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Diodes Incorporated DMN3006SCA6-7

Part No.:
DMN3006SCA6-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
6-SMD, No Lead
Datasheet:
AetrixDMN3006SCA6-7.pdf
Description:
MOSFET 2N-CH 30V 13A X4-DSN3519
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,290

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Product details

Overview

DMN3006SCA6-7 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in a 6-pin CSP package (X4-DSN3519-6), optimized for low on-resistance and fast switching in compact power management circuits. It delivers 4.8 mΩ RSS(ON) at VGS = 8 V, 13.0 A continuous source current at +25°C, and operates up to 30 V VSSS, targeting battery protection and load-switching functions in space-constrained portable electronics.

For engineers reviewing the DMN3006SCA6-7 datasheet, DMN3006SCA6-7 pinout, DMN3006SCA6-7 application, or DMN3006SCA6-7 equivalent, key selection criteria include its ultra-low profile (0.11 mm height), dual-source/dual-drain configuration, gate ESD protection, and thermal resistance of 68 °C/W under recommended PCB layout - critical for high-density battery management ICs and USB-C power delivery modules.

Technical Context

This device integrates two matched N-channel MOSFETs in a single chip-scale package with shared drain terminals (pins 3 & 4) and independent gate/source pairs (G1/S1 and G2/S2). Its design enables synchronous rectification or dual-path load switching without external paralleling.

It features a gate threshold voltage range of 1.3–2.2 V, supports logic-level drive down to 4.5 V, and maintains RSS(ON) stability across –55°C to +150°C junction temperature - verified by characterization curves for VGS(TH) and RSS(ON) vs. TJ.

Key Specifications

Parameter Value and Actual Design Meaning
VSSS 30 V - Maximum source-source blocking voltage; defines safe operating range in 3.3 V–24 V battery systems.
RSS(ON) @ VGS = 8 V 4.8 mΩ - Enables <100 mW conduction loss at 10 A, supporting high-efficiency load switching in portable devices.
IS Continuous @ +25°C 13.0 A - Sustained current capability with thermal derating to 10.5 A at +70°C ambient on FR-4 board.
Qg 17.7 nC - Low total gate charge reduces driver power and switching losses in 1–2 MHz DC-DC applications.
RθJA (min pad) 68 °C/W - Achievable with manufacturer-recommended copper area; enables 1.8 W power dissipation at +25°C ambient.
Package X4-DSN3519-6 - 3.5 mm × 1.9 mm footprint, 0.11 mm height; compatible with fine-pitch automated assembly and ultra-thin end equipment.

Pinout & Package

Package: X4-DSN3519-6 - ultra-thin chip-scale package with NiPdAu-plated terminals, moisture sensitivity level 1, and 0.0012 g mass.

Pin/Terminal Circuit Role Design Meaning
1 Gate 1 Independent control input for first MOSFET channel; accepts 0–20 V gate drive with ±10 µA leakage.
2 Source 1 Return path for channel 1; electrically isolated from Source 2 for dual-switch configurations.
3 Drain Common drain node shared by both MOSFETs; connects to high-side power rail or battery cathode.
4 Drain Redundant drain terminal for enhanced current handling and thermal spreading; tied internally to Pin 3.
5 Source 2 Return path for second MOSFET channel; enables independent load control or current sensing per channel.
6 Gate 2 Independent control input for second MOSFET channel; identical electrical specs to Gate 1.

Key Features

Feature Design Value
Dual N-channel topology Two matched MOSFETs in one die enable redundant load switching or independent path control without discrete pairing.
Ultra-low profile (0.11 mm) Supports <0.6 mm total Z-height in slim smartphones, wearables, and hearing aids where vertical space is constrained.
ESD-protected gate HBM rating ≥2 kV (implied by "ESD Protection of Gate" in Features section); reduces risk of assembly damage and field failure.
Lead-free & halogen-free Complies with RoHS 3 (2015/863/EU) and Diodes' "Green" standard (<900 ppm Br+Cl, <1000 ppm Sb); meets automotive and medical supply chain requirements.
Low RSS(ON) @ 4.5 V 6.3 mΩ at VGS = 4.5 V ensures full enhancement with standard logic-level drivers, eliminating need for gate boosters.

Applications

Battery Protection Circuit USB-C Load Switch

Use Scenario: Overcurrent and short-circuit protection in single-cell Li-ion battery packs for tablets and power banks.

IC Role / Device Role / Timing Role: Dual-MOSFET back-to-back configuration blocks reverse current and isolates faults during charging/discharging cycles.

Use Value: 4.8 mΩ RSS(ON) minimizes voltage drop across protection FETs, preserving battery runtime and enabling accurate current sensing.

Use Scenario: Power path control for USB-C ports in docking stations and multi-port chargers.

IC Role / Device Role / Timing Role: High-side load switch managing 3 A–5 A VBUS delivery with fast turn-on/turn-off (tD(ON) = 5.6 ns, tF = 20.9 ns).

Use Value: Low Qg (17.7 nC) and fast switching reduce power loss during hot-plug events and improve system responsiveness.

Smartphone Power Management Wireless Earbud Charging Case

Use Scenario: Dynamic load switching between PMIC rails and peripheral subsystems (e.g., display backlight, camera flash).

IC Role / Device Role / Timing Role: Dual-channel switch enabling independent power gating of two 3.3 V domains with minimal cross-talk.

Use Value: Independent gate terminals (Pins 1 & 6) allow separate PWM control, supporting staggered sequencing and leakage reduction in sleep modes.

Use Scenario: Battery isolation and charging control in compact earbud cases with integrated Qi receiver and dual-battery storage.

IC Role / Device Role / Timing Role: Compact dual-FET manages main battery discharge and earbud compartment charging with shared drain architecture.

Use Value: 3.5 mm × 1.9 mm footprint and 0.11 mm height fit within <100 mm³ case volume constraints while delivering 11.5 A at 4.5 V drive.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-N-channel load switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN3025LFG-7 Single N-channel, 2.5 mΩ @ 10 V, 17 A IS, same X4-DSN3519-6 package but no dual-gate structure. Lacks independent channel control; suitable only for single-path switching where redundancy or sequencing is unnecessary. Select when higher current per channel is needed and dual-gate functionality is not required.
AOB2036L SO-8 packaged dual N-channel, 3.6 mΩ @ 10 V, 20 A per channel, RθJA = 40 °C/W - larger footprint (4.9 mm × 6.0 mm), 1.05 mm height. Better thermal performance but incompatible with ultra-thin designs; requires rework of PCB layout and assembly process. Select when thermal headroom is critical and board space allows SO-8 placement.

Compared with DMN3006SCA6-7, DMN3025LFG-7 offers lower RSS(ON) but forfeits dual-channel flexibility, while AOB2036L provides superior power handling and cooling at the cost of 10× greater Z-height and 3× larger footprint - making DMN3006SCA6-7 optimal for miniaturized, dual-rail battery systems.

Availability

DMN3006SCA6-7 is available at Aetrix Electronics and suitable for battery protection, USB-C load switching, and smartphone power management requiring stable component supply and consistent lead-free compliance.

Supply support for DMN3006SCA6-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions, with design centers in Asia, Europe, and the U.S., and manufacturing in China, Taiwan, and the Philippines.

This part belongs to Diodes' DSN-series ultra-thin power MOSFET product line, engineered specifically for space-constrained portable electronics requiring high current density, low-profile packaging, and robust gate reliability.

FAQ

What is the maximum continuous drain current for DMN3006SCA6-7 at +70°C ambient?

At +70°C ambient temperature and VGS = 8 V, the continuous source current is rated at 10.5 A. This value is derived from thermal derating of the 13.0 A +25°C rating using the specified RθJA = 68 °C/W and maximum junction temperature of +150°C, validated per JEDEC test conditions on FR-4 PCB with minimum recommended copper area.

Can DMN3006SCA6-7 be used in a back-to-back configuration for AC blocking?

Yes - its dual N-channel structure with independent gates and sources enables true back-to-back connection (Source1–Drain–Source2) to block bidirectional current flow, commonly used in battery protection ICs. The matched characteristics ensure balanced voltage sharing, and the 30 V VSSS rating supports up to ±15 V differential blocking.

Is the X4-DSN3519-6 package compatible with standard reflow profiles for lead-free soldering?

Yes - the package uses NiPdAu or NiAu terminal finish and is qualified per MIL-STD-202, Method 208 for solderability. It complies with IPC/JEDEC J-STD-020 moisture sensitivity level 1, allowing unlimited floor life and compatibility with standard Pb-free reflow profiles (peak 260°C, 60-second duration above 217°C).

Does DMN3006SCA6-7 integrate body diode reverse recovery protection?

No - it does not include active reverse recovery control circuitry. However, its intrinsic body diode exhibits typical forward voltage of 0.95 V at 5 A and IS = 5 A, with reverse recovery characteristics defined by Ciss = 2235 pF and Crss = 274 pF, suitable for non-synchronous buck or linear regulator applications where controlled commutation is managed externally.

DMN3006SCA6-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-SMD, No Lead
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual) Common Drain
FET Feature:
-
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
13A (Ta)
Rds On (Max) @ Id, Vgs:
5.5mOhm @ 5A, 10V
Vgs(th) (Max) @ Id:
2.2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
17.7nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
2235pF @ 15V
Power - Max:
800mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X4-DSN3519-6

DMN3006SCA6-7 FAQ

1.How can I place an order for DMN3006SCA6-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN3006SCA6-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN3006SCA6-7 reliable?

The price and inventory of DMN3006SCA6-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3006SCA6-7 is usually 5 days.

3.What payment methods are accepted for DMN3006SCA6-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3006SCA6-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN3006SCA6-7?

DMN3006SCA6-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN3006SCA6-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN3006SCA6-7?

For technical support, including DMN3006SCA6-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3006SCA6-7 requirements.

6.How does Aetrix verify that DMN3006SCA6-7 is sourced from the original manufacturer or authorized distributors?

All DMN3006SCA6-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3006SCA6-7 meets industry standards.

7.What is the process for return or replacement of DMN3006SCA6-7?

All DMN3006SCA6-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3006SCA6-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN3006SCA6-7 part is unused and in its original packaging.

Return procedure for DMN3006SCA6-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN3006SCA6-7 Tags

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