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Diodes Incorporated DMN2012UCA6-7

Part No.:
DMN2012UCA6-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
6-SMD, No Lead
Datasheet:
AetrixDMN2012UCA6-7.pdf
Description:
MOSFET 2N-CH 24V 13A X3-DSN2718
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,649

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Product details

Overview

DMN2012UCA6-7 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in a 6-terminal CSP package (X3-DSN2718-6), rated for 24 V VSSS, 7.4 mΩ RSS(ON) at VGS = 3.8 V, and 13.0 A continuous source current at TA = +25°C. It serves as a low-profile load switch or battery protection device in space-constrained portable electronics.

For engineers reviewing the DMN2012UCA6-7 datasheet, DMN2012UCA6-7 pinout, DMN2012UCA6-7 application, or DMN2012UCA6-7 equivalent, key selection criteria include its ultra-low on-resistance at low gate drive (≤3.8 V), 0.21 mm height, ESD-protected gate, and AEC-Q101 readiness for automotive-grade power management.

Technical Context

This MOSFET employs a trench-gate silicon process optimized for low RSS(ON) while maintaining fast switching via low Qg (26.0 nC) and Qgd (9.5 nC). Its 24 V breakdown voltage and ±12 V gate rating support single-cell Li-ion and dual-cell NiMH battery systems.

The device integrates ESD protection on the gate terminal and uses NiPdAu-plated terminals compatible with standard reflow profiles. Thermal performance is characterized by RθJA = 55.0 °C/W under recommended PCB layout - critical for high-current, low-footprint battery switches.

Key Specifications

ParameterValue and Actual Design Meaning
VSSS24 V - Maximum blocking voltage for single-cell Li-ion (4.2 V) and dual-cell configurations with margin.
RSS(ON)7.4 mΩ @ VGS = 3.8 V - Enables <100 mW conduction loss at 10 A, suitable for always-on battery paths.
IS (max)13.0 A @ TA = +25°C - Supports peak load currents in USB-C PD and power bank output stages.
Qg26.0 nC - Low gate charge enables efficient driving from low-power microcontrollers or PMICs.
PackageX3-DSN2718-6 - 2.70 × 1.81 × 0.21 mm CSP footprint minimizes board area in wearable and hearable devices.
VGS(TH)0.5–1.3 V - Ensures reliable turn-on with 1.8 V/3.3 V logic-level control without external level shifting.

Pinout & Package

Package: X3-DSN2718-6 - ultra-thin 6-terminal chip-scale package with bottom-side thermal pad and solderable NiPdAu terminals.

Pin/TerminalCircuit RoleDesign Meaning
S1Source 1Primary current return path; electrically tied to S2/S3 for parallel low-inductance conduction.
G1GateControl input with integrated ESD protection; requires ≤±12 V drive per datasheet absolute max ratings.
S2Source 2Secondary source connection; used with S1/S3 to reduce package inductance and thermal resistance.
G2GateRedundant gate terminal for improved gate drive symmetry and reduced loop inductance in high-speed switching.
S3Source 3Third source terminal; all three sources (S1/S2/S3) are internally shorted and share current equally.
DDrainMain power output node; connected to top metal layer; requires thermal pad exposure on PCB for heat dissipation.

Key Features

FeatureDesign Value
Ultra-low profile0.21 mm height enables integration into slim smartphones, TWS earbuds, and medical patches.
Low-voltage gate driveTurns fully on at VGS ≥ 3.8 V - compatible with 3.3 V I/O domains without gate driver ICs.
ESD-protected gateHBM rating ≥ 2 kV - eliminates need for external gate protection diodes in consumer designs.
Thermally enhanced CSPBottom-exposed drain pad improves θJA to 55.0 °C/W - sustains 2.3 W power dissipation on minimal FR-4 copper.

Applications

Battery Protection CircuitUSB-C Power Delivery Switch

Use Scenario: Preventing overcurrent and reverse polarity in lithium-ion battery packs for tablets and power tools.

IC Role / Device Role / Timing Role: High-side load switch controlling main battery discharge path with fast fault response.

Use Value: 7.4 mΩ RSS(ON) limits voltage drop to <50 mV at 6.5 A, preserving battery runtime and enabling accurate current sensing.

Use Scenario: Enabling/disabling 20 V/5 A power paths in USB-C PD sink applications.

IC Role / Device Role / Timing Role: Low-inductance, low-RON power switch placed between connector and DC-DC converter input.

Use Value: Dual gate terminals (G1/G2) and triple source terminals (S1/S2/S3) minimize switching ringing and improve EMI performance at 300 kHz–1 MHz.

Wireless Earbud Charging CaseAutomotive Cabin Sensor Node

Use Scenario: Managing charging current from USB input to internal Li-ion battery in compact TWS charging cases.

IC Role / Device Role / Timing Role: Load switch isolating input power during battery charging and system sleep modes.

Use Value: 0.21 mm height allows placement beneath battery cells; 13.0 A rating supports fast-charging protocols up to 15 W.

Use Scenario: Power gating for low-power occupancy sensors and ambient light modules in vehicle door panels.

IC Role / Device Role / Timing Role: AEC-Q101-qualified load switch enabling controlled wake-up and shutdown of sensor subsystems.

Use Value: -55°C to +150°C operating range ensures reliability across cabin temperature extremes; RoHS/Green compliance meets automotive material requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2012LFG-7Same die, but in SOT-23-6 package (3.0 × 2.8 mm, 1.3 mm height); RSS(ON) = 7.8 mΩ @ VGS = 4.5 V.Larger footprint and higher profile - unsuitable for ultra-thin wearables but easier to hand-solder and rework.Select when manual assembly, thermal mass tolerance, or legacy board compatibility outweigh size constraints.
AOZ1280CIIntegrated load switch IC with enable, fault flag, and soft-start; RDS(ON) = 12 mΩ; 3.3 V logic compatible.Includes protection features (overcurrent, thermal shutdown) not present in DMN2012UCA6-7; requires no external gate resistor.Select when system-level protection and simplified control are prioritized over minimal BOM count and lowest possible RON.

Compared with DMN2012LFG-7 and AOZ1280CI, the DMN2012UCA6-7 delivers the smallest form factor and lowest RSS(ON) at low gate voltage, making it optimal for miniaturized, high-efficiency battery-switching where discrete control and thermal headroom are managed externally.

Availability

DMN2012UCA6-7 is available at Aetrix Electronics and suitable for battery management, load switching, and battery protection applications requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for DMN2012UCA6-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

This device belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, low-voltage power switching in portable and automotive electronics - emphasizing low RDS(ON), compact packaging, and robust gate protection.

FAQ

What is the maximum allowable gate-source voltage for DMN2012UCA6-7?

The absolute maximum VGS rating is ±12 V. Exceeding this may cause irreversible gate oxide damage. For reliable operation, gate drive should be limited to 0–4.5 V in normal use, with transient spikes clamped below ±12 V using appropriate layout and decoupling.

Does DMN2012UCA6-7 require a gate resistor in typical load-switch applications?

A gate resistor is not mandatory for basic ON/OFF switching at ≤100 kHz, but a 10–47 Ω series resistor is recommended to dampen gate ringing and limit peak gate current during fast transitions, especially when driven directly from microcontroller GPIO pins.

Can DMN2012UCA6-7 be used in automotive applications?

Yes - it is qualified to AEC-Q101 standards and manufactured in IATF 16949-certified facilities. Its -55°C to +150°C operating range, halogen-free "Green" construction, and PPAP capability make it suitable for cabin sensors, body control modules, and infotainment power rails.

How is thermal performance affected by PCB layout for DMN2012UCA6-7?

Thermal resistance drops from 151.9 °C/W (standard FR-4) to 55.0 °C/W when using the recommended 1-inch² copper pad with thermal vias. Insufficient copper area or missing vias will cause junction temperature to exceed 150°C at <1.5 W, risking premature failure.

DMN2012UCA6-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-SMD, No Lead
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual) Common Drain
FET Feature:
-
Drain to Source Voltage (Vdss):
24V
Current - Continuous Drain (Id) @ 25°C:
13A (Ta)
Rds On (Max) @ Id, Vgs:
9mOhm @ 5A, 4.5V
Vgs(th) (Max) @ Id:
1.3V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
26nC @ 4V
Input Capacitance (Ciss) (Max) @ Vds:
2417pF @ 10V
Power - Max:
820mW
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X3-DSN2718-6

DMN2012UCA6-7 FAQ

1.How can I place an order for DMN2012UCA6-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN2012UCA6-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN2012UCA6-7 reliable?

The price and inventory of DMN2012UCA6-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN2012UCA6-7 is usually 5 days.

3.What payment methods are accepted for DMN2012UCA6-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN2012UCA6-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN2012UCA6-7?

DMN2012UCA6-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN2012UCA6-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN2012UCA6-7?

For technical support, including DMN2012UCA6-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN2012UCA6-7 requirements.

6.How does Aetrix verify that DMN2012UCA6-7 is sourced from the original manufacturer or authorized distributors?

All DMN2012UCA6-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN2012UCA6-7 meets industry standards.

7.What is the process for return or replacement of DMN2012UCA6-7?

All DMN2012UCA6-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN2012UCA6-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN2012UCA6-7 part is unused and in its original packaging.

Return procedure for DMN2012UCA6-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN2012UCA6-7 Tags

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