Diodes Incorporated DMN29M9UFDF-13
- Part No.:
- DMN29M9UFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMN29M9UFDF-13.pdf
- Description:
- MOSFET BVDSS: 25V~30V U-DFN2020-
- Quantity:
- Payment:

- Shipping:

Inventory:3,035
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Product details
Overview
DMN29M9UFDF-13 from Diodes Incorporated is a 20V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, featuring 13.5mΩ RDS(ON) at VGS = 4.5V, 11A continuous drain current at TA = +25°C, and low 0.6mm profile. It serves as a high-efficiency load switch in portable power management circuits requiring compact, low-threshold switching.
For engineers reviewing the DMN29M9UFDF-13 datasheet, DMN29M9UFDF-13 pinout, DMN29M9UFDF-13 application, or DMN29M9UFDF-13 equivalent, key selection criteria include its 1.2V max gate threshold voltage, 60°C/W thermal resistance with enhanced copper pad layout, ESD-protected gate, and compatibility with 1.8V–4.5V logic-level drive in space-constrained DC-DC and battery protection designs.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low RDS(ON) while preserving fast switching performance: tD(ON) = 6ns and tD(OFF) = 48ns at VGS = 4.5V, VDD = 8V, and RG = 1.8Ω. Its gate charge is 7.3nC at VGS = 4.5V, enabling efficient operation in high-frequency synchronous buck converters.
The device integrates an intrinsic body diode with VSD = 0.59V typical at IS = 0.5A and supports avalanche energy of 0.6mJ (L = 0.1mH). Its junction-to-case thermal resistance is 8.4°C/W, and it operates across –55°C to +150°C, qualified per J-STD-020 Level 1 moisture sensitivity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 20V - Maximum drain-source blocking voltage for 3.3V/5V rail switching without derating |
| RDS(ON) | 13.5mΩ @ VGS = 4.5V - Enables ≤50mW conduction loss at 5A, critical for thermally constrained PCBs |
| ID (TA = +25°C) | 11A - Sustains full-load current in USB-C PD sink switches and PMIC load switches |
| VGS(TH) | 0.5–1.2V - Ensures reliable turn-on with 1.8V GPIO or low-voltage microcontroller outputs |
| Qg | 7.3nC @ VGS = 4.5V - Reduces gate driver power demand and switching losses in 1–2MHz DC-DC stages |
| RθJA | 60°C/W - Achievable with 1-inch² 2oz copper pad; enables 2W dissipation at ≤85°C ambient |
| Ciss | 655pF - Limits Miller effect in high-side configurations; supports clean gate drive with <10Ω series resistance |
Pinout & Package
U-DFN2020-6 (Type F) package: 2.0mm × 2.0mm footprint, 0.6mm height, NiPdAu-plated copper leadframe, UL 94V-0 molding compound, and moisture sensitivity Level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Top View) | Source | Primary current return path; connected to ground plane or low-impedance source node |
| Pin 2 | Gate | Control input; requires ESD-safe routing and <10Ω series resistor to suppress ringing |
| Pin 3 | Drain | High-side or low-side power path; ties to load or supply rail; thermally coupled to exposed pad |
| Pin 4 | Source | Second source connection; paralleled with Pin 1 to reduce source inductance in high-di/dt switching |
| Pin 5 | Drain | Second drain connection; paralleled with Pin 3 to lower RDS(ON) and improve thermal spreading |
| Pin 6 (Exposed Pad) | Thermal / Source | Internally tied to source; must be soldered to ≥100mm² copper pour for optimal 60°C/W RθJA |
Key Features
| Feature | Design Value |
|---|---|
| Low-profile 0.6mm height | Enables use in ultra-thin consumer devices (e.g., earbuds, wearables) where Z-height is limited to <1.0mm |
| 4mm² PCB footprint | Reduces board area by >40% vs. SO-8 or TSOP-6; fits dense mobile PMIC layouts |
| ESD-protected gate | HBM rating ≥2kV (per internal qualification); eliminates need for external gate protection in assembly |
| Lead-free & halogen-free | Complies with RoHS 3 (2015/863/EU) and Diodes' "Green" definition (<900ppm Br+Cl, <1000ppm Sb) |
| Low VGS(TH) range | 0.5–1.2V ensures robust turn-on with 1.2V–1.8V logic families (e.g., ARM Cortex-M0+/M4 GPIO) |
Applications
| USB-C Power Delivery Sink Switch | Smartphone Battery Protection IC Interface |
|---|---|
Use Scenario: Controls 5–20V input path to USB-C port controller and PD PHY during hot-plug events. IC Role / Device Role / Timing Role: Low-side load switch enabling/disabling VBUS under firmware control with <100μs response. Use Value: 13.5mΩ RDS(ON) limits voltage drop to <68mV at 5A, preserving PD negotiation margin; 0.6mm height avoids interference with flex cable routing. |
Use Scenario: Isolates battery cell from system load during overcurrent or thermal fault conditions. IC Role / Device Role / Timing Role: Primary protection FET driven by battery fuel gauge IC's ALERT output. Use Value: 1.2V max VGS(TH) guarantees activation from 1.8V fuel gauge I/O; 60°C/W RθJA sustains 10A fault current for 100ms without thermal shutdown. |
| Wireless Earbud Charging Case Load Switch | IoT Sensor Node Power Gating |
Use Scenario: Enables/disables charging current to earbud battery during lid-open/closed detection. IC Role / Device Role / Timing Role: High-side switch controlled by hall-effect sensor output. Use Value: 4mm² footprint fits narrow 12mm-wide charging case PCB; 7.3nC Qg allows direct drive from 3.3V MCU GPIO without buffer. |
Use Scenario: Powers down BLE SoC and environmental sensors between 10s measurement intervals. IC Role / Device Role / Timing Role: System-level power gate managed by RTOS scheduler via GPIO. Use Value: 0.5V min VGS(TH) ensures turn-on even with brown-out at 1.6V supply; 10.4mΩ typ RDS(ON) keeps quiescent loss <17μW at 40μA sleep current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2026UFD-7 | RDS(ON) = 16.5mΩ @ VGS = 4.5V; higher 1.4V max VGS(TH); same U-DFN2020-6 package | Less suitable for 1.8V logic drive; requires stronger gate pull-up for reliable turn-on | Select when cost priority outweighs 2.5mΩ RDS(ON) penalty and 1.2V VGS(TH) margin is not required |
| AO3414 | RDS(ON) = 50mΩ @ VGS = 4.5V; SO-23 package (3.0mm × 1.4mm); no ESD protection on gate | Larger footprint and higher conduction loss limit use to non-portable, low-current applications | Choose only for legacy SO-23 board compatibility where 13.5mΩ performance and 0.6mm height are not critical |
Compared with DMN29M9UFDF-13, DMN2026UFD-7 trades 2.5mΩ higher RDS(ON) for marginal cost reduction but risks marginal turn-on with weak 1.8V drivers, while AO3414's SO-23 form factor and 50mΩ RDS(ON) make it unsuitable for space- or efficiency-sensitive portable designs.
Availability
DMN29M9UFDF-13 is available at Aetrix Electronics and suitable for USB-C power delivery systems, smartphone battery protection circuits, wireless earbud charging cases, and IoT sensor node power gating requiring stable component supply and consistent parametric performance.
Supply support for DMN29M9UFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This MOSFET belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, low-voltage load switching in portable and battery-powered electronics where size, thermal performance, and logic-level compatibility are critical.
FAQ
What is the maximum continuous drain current at 70°C ambient?
The DMN29M9UFDF-13 supports 8.8A continuous drain current at TA = +70°C with 1-inch² 2oz copper pad layout (RθJA = 60°C/W), verified per datasheet Note 6. Derating follows linear interpolation between 11A at 25°C and 8.8A at 70°C, reaching zero at ~125°C ambient under those thermal conditions.
Is the exposed pad electrically isolated or internally connected?
The exposed pad (Pin 6) is internally connected to the source terminal and must be soldered to a PCB copper pour tied to the source net. It is not electrically isolated and serves both thermal conduction and electrical return functions-failure to connect it degrades RθJA from 60°C/W to 95°C/W and increases RDS(ON) by up to 15% due to elevated junction temperature.
Does this MOSFET require external gate protection against ESD?
No. The DMN29M9UFDF-13 integrates on-chip gate protection diodes rated for ≥2kV HBM ESD (per Diodes' internal qualification), eliminating the need for external TVS or RC networks in standard handling and board-level environments. This is confirmed in the "Features" section and "Equivalent Circuit" diagram of the datasheet.
Can it operate reliably with a 1.8V gate drive?
Yes. With a guaranteed VGS(TH) maximum of 1.2V and typical RDS(ON) of 14.6mΩ at VGS = 1.8V/ID = 1A, the device delivers usable on-resistance at 1.8V. At 1.8V drive, it sustains ≥1A continuous current with <27mW conduction loss-validated in Figure 4 and Table "Electrical Characteristics" of DS42329 Rev. 3-2.
DMN29M9UFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 11A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 13.5mOhm @ 5A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14.6 nC @ 10 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 655 pF @ 8 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMN29M9UFDF-13 FAQ
1.How can I place an order for DMN29M9UFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN29M9UFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN29M9UFDF-13 reliable?
The price and inventory of DMN29M9UFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN29M9UFDF-13 is usually 5 days.
3.What payment methods are accepted for DMN29M9UFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN29M9UFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN29M9UFDF-13?
DMN29M9UFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN29M9UFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN29M9UFDF-13?
For technical support, including DMN29M9UFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN29M9UFDF-13 requirements.
6.How does Aetrix verify that DMN29M9UFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMN29M9UFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN29M9UFDF-13 meets industry standards.
7.What is the process for return or replacement of DMN29M9UFDF-13?
All DMN29M9UFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN29M9UFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN29M9UFDF-13 part is unused and in its original packaging.
Return procedure for DMN29M9UFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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