My Inquiry
My Account
Diodes Incorporated DMN2024UFU-13
- Part No.:
- DMN2024UFU-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 6-UFDFN Exposed Pad
- Datasheet:
-
DMN2024UFU-13.pdf
- Description:
- MOSFET 2N-CH 20V 7.5A 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,485
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMN2024UFU-13 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in a U-DFN2030-6 (Type B) package, rated for 20V VDSS, 21A ID at TC = +25°C, and 20.2mΩ RDS(ON) @ VGS = 4.5V. It delivers low gate threshold (0.35–0.95V), ESD-protected gate, and optimized switching performance for high-efficiency DC-DC converters in portable power management systems.
For engineers reviewing the DMN2024UFU-13 datasheet, DMN2024UFU-13 pinout, DMN2024UFU-13 application, or DMN2024UFU-13 equivalent, key selection criteria include its 2.5V/4.5V drive capability, 73°C/W RθJA on enhanced PCB layout, dual-channel integration in 2.0 × 3.0 mm footprint, and AEC-Q101 readiness for automotive-grade power stages.
Technical Context
This dual N-channel MOSFET integrates two matched silicon die in a single leadless U-DFN2030-6 package with NiPdAu-plated terminals. Its low VGS(TH) enables direct drive from 2.5V/3.3V logic controllers, while tight RDS(ON) distribution (11.2–20.2mΩ typ/max @ 4.5V) supports synchronous buck topologies requiring precise current sharing.
The device features integrated body diode with 0.7–1.0V VSD and 149ns tRR, enabling efficient freewheeling in step-down regulators. Thermal design leverages 8.9°C/W RθJC to transfer heat directly to PCB copper, supporting continuous 17A operation at TC = +70°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 20V - Supports input rails up to 18V nominal in USB PD, battery-powered DC-DC converters |
| RDS(ON) max | 20.2mΩ @ VGS = 4.5V - Enables <120mW conduction loss at 6.5A output stage current |
| ID max | 21A @ TC = +25°C - Sustains high pulsed load currents in compact power modules |
| VGS(TH) | 0.35–0.95V - Ensures reliable turn-on with 2.5V microcontroller GPIO without level-shifting |
| QG | 6.5nC @ VGS = 4.5V - Reduces gate drive power and switching losses below 2MHz operation |
| RθJC | 8.9°C/W - Allows direct thermal coupling to internal ground planes for high-power density layouts |
| tRR | 149ns - Minimizes reverse recovery energy loss during synchronous rectification |
Pinout & Package
Package: U-DFN2030-6 (Type B), 2.0 mm × 3.0 mm × 0.6 mm, leadless molded plastic with NiPdAu over copper leadframe, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Source 1 | Low-side return path for Channel 1; electrically tied to exposed thermal pad for enhanced heat dissipation |
| 2 | Gate 1 | Control input for Channel 1; ESD-protected with ±10μA IGSS leakage limit |
| 3 | Drain 1 | High-current output node for Channel 1; connected to top-side copper pour for current handling |
| 4 | Drain 2 | High-current output node for Channel 2; symmetrical layout enables balanced current sharing |
| 5 | Gate 2 | Control input for Channel 2; independent drive allows asynchronous or interleaved switching |
| 6 | Source 2 | Low-side return path for Channel 2; internally isolated but thermally coupled to Source 1 via shared pad |
Key Features
| Feature | Design Value |
|---|---|
| Low gate threshold voltage | 0.35–0.95V range ensures robust turn-on from 2.5V logic without external biasing circuitry |
| Ultra-low RDS(ON) at 2.5V drive | 23.5mΩ max @ VGS = 2.5V enables high-efficiency operation in 3.3V-controlled power stages |
| ESD-protected gate | HBM rating ≥2kV per JEDEC JS-001 - eliminates need for external gate protection in space-constrained designs |
| Thermally optimized U-DFN package | 8.9°C/W RθJC and 0.012g mass support rapid thermal response in burst-mode DC-DC applications |
| Halogen- and antimony-free "Green" construction | <900ppm Br, <900ppm Cl, <1000ppm Sb - meets IPC-1752A Class 3 material declaration requirements |
Applications
| Battery Protection Circuit | USB-C Power Delivery Module |
|---|---|
|
Use Scenario: Dual-MOSFET configuration for overcurrent and short-circuit protection in Li-ion battery packs with 2S–3S configurations. IC Role / Device Role / Timing Role: Back-to-back N-channel switch controlling charge/discharge paths; gate timing synchronized to protect against reverse polarity and load dump. Use Value: 20.2mΩ RDS(ON) limits voltage drop to <130mV at 6.5A, preserving battery runtime and thermal margin under fault conditions. |
Use Scenario: Synchronous rectification in 20V/3A USB-C buck converter for portable chargers and power banks. IC Role / Device Role / Timing Role: High-side and low-side switch pair in synchronous buck topology; driven by dedicated controller with 140ns tD(ON) and 245ns tF. Use Value: 6.5nC QG reduces gate driver power consumption by >35% versus comparable 12V MOSFETs, extending system efficiency above 94% at full load. |
| Automotive Body Control Module | Industrial IoT Sensor Node Power Supply |
|
Use Scenario: Load switching for LED lighting and solenoid drivers in 12V automotive subsystems meeting AEC-Q101 stress test requirements. IC Role / Device Role / Timing Role: Dual-channel power switch enabling independent control of two 1A loads; operates across –40°C to +125°C ambient. Use Value: Normalized RDS(ON) variation <1.6× from –55°C to +150°C ensures stable current delivery despite engine bay thermal cycling. |
Use Scenario: Compact 3.3V/1.8V dual-rail power supply for ARM Cortex-M based sensor nodes with intermittent wake-up cycles. IC Role / Device Role / Timing Role: Primary switching element in discrete buck converter; gate driven by low-power PWM generator with 0.35V VGS(TH) margin. Use Value: 0.81W PD rating on standard FR-4 enables >1.5W output without heatsink, reducing BOM count in space-limited edge devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2026UFDE-7 | 26V VDSS, 18mΩ RDS(ON) @ 4.5V, same U-DFN2030-6 package | Higher voltage rating suits 24V industrial inputs; slightly higher gate charge (7.2nC) | Select when system input exceeds 20V or requires extended avalanche ruggedness (EAS = 12mJ vs. 8mJ) |
| Si2302DDS-T1-GE3 | 20V VDSS, 35mΩ RDS(ON) @ 4.5V, SOT-23-6 package, no ESD protection | Larger footprint (3.0 × 2.8 mm), higher thermal resistance (RθJA = 190°C/W), no integrated ESD diode | Choose only for cost-sensitive, non-automotive applications where board space permits larger package and external ESD protection is acceptable |
Compared with DMN2024UFU-13, DMN2026UFDE-7 offers higher voltage headroom at minor gate drive penalty, while Si2302DDS-T1-GE3 trades performance and reliability for lower unit cost in non-critical consumer applications.
Availability
DMN2024UFU-13 is available at Aetrix Electronics and suitable for battery management systems, USB-C power delivery modules, and automotive body control units requiring stable component supply, traceable sourcing, and long-term lifecycle support.
Supply support for DMN2024UFU-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The DMN2024UFU belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, space-constrained DC-DC conversion and load-switching applications in portable, automotive, and industrial electronics.
FAQ
What is the maximum continuous drain current for DMN2024UFU-13 at 70°C case temperature?
The maximum continuous drain current is 17A at TC = +70°C with VGS = 4.5V, as specified in the Absolute Maximum Ratings table. This rating assumes use of the recommended 1-inch square copper plate on FR-4 PCB per Note 6, and accounts for thermal derating beyond the 21A value at 25°C case temperature.
Does DMN2024UFU-13 support gate drive from 2.5V microcontrollers without level shifting?
Yes - its gate threshold voltage range of 0.35–0.95V ensures full enhancement at 2.5V VGS, delivering 14A ID and 23.5mΩ RDS(ON) under that condition. The low VGS(TH) eliminates need for external level shifters in 2.5V/3.3V logic-driven power stages.
How is thermal performance affected by PCB layout for DMN2024UFU-13?
Thermal resistance varies significantly with layout: RθJA is 155°C/W on minimal FR-4 (Note 5) but improves to 73°C/W with a 1-inch square copper plate (Note 6). The exposed thermal pad must be soldered to a solid inner-layer ground plane to achieve the lower value and sustain 17A continuous current.
Is DMN2024UFU-13 qualified for automotive applications?
While not pre-qualified to AEC-Q101 in this specific part number, Diodes Incorporated states that automotive-grade versions with AEC-Q101 qualification, PPAP capability, and IATF 16949 manufacturing are available upon request. Customers requiring automotive compliance should contact Diodes' local representative for qualified variants.
DMN2024UFU-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual) Common Drain
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 20V
- Current - Continuous Drain (Id) @ 25°C:
- 7.5A (Ta), 21A (Tc)
- Rds On (Max) @ Id, Vgs:
- 20.2mOhm @ 6.5A, 4.5V
- Vgs(th) (Max) @ Id:
- 950mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14.8nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 647pF @ 10V
- Power - Max:
- 810mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2030-6 (Type B)
DMN2024UFU-13 FAQ
1.How can I place an order for DMN2024UFU-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN2024UFU-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN2024UFU-13 reliable?
The price and inventory of DMN2024UFU-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN2024UFU-13 is usually 5 days.
3.What payment methods are accepted for DMN2024UFU-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN2024UFU-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN2024UFU-13?
DMN2024UFU-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN2024UFU-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN2024UFU-13?
For technical support, including DMN2024UFU-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN2024UFU-13 requirements.
6.How does Aetrix verify that DMN2024UFU-13 is sourced from the original manufacturer or authorized distributors?
All DMN2024UFU-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN2024UFU-13 meets industry standards.
7.What is the process for return or replacement of DMN2024UFU-13?
All DMN2024UFU-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN2024UFU-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN2024UFU-13 part is unused and in its original packaging.
Return procedure for DMN2024UFU-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMN2024UFU-13 Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
