Diodes Incorporated DMN21D2UFB-7
- Part No.:
- DMN21D2UFB-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-UFDFN
- Datasheet:
-
DMN21D2UFB-7.pdf
- Description:
- MOSFET BVDSS: 8V~24V X1-DFN1006-
- Quantity:
- Payment:

- Shipping:

Inventory:2,290
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Product details
Overview
DMN21D2UFB-7 from Diodes Incorporated is a 20V N-channel enhancement-mode MOSFET in an ultra-small X1-DFN1006-3 package (1.0 × 0.6 × 0.5 mm), featuring RDS(ON) = 0.99 Ω @ VGS = 4.5 V, VGS(TH) ≤ 1.0 V, and 760 mA continuous drain current at TA = +25°C. It serves as a low-voltage load switch in space-constrained power management circuits such as USB port protection and battery-powered sensor nodes.
For engineers reviewing the DMN21D2UFB-7 datasheet, DMN21D2UFB-7 pinout, DMN21D2UFB-7 application, or DMN21D2UFB-7 equivalent, key selection criteria include gate threshold voltage compatibility with 1.8 V logic, on-resistance at low VGS, thermal resistance under PCB-limited dissipation, and ESD-protected gate integrity in high-density layouts.
Technical Context
This MOSFET employs a planar trench-gate structure optimized for low RDS(ON) while maintaining fast switching (tD(ON) = 3.5 ns, tf = 9.8 ns) and low input capacitance (Ciss = 27.6 pF). Its sub-1V gate threshold enables direct drive from 1.8 V I/O rails without level shifting.
The device integrates an intrinsic body diode with VSD = 0.6 V @ IS = 150 mA and supports bidirectional current flow in analog switch configurations. Thermal performance is defined for two mounting conditions: RθJA = 325 °C/W (minimum pad) and 141 °C/W (enhanced thermal vias), enabling design flexibility across cost- and performance-tier PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 20 V - Maximum drain-source blocking voltage for 1.8–3.3 V system rail switching |
| RDS(ON) | 0.99 Ω @ VGS = 4.5 V - Enables <100 mW conduction loss at 320 mA load current |
| VGS(TH) | ≤1.0 V - Guarantees turn-on with 1.8 V logic; no external gate driver needed |
| ID (continuous) | 760 mA @ TA = +25°C - Sufficient for USB 2.0 port power switches and LED bias control |
| Ciss | 27.6 pF - Limits gate drive energy to <0.41 nC at 4.5 V, reducing MCU GPIO stress |
| RθJA | 141 °C/W (with thermal vias) - Allows 0.57 W power dissipation before junction exceeds 150°C |
| ESD Rating | HBM ±2 kV - Integrated gate protection eliminates need for external TVS in most portable designs |
Pinout & Package
Package: X1-DFN1006-3 - ultra-compact 1.0 mm × 0.6 mm, 0.5 mm max height, 3-terminal leadless plastic package with NiPdAu-plated copper leadframe and UL 94V-0 molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Current return path for N-channel channel | Connected to ground or low-side reference; largest copper area required for thermal conduction |
| 2 (Gate) | Control electrode for channel modulation | ESD-protected input; requires <0.41 nC charge for full turn-on; sensitive to layout-induced ringing |
| 3 (Drain) | High-side current output terminal | Connected to load or supply rail; exposed pad (pin 4) is electrically tied to drain and must be soldered for thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate threshold | VGS(TH) ≤ 1.0 V ensures reliable turn-on with 1.8 V microcontrollers and ASIC I/O |
| Low RDS(ON) at 1.5 V VGS | 3.0 Ω @ VGS = 1.5 V enables operation in deep-sleep modes with minimal voltage headroom |
| Minimal package profile | 0.5 mm max height allows placement under connectors or beneath stacked components in wearables |
| Integrated ESD protection | HBM ±2 kV rating eliminates discrete gate protection diodes in consumer-grade PCBs |
| Green RoHS/REACH compliance | Halogen- and antimony-free, lead-free construction meets IPC-J-STD-609 Class 3 requirements |
Applications
| USB Port Power Switch | Low-Voltage Sensor Bias Control |
|---|---|
Use Scenario: Selective power enable/disable for USB peripheral ports in portable hubs or docking stations. IC Role / Device Role / Timing Role: Low-side load switch controlling VBUS delivery; operates in DC steady-state with occasional toggling during plug/unplug events. Use Value: Sub-1V VGS(TH) guarantees full turn-on from host controller's 1.8 V GPIO; 0.99 Ω RDS(ON) limits voltage drop to <750 mV at 750 mA, preserving USB 2.0 voltage margin. | Use Scenario: Precision current sourcing to MEMS accelerometers or temperature sensors in battery-powered IoT nodes. IC Role / Device Role / Timing Role: Analog switch regulating bias current to sensor elements; operated in linear region for fine current control. Use Value: Low Ciss (27.6 pF) and fast switching minimize transient injection into sensitive analog front-ends; RDS(ON) flatness vs. VGS improves current regulation accuracy. |
| Smartphone Camera Flash LED Driver | Wearable Device Battery Protection |
Use Scenario: Pulse-width modulated current control for white LED flash in compact camera modules. IC Role / Device Role / Timing Role: High-speed switching element in constant-current LED driver topology; switched at 1–10 kHz with <10% duty cycle. Use Value: tf = 9.8 ns and Qgd = 0.06 nC reduce switching losses and EMI generation; 0.5 mm height avoids interference with lens assemblies. | Use Scenario: Overcurrent cutoff in coin-cell–powered hearables or smart patches during fault conditions. IC Role / Device Role / Timing Role: Primary protection switch placed between battery and system PMIC; normally ON, latched OFF during overcurrent detection. Use Value: RDS(ON) = 1.2 Ω @ VGS = 2.5 V ensures <3 mW standby loss; ESD-hardened gate survives repeated handling in automated assembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-voltage load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2016LFG-7 | RDS(ON) = 0.75 Ω @ VGS = 4.5 V; VGS(TH) = 0.5–1.1 V; same X1-DFN1006-3 package | Lower on-resistance improves efficiency in higher-current (>500 mA) loads but increases gate charge (Qg = 0.55 nC) | Select when minimizing conduction loss outweighs gate drive energy constraints |
| AO3400A | RDS(ON) = 0.042 Ω @ VGS = 10 V; VGS(TH) = 0.7–1.4 V; SOT-23 package (3×1.75 mm) | Larger footprint and higher VGS(TH) uncertainty require 3.3 V logic or gate boosting; unsuitable for 1.8 V-only systems | Select only if board space permits SOT-23 and system uses ≥3.3 V control rails |
Compared with DMN2016LFG-7 and AO3400A, DMN21D2UFB-7 uniquely balances ultra-low VGS(TH), compact size, and moderate RDS(ON)-making it optimal for 1.8 V–driven, space-constrained load switching where gate drive simplicity and PCB real estate are prioritized over absolute lowest on-resistance.
Availability
DMN21D2UFB-7 is available at Aetrix Electronics and suitable for USB power switching, wearable sensor biasing, LED flash control, and battery protection circuits requiring stable component supply across high-mix, low-volume production runs.
Supply support for DMN21D2UFB-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This device belongs to Diodes' DFN-series low-voltage MOSFET product line, engineered specifically for space- and power-constrained portable electronics requiring direct 1.8 V logic compatibility and minimal thermal footprint.
FAQ
What is the maximum continuous drain current at 70°C ambient?
The DMN21D2UFB-7 supports 610 mA continuous drain current at TA = +70°C with standard FR-4 mounting (no thermal vias), and 700 mA under pulsed conditions (t < 5 s). Derating follows RθJA = 325 °C/W; exceeding these limits risks junction temperature exceeding 150°C.
Is the exposed thermal pad electrically isolated?
No-the exposed pad (Pin 4, not numbered in top view but present in X1-DFN1006-3 outline) is internally connected to the drain terminal. It must be soldered to a PCB copper pour tied to the drain net to achieve specified RθJA = 141 °C/W and prevent thermal runaway under sustained load.
Can this MOSFET be used in linear (ohmic) mode for analog switching?
Yes-its low RDS(ON) variation across VGS (0.6–3.0 Ω from 1.5–4.5 V) and low Coss (4.0 pF) make it suitable for analog signal routing in low-frequency (<1 MHz), low-voltage (<5 V) applications, provided gate drive remains within ±12 V and power dissipation stays within 0.25 W at TA = +70°C.
Does the "-7" suffix indicate tape-and-reel packaging?
Yes-the "-7" suffix denotes 3,000-unit tape-and-reel packaging in 8 mm wide carrier tape with 4 mm pitch, per Diodes' ordering information. The alternate "-7B" variant uses 2 mm pitch and 10,000-unit reels, but both share identical electrical and thermal specifications.
DMN21D2UFB-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-UFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 760mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 990mOhm @ 100mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.93 nC @ 10 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 27.6 pF @ 16 V
- FET Feature:
- -
- Power Dissipation (Max):
- 380mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X1-DFN1006-3
DMN21D2UFB-7 FAQ
1.How can I place an order for DMN21D2UFB-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN21D2UFB-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN21D2UFB-7 reliable?
The price and inventory of DMN21D2UFB-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN21D2UFB-7 is usually 5 days.
3.What payment methods are accepted for DMN21D2UFB-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN21D2UFB-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN21D2UFB-7?
DMN21D2UFB-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN21D2UFB-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN21D2UFB-7?
For technical support, including DMN21D2UFB-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN21D2UFB-7 requirements.
6.How does Aetrix verify that DMN21D2UFB-7 is sourced from the original manufacturer or authorized distributors?
All DMN21D2UFB-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN21D2UFB-7 meets industry standards.
7.What is the process for return or replacement of DMN21D2UFB-7?
All DMN21D2UFB-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN21D2UFB-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN21D2UFB-7 part is unused and in its original packaging.
Return procedure for DMN21D2UFB-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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