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Diodes Incorporated DMN2024UFX-7

Part No.:
DMN2024UFX-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
4-VFDFN Exposed Pad
Datasheet:
AetrixDMN2024UFX-7.pdf
Description:
MOSFET 2N-CH 20V 8A 4VDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,355

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Product details

Overview

DMN2024UFX from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in a V-DFN2050-4 package, rated for 20V VDSS, 22 mΩ RDS(ON) @ 4.5V VGS, 8A ID at TC = +25°C, and featuring ESD protection. It serves as a compact, low-loss power switch in space-constrained DC-DC converter output stages and load-switching circuits.

For engineers reviewing the DMN2024UFX datasheet, DMN2024UFX pinout, DMN2024UFX application, or DMN2024UFX equivalent, key selection criteria include its dual-channel layout, 2.0 mm × 5.0 mm footprint, low gate charge (6.5 nC @ 4.5V), fast switching (tR = 140 ns), and thermal resistance of 7.4 °C/W (junction-to-case).

Technical Context

This dual MOSFET integrates two independent N-channel devices sharing a common source terminal configuration per channel (S1/G1/D1 and S2/G2/D2), enabling synchronous rectification or complementary half-bridge operation without external isolation. Its low RDS(ON) at 2.5V gate drive supports direct interfacing with 3.3V logic controllers.

The device uses trench-gate process technology to achieve high cell density and low input capacitance (Ciss = 647 pF), while maintaining robust avalanche capability (EAS = 8 mJ) and body diode recovery performance (tRR = 245 ns, QRR = 149 nC) suitable for hard-switched topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 20 V - Maximum drain-source blocking voltage for 3.3V/5V rail applications
RDS(ON) 22 mΩ @ 4.5V VGS - Enables <170 mW conduction loss at 4A continuous current
ID (max) 8 A @ TC = +25°C - Supports high-current load switching on thermally enhanced PCBs
Qg 6.5 nC @ VGS = 4.5V - Reduces gate driver power demand and switching transition time
RθJC 7.4 °C/W - Allows direct thermal coupling to copper pour for efficient heat extraction
Ciss 647 pF - Limits Miller-induced turn-on risk in high-dV/dt environments
tRR 245 ns - Minimizes reverse recovery losses during freewheeling in buck converters

Pinout & Package

Package: V-DFN2050-4 (2.0 mm × 5.0 mm × 0.8 mm), exposed thermal pad, RoHS-compliant NiPdAu-plated terminals, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
1 (G1) Gate of Channel 1 Independent control input for first N-MOSFET; requires 0.5–1.0 V threshold margin
2 (S1) Source of Channel 1 Common return path for Channel 1; electrically isolated from S2 unless externally tied
3 (D1/D2) Drain of Channel 1 & Channel 2 Shared drain node enables parallel operation or dual-switch configurations
4 (G2) Gate of Channel 2 Independent control input for second N-MOSFET; identical threshold behavior to G1
Exposed Pad Thermal & Electrical Ground Must be soldered to PCB thermal plane; provides primary heat dissipation path and low-inductance ground

Key Features

Feature Design Value
Low RDS(ON) at 2.5V 26 mΩ - Enables full enhancement with 3.3V microcontroller GPIOs without level-shifting
ESD Protection HBM ±2 kV - Eliminates need for external TVS on gate lines in consumer-grade designs
Low Coss 78 pF - Reduces switching loss during turn-off and improves efficiency at >500 kHz
Fast tF 434 ns - Limits cross-conduction risk in synchronous rectifier applications
Green Construction Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb) - Meets IPC-1752A Tier 1 reporting requirements

Applications

USB Power Delivery Switch DC-DC Synchronous Rectifier

Use Scenario: Bidirectional 5–20V USB PD port with overcurrent and short-circuit protection.

IC Role / Device Role / Timing Role: Dual-channel load switch controlling VBUS path and CC line power routing.

Use Value: 22 mΩ RDS(ON) limits voltage drop to <110 mV at 5A, preserving PD negotiation margins.

Use Scenario: Secondary-side rectification in 12V→3.3V buck converter for FPGA core supply.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode in continuous conduction mode.

Use Value: 6.5 nC Qg allows clean 1 MHz switching with minimal gate drive loss and reduced EMI.

Hot-Swap Controller Interface Industrial Sensor Node Power Gate

Use Scenario: Inrush-limited 12V backplane insertion for modular PLC I/O cards.

IC Role / Device Role / Timing Role: High-side power switch controlled by hot-swap controller's gate driver output.

Use Value: 400 Ω Rg enables precise slew-rate control of VDS during soft-start, limiting dI/dt to <10 A/ms.

Use Scenario: Battery-powered environmental sensor node requiring ultra-low standby leakage.

IC Role / Device Role / Timing Role: Main power gate isolating MCU, radio, and analog front-end during sleep mode.

Use Value: 1 µA IDSS at 20V ensures <1 µW quiescent loss, extending 10-year battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2024LSD-13 Same die in SO-8 package; RDS(ON) = 24 mΩ @ 4.5V; higher RθJA (60 °C/W vs. 136 °C/W) Preferred where board-level reworkability and manual assembly are required Select when thermal pad soldering is impractical but higher junction temperature rise is acceptable
AOB2022L Single-channel 20V MOSFET (20 mΩ @ 4.5V); no shared drain; Qg = 5.8 nC; TO-252 package Suitable for discrete half-bridge layouts where channel independence is critical Choose when separate drain routing is needed to avoid shoot-through in bridge configurations

Compared with DMN2024UFX, DMN2024LSD-13 trades compactness and thermal performance for ease of handling and visual inspection, while AOB2022L offers lower gate charge and true channel isolation at the cost of doubled footprint and component count for dual-switch functions.

Availability

DMN2024UFX is available at Aetrix Electronics and suitable for USB-C power delivery modules, industrial hot-swap subsystems, and battery-powered sensor nodes requiring stable component supply across multi-year production cycles.

Supply support for DMN2024UFX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in IATF 16949-certified facilities.

The DMN2024UFX belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, space-constrained power switching in portable and industrial equipment where low gate drive voltage and thermal density are critical.

FAQ

What is the maximum safe operating temperature for DMN2024UFX?

The DMN2024UFX has an absolute maximum junction temperature of +150°C and a storage temperature range of –55°C to +150°C. Under continuous 8A operation with 2.1W power dissipation on a 1-inch² copper pad, junction temperature rise is ~15.5°C above ambient, allowing reliable operation up to +134°C ambient if heatsinking is adequate.

Can DMN2024UFX be used in linear regulator applications?

No - DMN2024UFX is not characterized or guaranteed for linear-mode operation. Its Safe Operating Area (SOA) curve shows only single-pulse capability down to DC at low VDS; sustained linear operation risks thermal runaway due to positive temperature coefficient of RDS(ON) and lack of SOA derating data beyond 10 ms pulses.

Is the exposed thermal pad electrically connected to any internal node?

Yes - the exposed pad is internally connected to the source terminals (S1 and S2) and must be soldered to a PCB copper pour tied to system ground. This connection provides both thermal conduction and low-inductance grounding for high-frequency switching noise suppression.

Does DMN2024UFX meet automotive qualification standards?

DMN2024UFX is not AEC-Q101 qualified. Diodes Incorporated offers automotive-grade variants (e.g., DMN2024UFXQ-7) with PPAP documentation, IATF 16949 manufacturing, and extended temperature testing; standard DMN2024UFX-7 is intended for commercial and industrial applications only.

DMN2024UFX-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
4-VFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
8A (Tc)
Rds On (Max) @ Id, Vgs:
22mOhm @ 4A, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
14.8nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
647pF @ 10V
Power - Max:
920mW
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
V-DFN2050-4

DMN2024UFX-7 FAQ

1.How can I place an order for DMN2024UFX-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN2024UFX-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN2024UFX-7 reliable?

The price and inventory of DMN2024UFX-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN2024UFX-7 is usually 5 days.

3.What payment methods are accepted for DMN2024UFX-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN2024UFX-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN2024UFX-7?

DMN2024UFX-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN2024UFX-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN2024UFX-7?

For technical support, including DMN2024UFX-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN2024UFX-7 requirements.

6.How does Aetrix verify that DMN2024UFX-7 is sourced from the original manufacturer or authorized distributors?

All DMN2024UFX-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN2024UFX-7 meets industry standards.

7.What is the process for return or replacement of DMN2024UFX-7?

All DMN2024UFX-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN2024UFX-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN2024UFX-7 part is unused and in its original packaging.

Return procedure for DMN2024UFX-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN2024UFX-7 Tags

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