Diodes Incorporated DMN2990UFO-7B

Overview

DMN2990UFO-7B from Diodes Incorporated is a 20V N-channel enhancement-mode MOSFET in a 0.6mm × 0.4mm X2-DFN0604-3 package, featuring 0.99Ω R_DS(ON) at V_GS = 4.5V, 1.0V max gate threshold voltage, and ESD-protected gate. It serves as a low-voltage load switch or analog switch in space-constrained portable power rails and battery management circuits.

For engineers reviewing the DMN2990UFO-7B datasheet, DMN2990UFO-7B pinout, DMN2990UFO-7B application, or DMN2990UFO-7B equivalent, key selection criteria include ultra-low V_GS(TH), sub-1Ω on-resistance at 4.5V drive, thermal resistance of 150°C/W (steady-state), and compatibility with 1.8V logic-level control in compact DFN packaging.

Technical Context

This MOSFET employs planar trench-gate technology optimized for low gate charge (Q_g = 0.41nC) and fast switching (t_D(ON) = 4.5ns, t_F = 12ns), enabling high-efficiency operation in DC-DC converter synchronous rectification and load-switching topologies. Its 1.0V max V_GS(TH) ensures reliable turn-on with 1.8V I/O rails.

The device integrates an intrinsic body diode with V_SD = 0.6V at 150mA and exhibits normalized R_DS(ON) variation ≤1.2× across –55°C to +150°C junction temperature, supporting stable performance in thermally variable environments like wearable electronics and IoT sensor nodes.

Key Specifications

Pinout & Package

Package: X2-DFN0604-3, 0.6mm × 0.4mm × 0.36mm body, 3-terminal leadless plastic package with exposed drain pad for thermal enhancement.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Compared with AO3400A and DMN2021UFA-7, DMN2990UFO-7B uniquely balances ultra-low V_GS(TH), sub-1Ω R_DS(ON) at 4.5V, and minimal 0.24mm² footprint-making it optimal for 1.8V–4.5V logic-driven load switching where space and low-voltage drive are co-constrained.

Availability

DMN2990UFO-7B is available at Aetrix Electronics and suitable for smartphone power switching, USB-C port power delivery, and wearable sensor node power gating requiring stable component supply across high-mix, low-volume production runs.

Supply support for DMN2990UFO-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The DMN2990UFO-7B belongs to Diodes' X2-DFN logic-level MOSFET product line, engineered specifically for ultra-compact, low-voltage power management in portable and wearables applications where gate drive voltage and PCB area are severely limited.

FAQ

What is the maximum continuous drain current for DMN2990UFO-7B at 85°C ambient?

The maximum continuous drain current is 600mA at T_A = +85°C, derated from 750mA at +25°C due to thermal limitations. This value assumes mounting on an FR-4 PCB with 2oz copper and thermal bias to a 1-inch square copper plate, per datasheet Note 5.

Does DMN2990UFO-7B require external gate resistors for ESD protection?

No. The device integrates on-chip ESD protection on the gate terminal rated to ≥2kV HBM, eliminating the need for external series gate resistors in typical portable electronics layouts. External resistors may still be used for ringing suppression in high-speed switching, but not for ESD safety.

Can DMN2990UFO-7B be used in reverse conduction (source-to-drain) mode?

Yes-the intrinsic body diode supports source-to-drain conduction with V_SD = 0.6V typical at 150mA and 25°C. However, reverse current must remain within the pulsed drain current limit of 1.5A (10μs, 1% duty cycle) and thermal limits; sustained reverse conduction requires careful thermal design due to lack of dedicated cathode connection.

Is the X2-DFN0604-3 package compatible with standard reflow profiles for lead-free soldering?

Yes. The package is qualified for IPC/JEDEC J-STD-020 moisture sensitivity Level 1 and supports standard lead-free reflow profiles (peak temperature ≤260°C). Matte tin annealed terminals ensure reliable wetting, and the UL 94V-0 molding compound withstands repeated thermal cycling without delamination.