Diodes Incorporated DMN3006SCA6-7
- Part No.:
- DMN3006SCA6-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 6-SMD, No Lead
- Datasheet:
-
DMN3006SCA6-7.pdf
- Description:
- MOSFET 2N-CH 30V 13A X4-DSN3519
- Quantity:
- Payment:

- Shipping:

Inventory:5,290
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMN3006SCA6-7 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in a 6-pin CSP package (X4-DSN3519-6), optimized for low on-resistance and fast switching in compact power management circuits. It delivers 4.8 mΩ RSS(ON) at VGS = 8 V, 13.0 A continuous source current at +25°C, and operates up to 30 V VSSS, targeting battery protection and load-switching functions in space-constrained portable electronics.
For engineers reviewing the DMN3006SCA6-7 datasheet, DMN3006SCA6-7 pinout, DMN3006SCA6-7 application, or DMN3006SCA6-7 equivalent, key selection criteria include its ultra-low profile (0.11 mm height), dual-source/dual-drain configuration, gate ESD protection, and thermal resistance of 68 °C/W under recommended PCB layout - critical for high-density battery management ICs and USB-C power delivery modules.
Technical Context
This device integrates two matched N-channel MOSFETs in a single chip-scale package with shared drain terminals (pins 3 & 4) and independent gate/source pairs (G1/S1 and G2/S2). Its design enables synchronous rectification or dual-path load switching without external paralleling.
It features a gate threshold voltage range of 1.3–2.2 V, supports logic-level drive down to 4.5 V, and maintains RSS(ON) stability across –55°C to +150°C junction temperature - verified by characterization curves for VGS(TH) and RSS(ON) vs. TJ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VSSS | 30 V - Maximum source-source blocking voltage; defines safe operating range in 3.3 V–24 V battery systems. |
| RSS(ON) @ VGS = 8 V | 4.8 mΩ - Enables <100 mW conduction loss at 10 A, supporting high-efficiency load switching in portable devices. |
| IS Continuous @ +25°C | 13.0 A - Sustained current capability with thermal derating to 10.5 A at +70°C ambient on FR-4 board. |
| Qg | 17.7 nC - Low total gate charge reduces driver power and switching losses in 1–2 MHz DC-DC applications. |
| RθJA (min pad) | 68 °C/W - Achievable with manufacturer-recommended copper area; enables 1.8 W power dissipation at +25°C ambient. |
| Package | X4-DSN3519-6 - 3.5 mm × 1.9 mm footprint, 0.11 mm height; compatible with fine-pitch automated assembly and ultra-thin end equipment. |
Pinout & Package
Package: X4-DSN3519-6 - ultra-thin chip-scale package with NiPdAu-plated terminals, moisture sensitivity level 1, and 0.0012 g mass.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate 1 | Independent control input for first MOSFET channel; accepts 0–20 V gate drive with ±10 µA leakage. |
| 2 | Source 1 | Return path for channel 1; electrically isolated from Source 2 for dual-switch configurations. |
| 3 | Drain | Common drain node shared by both MOSFETs; connects to high-side power rail or battery cathode. |
| 4 | Drain | Redundant drain terminal for enhanced current handling and thermal spreading; tied internally to Pin 3. |
| 5 | Source 2 | Return path for second MOSFET channel; enables independent load control or current sensing per channel. |
| 6 | Gate 2 | Independent control input for second MOSFET channel; identical electrical specs to Gate 1. |
Key Features
| Feature | Design Value |
|---|---|
| Dual N-channel topology | Two matched MOSFETs in one die enable redundant load switching or independent path control without discrete pairing. |
| Ultra-low profile (0.11 mm) | Supports <0.6 mm total Z-height in slim smartphones, wearables, and hearing aids where vertical space is constrained. |
| ESD-protected gate | HBM rating ≥2 kV (implied by "ESD Protection of Gate" in Features section); reduces risk of assembly damage and field failure. |
| Lead-free & halogen-free | Complies with RoHS 3 (2015/863/EU) and Diodes' "Green" standard (<900 ppm Br+Cl, <1000 ppm Sb); meets automotive and medical supply chain requirements. |
| Low RSS(ON) @ 4.5 V | 6.3 mΩ at VGS = 4.5 V ensures full enhancement with standard logic-level drivers, eliminating need for gate boosters. |
Applications
| Battery Protection Circuit | USB-C Load Switch |
|---|---|
Use Scenario: Overcurrent and short-circuit protection in single-cell Li-ion battery packs for tablets and power banks. IC Role / Device Role / Timing Role: Dual-MOSFET back-to-back configuration blocks reverse current and isolates faults during charging/discharging cycles. Use Value: 4.8 mΩ RSS(ON) minimizes voltage drop across protection FETs, preserving battery runtime and enabling accurate current sensing. |
Use Scenario: Power path control for USB-C ports in docking stations and multi-port chargers. IC Role / Device Role / Timing Role: High-side load switch managing 3 A–5 A VBUS delivery with fast turn-on/turn-off (tD(ON) = 5.6 ns, tF = 20.9 ns). Use Value: Low Qg (17.7 nC) and fast switching reduce power loss during hot-plug events and improve system responsiveness. |
| Smartphone Power Management | Wireless Earbud Charging Case |
Use Scenario: Dynamic load switching between PMIC rails and peripheral subsystems (e.g., display backlight, camera flash). IC Role / Device Role / Timing Role: Dual-channel switch enabling independent power gating of two 3.3 V domains with minimal cross-talk. Use Value: Independent gate terminals (Pins 1 & 6) allow separate PWM control, supporting staggered sequencing and leakage reduction in sleep modes. |
Use Scenario: Battery isolation and charging control in compact earbud cases with integrated Qi receiver and dual-battery storage. IC Role / Device Role / Timing Role: Compact dual-FET manages main battery discharge and earbud compartment charging with shared drain architecture. Use Value: 3.5 mm × 1.9 mm footprint and 0.11 mm height fit within <100 mm³ case volume constraints while delivering 11.5 A at 4.5 V drive. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LFG-7 | Single N-channel, 2.5 mΩ @ 10 V, 17 A IS, same X4-DSN3519-6 package but no dual-gate structure. | Lacks independent channel control; suitable only for single-path switching where redundancy or sequencing is unnecessary. | Select when higher current per channel is needed and dual-gate functionality is not required. |
| AOB2036L | SO-8 packaged dual N-channel, 3.6 mΩ @ 10 V, 20 A per channel, RθJA = 40 °C/W - larger footprint (4.9 mm × 6.0 mm), 1.05 mm height. | Better thermal performance but incompatible with ultra-thin designs; requires rework of PCB layout and assembly process. | Select when thermal headroom is critical and board space allows SO-8 placement. |
Compared with DMN3006SCA6-7, DMN3025LFG-7 offers lower RSS(ON) but forfeits dual-channel flexibility, while AOB2036L provides superior power handling and cooling at the cost of 10× greater Z-height and 3× larger footprint - making DMN3006SCA6-7 optimal for miniaturized, dual-rail battery systems.
Availability
DMN3006SCA6-7 is available at Aetrix Electronics and suitable for battery protection, USB-C load switching, and smartphone power management requiring stable component supply and consistent lead-free compliance.
Supply support for DMN3006SCA6-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions, with design centers in Asia, Europe, and the U.S., and manufacturing in China, Taiwan, and the Philippines.
This part belongs to Diodes' DSN-series ultra-thin power MOSFET product line, engineered specifically for space-constrained portable electronics requiring high current density, low-profile packaging, and robust gate reliability.
FAQ
What is the maximum continuous drain current for DMN3006SCA6-7 at +70°C ambient?
At +70°C ambient temperature and VGS = 8 V, the continuous source current is rated at 10.5 A. This value is derived from thermal derating of the 13.0 A +25°C rating using the specified RθJA = 68 °C/W and maximum junction temperature of +150°C, validated per JEDEC test conditions on FR-4 PCB with minimum recommended copper area.
Can DMN3006SCA6-7 be used in a back-to-back configuration for AC blocking?
Yes - its dual N-channel structure with independent gates and sources enables true back-to-back connection (Source1–Drain–Source2) to block bidirectional current flow, commonly used in battery protection ICs. The matched characteristics ensure balanced voltage sharing, and the 30 V VSSS rating supports up to ±15 V differential blocking.
Is the X4-DSN3519-6 package compatible with standard reflow profiles for lead-free soldering?
Yes - the package uses NiPdAu or NiAu terminal finish and is qualified per MIL-STD-202, Method 208 for solderability. It complies with IPC/JEDEC J-STD-020 moisture sensitivity level 1, allowing unlimited floor life and compatibility with standard Pb-free reflow profiles (peak 260°C, 60-second duration above 217°C).
Does DMN3006SCA6-7 integrate body diode reverse recovery protection?
No - it does not include active reverse recovery control circuitry. However, its intrinsic body diode exhibits typical forward voltage of 0.95 V at 5 A and IS = 5 A, with reverse recovery characteristics defined by Ciss = 2235 pF and Crss = 274 pF, suitable for non-synchronous buck or linear regulator applications where controlled commutation is managed externally.
DMN3006SCA6-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-SMD, No Lead
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual) Common Drain
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 13A (Ta)
- Rds On (Max) @ Id, Vgs:
- 5.5mOhm @ 5A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 17.7nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2235pF @ 15V
- Power - Max:
- 800mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X4-DSN3519-6
DMN3006SCA6-7 FAQ
1.How can I place an order for DMN3006SCA6-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3006SCA6-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3006SCA6-7 reliable?
The price and inventory of DMN3006SCA6-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3006SCA6-7 is usually 5 days.
3.What payment methods are accepted for DMN3006SCA6-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3006SCA6-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3006SCA6-7?
DMN3006SCA6-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3006SCA6-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3006SCA6-7?
For technical support, including DMN3006SCA6-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3006SCA6-7 requirements.
6.How does Aetrix verify that DMN3006SCA6-7 is sourced from the original manufacturer or authorized distributors?
All DMN3006SCA6-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3006SCA6-7 meets industry standards.
7.What is the process for return or replacement of DMN3006SCA6-7?
All DMN3006SCA6-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3006SCA6-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3006SCA6-7 part is unused and in its original packaging.
Return procedure for DMN3006SCA6-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMN3006SCA6-7 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

