Diodes Incorporated DMN2013UFDEQ-7
- Part No.:
- DMN2013UFDEQ-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-PowerUDFN
- Datasheet:
-
DMN2013UFDEQ-7.pdf
- Description:
- MOSFET BVDSS: 8V~24V U-DFN2020-6
- Quantity:
- Payment:

- Shipping:

Inventory:2,172
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Product details
Overview
DMN2013UFDEQ-7 from Diodes Incorporated is a 20V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type E) package, delivering 11 mΩ RDS(ON) at VGS = 4.5V, 10.5 A continuous drain current, and AEC-Q101 qualification for automotive power switching. It serves as a low-profile load switch in DC-DC converter synchronous rectification and battery protection circuits.
For engineers reviewing the DMN2013UFDEQ-7 datasheet, DMN2013UFDEQ-7 pinout, DMN2013UFDEQ-7 application, or DMN2013UFDEQ-7 equivalent, key selection criteria include gate threshold voltage (0.5–1.1 V), thermal resistance (61 °C/W under enhanced layout), body diode forward voltage (1.2 V), and ESD-protected gate architecture.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low RDS(ON) while preserving fast switching dynamics: total gate charge is 14.3 nC at VGS = 4.5V, with turn-on delay of 9.9 ns and turn-off delay of 66.4 ns under standard test conditions (VDS = 10V, ID = 8.5A, RG = 1.8 Ω). Its low 0.6 mm profile and 4 mm² footprint support ultra-thin portable and automotive PCB designs.
The device integrates an intrinsic body diode with 2.5 A continuous forward current rating and 1.2 V forward voltage at 8.5 A, enabling bidirectional conduction in reverse-polarity protection and OR-ing applications. Gate-source leakage remains ≤ ±2 µA up to ±8 V, ensuring stable biasing in low-power control logic interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 20 V - Maximum blocking voltage for 12 V automotive rail and USB PD auxiliary power paths |
| RDS(ON) | 11 mΩ @ VGS = 4.5V - Enables <100 mW conduction loss at 8.5 A in compact thermal layouts |
| ID (continuous) | 10.5 A @ TA = +25°C - Supports high-current load switching without external heatsinking on 2 oz copper |
| VGS(TH) | 0.5–1.1 V - Ensures reliable turn-on with 1.8 V/2.5 V/3.3 V logic-level drivers |
| Qg | 14.3 nC @ VGS = 4.5V - Limits gate drive power to ~65 µW at 1 MHz switching in DC-DC controllers |
| RθJA | 61 °C/W - Achievable with 1-inch² thermal pad; enables 2.03 W dissipation at TA = +25°C |
| Ciss | 2453 pF - Defines input capacitance for gate driver sizing and EMI filtering requirements |
Pinout & Package
U-DFN2020-6 (Type E) is a 2.0 × 2.0 mm, 0.6 mm height, leadless surface-mount package with exposed thermal pad (pin 6) and six terminals arranged in dual-row configuration. Molded plastic case meets UL 94V-0 flammability rating and J-STD-020 Level 1 moisture sensitivity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Common source connection; electrically tied internally; used for return path and thermal conduction to PCB |
| 4 | Gate (G) | Control terminal; ESD-protected; requires <1.8 Ω series resistor to limit ringing during fast switching |
| 5 | Drain (D) | Main power output node; connects to high-side or low-side switching node depending on topology |
| 6 | Thermal Pad / Exposed Drain | Electrically connected to drain; must be soldered to large copper pour for thermal management and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Low-profile 0.6 mm height | Enables integration into space-constrained modules such as automotive ADAS camera housings and wearable power banks |
| ESD-protected gate | Withstands ≥2 kV HBM per JESD22-A114, reducing need for external TVS in board-level ESD protection schemes |
| AEC-Q101 qualified | Validated for automotive temperature range (−55°C to +150°C) and PPAP-capable manufacturing in IATF 16949 facilities |
| Halogen- and antimony-free "Green" construction | Meets automotive OEM chemical compliance requirements (<900 ppm Br, <900 ppm Cl, <1000 ppm Sb) |
| 1.5 V gate drive capability | Supports operation with ultra-low-voltage microcontrollers and energy-harvesting PMICs down to 1.5 V logic |
Applications
| Automotive Load Switch | USB-C Power Delivery Protection |
|---|---|
Use Scenario: Controlling power to infotainment display backlight and sensor modules in 12 V vehicle electrical systems. IC Role / Device Role / Timing Role: Low-side load switch enabling controlled hot-swap and inrush current limiting. Use Value: 11 mΩ RDS(ON) minimizes voltage drop across switch, preserving >98% efficiency at 8 A load current. | Use Scenario: Reverse-polarity and overcurrent protection in USB-C receptacle circuits supporting 20 V/5 A PD profiles. IC Role / Device Role / Timing Role: Bidirectional power path switch leveraging integrated body diode for fault-tolerant OR-ing. Use Value: 1.2 V body diode VSD ensures low-loss reverse conduction during cable insertion transients. |
| Portable Device Battery Protection | Synchronous Rectifier in DC-DC Converters |
Use Scenario: Primary discharge path control in Li-ion battery packs for medical handheld devices requiring AEC-Q101 reliability. IC Role / Device Role / Timing Role: High-side or low-side protection FET in smart battery fuel gauge IC interface. Use Value: 0.5–1.1 V gate threshold allows direct drive from 1.8 V system MCU GPIO without level-shifting. | Use Scenario: Secondary-side synchronous rectification in 5 V/3.3 V buck converters for industrial IoT edge nodes. IC Role / Device Role / Timing Role: Fast-switching power transistor replacing Schottky diode to reduce conduction losses. Use Value: 14.3 nC Qg enables efficient gate driving at 500 kHz–1 MHz with minimal driver IC power consumption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2013LFG-7 | Same die, different package: U-DFN2020-6 (Type G); 0.55 mm height; identical RDS(ON), Qg, and ratings | Requires updated stencil and reflow profile due to thinner package; no change in circuit performance | Select when board stack height is constrained below 0.6 mm or when Type G footprint is already standardized |
| DMN2019UFD-7 | Higher RDS(ON): 19 mΩ @ 4.5 V; lower Qg: 9.5 nC; same package and voltage rating | Better suited for lower-current, higher-frequency switching where gate drive loss dominates conduction loss | Prefer for 1–3 A loads above 2 MHz switching frequency; avoid for >6 A continuous duty |
Compared with DMN2013UFDEQ-7, DMN2013LFG-7 offers identical electrical behavior in a marginally thinner package, while DMN2019UFD-7 trades 73% higher conduction loss for 34% lower gate charge-making it optimal only in high-frequency, low-current scenarios where thermal headroom is ample.
Availability
DMN2013UFDEQ-7 is available at Aetrix Electronics and suitable for automotive infotainment systems, USB-C power delivery modules, and portable medical device battery management requiring stable component supply, AEC-Q101 traceability, and RoHS-compliant sourcing.
Supply support for DMN2013UFDEQ-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
This MOSFET belongs to Diodes' Automotive-Qualified PowerFET family, engineered specifically for high-reliability, low-RDS(ON) switching in 12 V and 24 V automotive subsystems and portable power architectures.
FAQ
What is the maximum continuous drain current for DMN2013UFDEQ-7 at 70°C ambient?
The maximum continuous drain current is 8.5 A at TA = +70°C with VGS = 4.5 V under steady-state conditions on a standard FR-4 board with minimum recommended pad layout. This derating reflects thermal limits imposed by the 61 °C/W junction-to-ambient resistance under enhanced thermal layout.
Does DMN2013UFDEQ-7 require external gate resistors in typical switching applications?
Yes-a series gate resistor of 1.8 Ω is specified in the datasheet for dynamic characterization and is recommended to dampen ringing caused by parasitic inductance in high-speed switching. Omission may cause overshoot exceeding ±8 V gate rating or oscillatory turn-on behavior in layouts with long gate traces.
Is the thermal pad (Pin 6) electrically isolated or connected to a specific terminal?
The thermal pad (Pin 6) is electrically connected to the drain terminal and must be soldered to a PCB copper pour tied to the drain net. It is not isolated and serves both thermal conduction and electrical connection functions-failure to connect it properly degrades RθJA by >30% and risks thermal runaway under sustained load.
Can DMN2013UFDEQ-7 be used in linear (analog) regulation mode?
No-it is not characterized or rated for linear operation. The Safe Operating Area (SOA) curve shows limited DC capability (≤0.1 A at 10 V), and its RDS(ON) variation with temperature (±30% over −55°C to +150°C) makes it unsuitable for precision analog pass elements. Use only in saturated switching mode.
DMN2013UFDEQ-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-PowerUDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 10.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 11mOhm @ 8.5A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 25.8 nC @ 8 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2453 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 660mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type E)
DMN2013UFDEQ-7 FAQ
1.How can I place an order for DMN2013UFDEQ-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN2013UFDEQ-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN2013UFDEQ-7 reliable?
The price and inventory of DMN2013UFDEQ-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN2013UFDEQ-7 is usually 5 days.
3.What payment methods are accepted for DMN2013UFDEQ-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN2013UFDEQ-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN2013UFDEQ-7?
DMN2013UFDEQ-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN2013UFDEQ-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN2013UFDEQ-7?
For technical support, including DMN2013UFDEQ-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN2013UFDEQ-7 requirements.
6.How does Aetrix verify that DMN2013UFDEQ-7 is sourced from the original manufacturer or authorized distributors?
All DMN2013UFDEQ-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN2013UFDEQ-7 meets industry standards.
7.What is the process for return or replacement of DMN2013UFDEQ-7?
All DMN2013UFDEQ-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN2013UFDEQ-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN2013UFDEQ-7 part is unused and in its original packaging.
Return procedure for DMN2013UFDEQ-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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