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Diodes Incorporated DMN3009SFGQ-13

Part No.:
DMN3009SFGQ-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixDMN3009SFGQ-13.pdf
Description:
MOSFET N-CH 30V 16A PWRDI3333
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,352

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Product details

Overview

DMN3009SFGQ-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in PowerDI3333-8 package, qualified to AEC-Q101 and PPAP-capable for automotive power management. It delivers 45A continuous drain current at TC = +25°C, 5.5mΩ RDS(on) @ VGS = 10V, and 9mΩ @ VGS = 4.5V - enabling high-efficiency DC-DC conversion in engine control units and battery protection circuits.

For engineers reviewing the DMN3009SFGQ-13 datasheet, DMN3009SFGQ-13 pinout, DMN3009SFGQ-13 application, or DMN3009SFGQ-13 equivalent, key selection criteria include its AEC-Q101 qualification, low RDS(on) at 4.5V gate drive, thermal resistance of 7.8°C/W (junction-to-case), and suitability for space-constrained automotive power stages requiring <10mΩ on-resistance and >30A pulsed capability.

Technical Context

This MOSFET employs a trench-gate silicon process optimized for low conduction loss and fast switching in 12V/24V automotive systems. Its gate threshold voltage (1.0–2.5V) ensures robust turn-on with standard logic-level drivers, while its 2,000pF input capacitance and 42nC total gate charge at 10V support stable PWM operation up to 500kHz in synchronous buck converters.

The device integrates a body diode with 0.68V forward voltage at 1A and 15ns reverse recovery time, enabling efficient freewheeling in high-frequency topologies. Its 55mJ single-pulse avalanche energy rating and 33A IAS support transient overvoltage resilience in load-dump and inductive switching scenarios.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 30V - Maximum drain-source blocking voltage compatible with 24V automotive systems including load-dump transients.
RDS(on) @ VGS = 10V 5.5mΩ - Enables ≤1.5W conduction loss at 45A, reducing heatsink requirements in compact ECUs.
RDS(on) @ VGS = 4.5V 9mΩ - Ensures full enhancement with 3.3V/5V microcontroller GPIOs without level-shifting.
ID Continuous @ TC = +25°C 45A - Supports high-current motor drivers and battery disconnect switches in ADAS modules.
RθJC 7.8°C/W - Allows direct thermal coupling to PCB copper pour or metal-core board for passive cooling.
Qg @ VGS = 10V 42nC - Matches standard gate drivers (e.g., UCC27531) for <30ns turn-off delay in 200kHz+ converters.
EAS 55mJ - Withstands repetitive inductive energy spikes in solenoid and fuel injector drivers.

Pinout & Package

Package: PowerDI3333-8 - thermally enhanced 8-pin surface-mount package with exposed drain pad for low RθJC and high-power density mounting.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 4, 5, 6, 7, 8 (Drain) Drain (common connection) All pins 1–8 are internally connected to the drain terminal and exposed copper pad - provides parallel current paths and minimal thermal impedance to PCB ground plane.
Source (pins S1–S4) Source (internal connection) Four dedicated source terminals (visible as inner pins in top view) reduce source inductance and improve gate-drive stability in high-di/dt applications.
Gate (pin G) Gate input Single gate terminal (pin 1 indicator adjacent) accepts standard CMOS/TTL logic levels; layout requires <5mm trace length to minimize ringing.

Key Features

Feature Design Value
AEC-Q101 qualified & PPAP capable Validated for automotive production use with full change control, IATF 16949 manufacturing, and zero-defect screening.
Low RDS(on) at 4.5V drive 9mΩ enables direct interface with 3.3V/5V MCUs in battery management ICs without external gate drivers.
Thermally optimized PowerDI3333-8 7.8°C/W RθJC allows 45A operation with only 1-inch² 2oz copper thermal pad - no heatsink required.
Green, halogen-free construction <900ppm Br/Cl and <1000ppm Sb meets automotive OEM environmental compliance mandates (e.g., BMW GS95003).
Fast body diode recovery 15ns tRR and 6nC QRR minimize shoot-through risk and switching losses in synchronous rectification.

Applications

Engine Control Unit (ECU) Power Stage Battery Disconnect Switch

Use Scenario: High-side switch controlling 12V main power rail to fuel injectors and ignition coils.

IC Role / Device Role / Timing Role: Primary power switch handling 30A peak loads with <100ns switching transitions under ECU PWM control.

Use Value: 5.5mΩ RDS(on) limits conduction loss to <4.5W at 30A, eliminating active cooling while meeting ASIL-B thermal derating requirements.

Use Scenario: Bidirectional isolation between starter battery and auxiliary 12V LiFePO₄ backup bank in start-stop systems.

IC Role / Device Role / Timing Role: Dual-function MOSFET acting as both charge controller and fault-isolation switch during cranking events.

Use Value: 33A avalanche current rating and 55mJ EAS withstand repeated 100A cranking surges without degradation.

DC-DC Converter in ADAS Camera Module Electric Power Steering (EPS) Motor Driver

Use Scenario: Synchronous buck converter stepping 12V vehicle supply down to 3.3V for image sensor and SoC power rails.

IC Role / Device Role / Timing Role: Low-side switch operating at 400kHz with 42nC Qg and 14.6ns tF for minimal dead-time loss.

Use Value: 9mΩ RDS(on) @ 4.5V ensures >94% efficiency at 5A output, critical for thermal-limited camera housing envelopes.

Use Scenario: Half-bridge leg in three-phase inverter driving 200W EPS assist motor.

IC Role / Device Role / Timing Role: High-current phase switch conducting 25A RMS with <5ns propagation delay matching for precise torque control.

Use Value: 2,000pF Ciss and 248pF Crss enable clean gate drive with 3.3Ω external resistor, suppressing dv/dt-induced shoot-through.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
Infineon BSC010N04LS6 40V VDSS, 1.0mΩ RDS(on) @ 10V, PG-TSDSON-8 package, higher cost, tighter gate threshold (1.2–2.2V) Preferred for 42V mild-hybrid systems; not drop-in due to different thermal pad layout and pinout Select when 40V rating and sub-1.5mΩ RDS(on) justify premium pricing and PCB redesign.
Vishay SQJQ910E 30V VDSS, 6.0mΩ RDS(on) @ 10V, PowerPAK® SO-8L, AEC-Q101 qualified, 10.5mΩ @ 4.5V Compatible footprint but lower 4.5V drive performance; 12.5°C/W RθJA vs. 59°C/W for DMN3009SFGQ Choose for legacy SO-8L board reuse where 4.5V gate drive margin is sufficient and thermal budget allows larger copper area.

Compared with BSC010N04LS6 and SQJQ910E, DMN3009SFGQ offers the best balance of 4.5V drive capability (9mΩ), thermal performance (7.8°C/W RθJC), and cost for 12V/24V automotive power stages - especially where PPAP documentation and PowerDI3333-8's superior thermal pad coupling are mandatory.

Availability

DMN3009SFGQ-13 is available at Aetrix Electronics and suitable for automotive power management functions, battery disconnect systems, and DC-DC converters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for DMN3009SFGQ-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers and manufacturing facilities across Asia and the Americas.

The DMN3009SFGQ belongs to Diodes' AEC-Q101-qualified PowerMOS family, engineered specifically for automotive power conversion, motor control, and battery protection - emphasizing low RDS(on), robust avalanche capability, and IATF 16949-compliant traceability.

FAQ

Is DMN3009SFGQ-13 pin-compatible with standard SO-8 or PowerPAK SO-8L packages?

No. DMN3009SFGQ-13 uses the PowerDI3333-8 package, which has an 8-pin layout with all drains connected to a single exposed thermal pad - unlike SO-8 or PowerPAK SO-8L. Its footprint requires specific land pattern dimensions (D = 3.30mm, E = 3.30mm, exposed pad 2.27 × 1.61mm) per Diodes' package outline DS39775.

What is the maximum recommended gate drive voltage for reliable operation?

The absolute maximum gate-source voltage is ±20V, but Diodes specifies VGS = 10V for rated RDS(on) and 4.5V for logic-level compatibility. Driving above 12V provides no significant RDS(on) improvement and increases gate oxide stress - 10V is the optimal balance of performance and reliability.

Does DMN3009SFGQ-13 support bidirectional current flow in battery protection circuits?

Yes. As an N-channel MOSFET with a monolithic body diode, it conducts current from source to drain when VDS < 0. Conducting 20A continuous body diode current (IS) is specified, and its 0.68V VSD at 1A supports efficient reverse-path operation in charge/discharge controllers.

How does the PowerDI3333-8 package improve thermal performance over traditional SO-8?

PowerDI3333-8 reduces junction-to-case thermal resistance to 7.8°C/W by integrating a large exposed drain pad directly soldered to PCB copper - versus ~62°C/W for standard SO-8. This allows 45A continuous current with only 1-inch² 2oz copper, whereas SO-8 would require heatsinking or derating below 20A.

DMN3009SFGQ-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
16A (Ta), 45A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
5.5mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
42 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2000 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
900mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
POWERDI3333-8

DMN3009SFGQ-13 FAQ

1.How can I place an order for DMN3009SFGQ-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN3009SFGQ-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN3009SFGQ-13 reliable?

The price and inventory of DMN3009SFGQ-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3009SFGQ-13 is usually 5 days.

3.What payment methods are accepted for DMN3009SFGQ-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3009SFGQ-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN3009SFGQ-13?

DMN3009SFGQ-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN3009SFGQ-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN3009SFGQ-13?

For technical support, including DMN3009SFGQ-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3009SFGQ-13 requirements.

6.How does Aetrix verify that DMN3009SFGQ-13 is sourced from the original manufacturer or authorized distributors?

All DMN3009SFGQ-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3009SFGQ-13 meets industry standards.

7.What is the process for return or replacement of DMN3009SFGQ-13?

All DMN3009SFGQ-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3009SFGQ-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN3009SFGQ-13 part is unused and in its original packaging.

Return procedure for DMN3009SFGQ-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN3009SFGQ-13 Tags

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