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Diodes Incorporated DMN2024UTS-13

Part No.:
DMN2024UTS-13
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
8-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixDMN2024UTS-13.pdf
Description:
MOSFET 2N-CH 20V 6.2A 8TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,367

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Product details

Overview

DMN2024UTS from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in TSSOP-8 package, rated for 20V VDSS, 24mΩ RDS(ON) at VGS = 4.5V, and 6.2A continuous drain current at TA = +25°C. It delivers low gate threshold (0.35–0.95V), ESD-protected gate, and optimized switching performance for compact DC-DC converters in portable battery-powered systems.

For engineers reviewing the DMN2024UTS datasheet, DMN2024UTS pinout, DMN2024UTS application, or DMN2024UTS equivalent, key selection criteria include its dual-N configuration, 2.5V turn-on capability, thermal resistance of 90°C/W (with enhanced pad layout), and suitability for synchronous buck topologies requiring low conduction loss and fast switching transitions.

Technical Context

This device integrates two matched N-channel MOSFETs in a single TSSOP-8 package, enabling half-bridge or dual-switch configurations without discrete pairing. Its low 0.35V minimum VGS(TH) ensures reliable turn-on with 2.5V logic-level drivers, while RDS(ON) remains ≤28mΩ at that voltage - critical for high-efficiency step-down regulation below 3.3V input rails.

The MOSFET features fully characterized dynamic parameters: QG = 6.5nC at VGS = 4.5V, Ciss = 647pF, and tF = 434ns, supporting switching frequencies up to 2MHz in space-constrained power stages. The integrated body diode exhibits VSD = 0.7V at 1A, with QRR = 149nC, indicating moderate reverse recovery behavior suitable for non-critical synchronous rectification.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS20V - Supports input rails up to 18V with margin for transients in USB PD, Li-ion battery, and industrial 12V systems.
RDS(ON) @ VGS = 4.5V24mΩ max - Enables ≤150mW conduction loss at 6.2A, reducing thermal load in thermally constrained PCB layouts.
ID Continuous @ TA = +25°C6.2A - Sustains full-load operation in 3A–5A buck converters without forced airflow or heatsinking.
VGS(TH)0.35–0.95V - Guarantees robust gate drive compatibility with 1.8V/2.5V/3.3V microcontrollers and PMICs.
QG @ VGS = 4.5V6.5nC - Minimizes gate drive power and enables efficient operation with low-side drivers like TC4427 or UCC27517.
RθJA (enhanced layout)90°C/W - Achieved with 1-inch² copper pour; allows 1.39W dissipation before exceeding 150°C junction temperature.
Ciss647pF - Sets Miller plateau timing and influences gate drive strength requirements in high-frequency designs.

Pinout & Package

TSSOP-8 package: 3mm × 4.4mm footprint, 0.65mm pitch, matte tin-plated copper leadframe, JEDEC-compliant moisture sensitivity level 3, UL 94V-0 molded plastic body.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3Source 1 / Drain 1 / Gate 1Left-side MOSFET channel: Pin 1 = S1 (common source tie point), Pin 2 = D1, Pin 3 = G1.
4, 5, 6Source 2 / Drain 2 / Gate 2Right-side MOSFET channel: Pin 4 = S2, Pin 5 = D2, Pin 6 = G2 - independent control, no internal connection between gates or drains.
7, 8Drain 1 / Source 1 (shared)Pins 7 and 8 are internally bonded to D1 and S1 respectively - confirmed by top-view pin diagram and "N2024U" marking orientation per DS40994 Rev. 5-2 p.2.

Key Features

FeatureDesign Value
Dual N-channel topologyEnables compact half-bridge or dual-phase synchronous rectifier implementation without external matching or layout skew.
2.5V logic-compatible VGS(TH)Eliminates need for gate boosters or level shifters when driven directly by low-voltage MCUs or PMICs.
ESD-protected gate (HBM >2kV)Reduces risk of assembly-line damage and improves field reliability in unshielded consumer electronics environments.
Halogen- and antimony-free "Green" constructionMeets IEC 61249-2-21 and IPC-4101D requirements for environmentally restricted electronics manufacturing.
Thermally enhanced RθJA = 90°C/WPermits higher sustained power delivery on standard FR-4 with 1-inch² copper area - verified per Note 6 in datasheet.

Applications

Battery Protection CircuitSynchronous Buck Converter

Use Scenario: Dual-MOSFET back-to-back configuration for Li-ion cell over-discharge and reverse-current blocking in power banks and wearables.

IC Role / Device Role / Timing Role: Acts as bidirectional load switch with independent gate control; body diodes prevent reverse current flow during sleep mode.

Use Value: 24mΩ RDS(ON) limits voltage drop to <150mV at 6A, preserving battery runtime; low VGS(TH) ensures clean turn-off at MCU GPIO low state.

Use Scenario: High-density 3.3V/5V output stage in FPGA or SoC power supplies where board space is limited to <100mm².

IC Role / Device Role / Timing Role: Upper and lower switches in synchronous buck topology operating at 1–2MHz switching frequency.

Use Value: Low QG (6.5nC) and Ciss (647pF) reduce gate drive losses; matched RDS(ON) minimizes duty-cycle asymmetry and improves efficiency above 92%.

USB-C Power Delivery ModuleIndustrial Sensor Node Power Rail

Use Scenario: Input protection and VBUS switching in 20V-rated USB-C PD sink applications with dynamic voltage negotiation.

IC Role / Device Role / Timing Role: Dual-channel switch controlling path from Type-C connector to system rail and protection IC, with independent enable logic.

Use Value: 20V VDSS rating provides 2V margin over USB PD 20V profile; ESD protection prevents latch-up during hot-plug events.

Use Scenario: Always-on 3.3V supply for LoRaWAN or NB-IoT sensor nodes powered by primary lithium batteries (e.g., CR123A).

IC Role / Device Role / Timing Role: Low-quiescent-current load switch enabling firmware-controlled power gating of RF and sensing subsystems.

Use Value: Sub-1V gate threshold allows full turn-on with aging battery voltages down to 2.7V; 1.6A body diode rating supports controlled discharge paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-N-channel logic-level MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2026UTS-13RDS(ON) = 26mΩ @ 4.5V (vs. 24mΩ); identical pinout, package, and VDSS.Slightly higher conduction loss - acceptable where thermal margin exists but not preferred for 6A continuous loads.Select only if DMN2024UTS is unavailable and design tolerates ~8% higher I²R loss at full load.
SI6926ADQ-T1-GE3Single-die dual-N with 22mΩ RDS(ON) @ 4.5V but higher QG (10.5nC); same TSSOP-8 footprint.Higher gate charge increases driver stress and switching loss at >1MHz - less optimal for ultra-high-frequency buck converters.Prefer when lowest RDS(ON) is critical and gate drive capability permits higher QG.

Compared with DMN2024UTS, DMN2026UTS trades minimal RDS(ON) increase for identical drive compatibility, while SI6926ADQ offers lower on-resistance at the cost of higher gate charge - making DMN2024UTS the balanced choice for 1–2MHz, 3–6A synchronous buck stages with 2.5–3.3V logic control.

Availability

DMN2024UTS is available at Aetrix Electronics and suitable for battery management systems, portable DC-DC converters, and USB-C power delivery modules requiring stable component supply across multi-year production cycles.

Supply support for DMN2024UTS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in certified IATF 16949 facilities.

The DMN2024UTS belongs to Diodes' logic-level power MOSFET product line, engineered specifically for high-efficiency, space-constrained DC-DC conversion in battery-powered and USB-powered electronics.

FAQ

What is the maximum safe operating junction temperature for DMN2024UTS?

The absolute maximum junction temperature is +150°C, as specified in the Thermal Characteristics table. Operation must remain within this limit under all conditions - including transient loads - using the provided transient thermal resistance curve (Figure 13) and appropriate PCB copper area per Note 6 (1-inch² pour for RθJA = 90°C/W).

Can DMN2024UTS be used in a synchronous rectifier configuration?

Yes - its low RDS(ON) and matched dual-N structure support synchronous rectification in flyback or buck-boost topologies. However, the body diode's QRR = 149nC and tRR = 245ns require careful dead-time control to avoid shoot-through; gate drive sequencing must ensure turn-off before complementary FET turn-on.

Is the DMN2024UTS pinout compatible with standard TSSOP-8 footprints?

Yes - it uses JEDEC-standard TSSOP-8 mechanical dimensions (3.025mm × 4.425mm, 0.65mm pitch) with pin 1 marked by a dot or notch. The suggested pad layout in Diodes' package outline document (PN: TSSOP-8) matches IPC-7351B density Level A, ensuring reliable reflow soldering on standard SMT lines.

Does DMN2024UTS meet automotive qualification standards?

No - the datasheet states that automotive-qualified versions (AEC-Q101) require explicit contact with Diodes Incorporated or local representatives. Standard DMN2024UTS-13 is rated for industrial temperature range (−55°C to +150°C) but lacks PPAP documentation, IATF 16949 traceability per lot, or AEC-Q101 stress test reporting.

DMN2024UTS-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-TSSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
6.2A (Ta), 15.2A (Tc)
Rds On (Max) @ Id, Vgs:
24mOhm @ 6.5A, 4.5V
Vgs(th) (Max) @ Id:
950mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.9nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
647pF @ 10V
Power - Max:
890mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP

DMN2024UTS-13 FAQ

1.How can I place an order for DMN2024UTS-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN2024UTS-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN2024UTS-13 reliable?

The price and inventory of DMN2024UTS-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN2024UTS-13 is usually 5 days.

3.What payment methods are accepted for DMN2024UTS-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN2024UTS-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN2024UTS-13?

DMN2024UTS-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN2024UTS-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN2024UTS-13?

For technical support, including DMN2024UTS-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN2024UTS-13 requirements.

6.How does Aetrix verify that DMN2024UTS-13 is sourced from the original manufacturer or authorized distributors?

All DMN2024UTS-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN2024UTS-13 meets industry standards.

7.What is the process for return or replacement of DMN2024UTS-13?

All DMN2024UTS-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN2024UTS-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN2024UTS-13 part is unused and in its original packaging.

Return procedure for DMN2024UTS-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN2024UTS-13 Tags

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