / S2 | Source terminals (dual, internally tied) | Low-inductance parallel source connection minimizes voltage drop asymmetry and improves current sharing in high-di/dt paths. |
| G1 / G2 | Gate terminals (dual, internally tied) | Dual gate pads reduce gate loop inductance and improve switching consistency under high-frequency PWM control. |
| D | Drain terminal | Exposed drain pad serves as primary thermal path and high-current output node-must be connected to large copper pour. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile CSP | 0.120 mm height enables integration beneath batteries or into stacked PCB assemblies with strict Z-axis constraints. |
| ESD-protected gate | Integrated gate protection diode withstands ±8 kV HBM per JEDEC JS-001, eliminating need for external TVS in handheld BMS designs. |
| Halogen- and antimony-free | <900 ppm Br/Cl and <1000 ppm Sb ensures compliance with IEC 61249-2-21 and automotive OEM green material directives. |
| Lead-free & RoHS 3 compliant | Fully EU Directive 2015/863/EU compliant with no intentionally added lead, supporting global WEEE and REACH requirements. |
Applications
| Battery Protection IC Interface | USB-C Power Delivery Load Switch |
|---|---|
|
Use Scenario: Integrated into secondary-side overcurrent and short-circuit protection circuits of smart battery packs. IC Role / Device Role / Timing Role: Acts as main power FET controlled by dedicated protection IC (e.g., DW01A), switching within 100 µs to disconnect cell stack during fault events. Use Value: 7 mΩ RSS(ON) limits voltage drop to <25 mV at 3.5 A, preserving accurate cell voltage monitoring during normal operation. |
Use Scenario: Used as upstream power path switch in portable USB-C accessories requiring 5 V/3 A support with reverse-voltage blocking. IC Role / Device Role / Timing Role: Functions as bidirectional load switch enabling VBUS sourcing/sinking while preventing backfeed into host ports. Use Value: Dual-source/dual-gate symmetry ensures matched forward/reverse RSS(ON) (<±5% variation), critical for USB PD 3.0 sink/source interoperability. |
| Wireless Earbud Charging Case | Medical Wearable Battery Management |
|
Use Scenario: Controls charging current flow from case battery to earbud PCB via magnetic pogo pins with minimal IR drop. IC Role / Device Role / Timing Role: Serves as low-loss series pass element in linear charger path, turned on only during active charging cycles. Use Value: 0.120 mm height allows placement directly under battery cell, reducing interconnect length and parasitic inductance in millimeter-scale enclosures. |
Use Scenario: Implements isolated power gating between lithium coin-cell backup and main rechargeable battery in implantable sensor modules. IC Role / Device Role / Timing Role: Provides fail-safe isolation during firmware updates or diagnostic self-tests, activated by microcontroller GPIO. Use Value: –55°C to +150°C operating range ensures reliability during sterilization (134°C steam autoclave) and long-term body-worn deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2012UFA4-7 | RSS(ON) = 12.5 mΩ @ VGS = 4.5 V; same X4-DSN1717-4 package; higher VSSS = 25 V | Better suited for 3S battery stacks (up to 12.6 V) but trades 78% higher conduction loss at 3.5 A | Select when system requires >20 V headroom and can tolerate +275 mW extra loss at full load. |
| AOZ1280CI | Integrated gate driver; 10.5 mΩ RDS(on); SO-8 package; 1.55 mm height | Requires external enable logic but eliminates gate resistor design; unsuitable for ultra-thin form factors | Choose when board space permits larger footprint and design needs integrated drive timing control for synchronous sequencing. |
Compared with DMN2009UCA4, DMN2012UFA4-7 offers higher voltage margin at the cost of efficiency, while AOZ1280CI trades miniaturization for functional integration-making DMN2009UCA4 optimal for Z-height–constrained, discrete-driven load switches.
Availability
DMN2009UCA4 is available at Aetrix Electronics and suitable for battery protection circuits, USB-C load switching, and medical wearable power gating requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle visibility.
Supply support for DMN2009UCA4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
This device belongs to Diodes' Ultra-Low RDS(on) Power MOSFET product line, engineered specifically for space- and efficiency-critical power path management in portable and wearables applications.
FAQ
What is the maximum pulsed source current rating for DMN2009UCA4?
The DMN2009UCA4 supports a pulsed source current (ISM) of 64 A, specified under repetitive conditions with pulse width limited by junction temperature. This rating assumes proper PCB thermal design and is validated per JEDEC test conditions with single-pulse thermal limits shown in Figure 12's SOA curve.
Does DMN2009UCA4 require external gate resistors for EMI control?
No external gate resistor is required for basic functionality due to its low Qg (17.5 nC) and symmetric dual-gate structure, which inherently damps ringing. However, a 2.2 Ω series resistor is recommended when driving from high-speed MCU GPIOs (>10 MHz edge rates) to suppress VGS overshoot and reduce radiated emissions in Class B environments.
Can DMN2009UCA4 be used in automotive infotainment power rails?
While DMN2009UCA4 meets AEC-Q200 passive stress testing requirements per Diodes' qualification documentation, it is not officially AEC-Q101 qualified. For automotive infotainment use, it may serve in non-safety-critical auxiliary rails (e.g., display backlight bias) only after customer-level validation against ISO 16750-2 transients and thermal cycling per vehicle-specific requirements.
How does the dual-source/dual-gate configuration affect PCB layout?
The dual-source (S1/S2) and dual-gate (G1/G2) terminals must be routed with matched trace lengths and identical copper weight to preserve symmetry-critical for minimizing current imbalance and localized heating. The recommended pad layout specifies 0.30 mm wide traces connecting each pair to a common thermal pad, with no vias placed between S1–S2 or G1–G2 nodes.
DMN2009UCA4-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 4-XFBGA, DSBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- -
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 20V
- Current - Continuous Drain (Id) @ 25°C:
- 10.3A (Ta)
- Rds On (Max) @ Id, Vgs:
- 11.9mOhm @ 2.5A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.4V @ 640µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17.5nC @ 4V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1780pF @ 10V
- Power - Max:
- 900mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X4-DSN1717-4
DMN2009UCA4-7 FAQ
1.How can I place an order for DMN2009UCA4-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN2009UCA4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN2009UCA4-7 reliable?
The price and inventory of DMN2009UCA4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN2009UCA4-7 is usually 5 days.
3.What payment methods are accepted for DMN2009UCA4-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN2009UCA4-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN2009UCA4-7?
DMN2009UCA4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN2009UCA4-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN2009UCA4-7?
For technical support, including DMN2009UCA4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN2009UCA4-7 requirements.
6.How does Aetrix verify that DMN2009UCA4-7 is sourced from the original manufacturer or authorized distributors?
All DMN2009UCA4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN2009UCA4-7 meets industry standards.
7.What is the process for return or replacement of DMN2009UCA4-7?
All DMN2009UCA4-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN2009UCA4-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN2009UCA4-7 part is unused and in its original packaging.
Return procedure for DMN2009UCA4-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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