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Diodes Incorporated DMN3013LFG-13
- Part No.:
- DMN3013LFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-PowerLDFN
- Datasheet:
-
DMN3013LFG-13.pdf
- Description:
- MOSFET 2N-CH 30V 9.5A PWRDI3333
- Quantity:
- Payment:
- Shipping:
Inventory:7,774
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Product details
Overview
DMN3013LFG-13 from Diodes Incorporated is a dual-channel 30V N-channel enhancement-mode MOSFET in PowerDI3333-8 (Type D) package, configured as two matched synchronous switches with RDS(ON) = 14.3 mΩ @ VGS = 8V, ID = 4A per channel, 100% production-tested UIS capability, and low Ciss (600 pF max), designed for high-efficiency DC-DC converter power stages.
For engineers reviewing the DMN3013LFG-13 datasheet, DMN3013LFG-13 pinout, DMN3013LFG-13 application, or DMN3013LFG-13 equivalent, this dual N-channel MOSFET supports compact synchronous buck topologies requiring matched on-resistance, fast switching (tF = 2.2 ns), and robust avalanche energy rating (EAS = 28 mJ).
Technical Context
This device integrates two independent N-channel MOSFETs in a single PowerDI3333-8 (Type D) thermally enhanced package with exposed die clip for low RθJC (6.9°C/W). Each channel shares identical maximum ratings: 30V VDSS, 15A ID (TC = 25°C), and 80A pulsed drain current.
Its gate threshold voltage (VGS(TH) = 0.75–1.2 V) enables logic-level drive compatibility, while matched RDS(ON) tolerance (<±15% at VGS = 8V) ensures balanced current sharing in paralleled or half-bridge configurations without external balancing components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage per channel; supports 24V input rail systems with margin. |
| RDS(ON) max | 14.3 mΩ @ VGS = 8V, ID = 4A - Low conduction loss enabling >95% efficiency in 12V→3.3V/5A buck converters. |
| Qg typ | 5.7 nC @ VGS = 4.5V - Enables fast turn-on with minimal gate driver power dissipation in high-frequency (>1 MHz) operation. |
| EAS | 28 mJ - Confirmed avalanche energy rating allows reliable operation under inductive load switching stress without snubbers. |
| Ciss max | 600 pF - Reduces Miller effect and improves noise immunity in high-dV/dt environments like motor drives. |
| TJ range | −55°C to +150°C - Supports industrial and automotive under-hood ambient conditions without derating. |
Pinout & Package
Package: PowerDI3333-8 (Type D), surface-mount, thermally enhanced with exposed copper die pad (pin 1 identified by notch and marking "G72").
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source Q1 | Common source connection for first MOSFET channel; electrically tied to exposed die clip for thermal path. |
| 5, 6, 7, 8 | Source Q2 | Common source connection for second MOSFET channel; isolated from Q1 source for independent control. |
| Pin 1 | Gate Q1 | Input control terminal for channel 1; requires <1.2 V threshold to initiate conduction. |
| Pin 5 | Gate Q2 | Input control terminal for channel 2; fully independent gate drive path with matched VGS(TH). |
| Exposed Pad | Drain Q1 & Q2 | Internally connected to both drains; primary thermal and high-current return path to PCB ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Matched dual N-channel topology | Identical BVDSS (30 V), RDS(ON) (14.3 mΩ), and Qg (5.7 nC) across channels enable symmetrical synchronous rectification without calibration. |
| 100% UIS tested | Every unit validated for unclamped inductive switching up to 24 A and 28 mJ, eliminating need for external avalanche protection in flyback or buck-boost designs. |
| Low Coss (350 pF max) | Minimizes capacitive turn-off losses and improves zero-voltage switching (ZVS) feasibility in resonant converters. |
| Green RoHS-compliant construction | Halogen- and antimony-free molding compound (<900 ppm Br/Cl, <1000 ppm Sb) meets IPC-1752A environmental compliance requirements. |
| Thermal resistance RθJA | 58.8°C/W on FR-4 with 1-inch² copper - enables 2.16 W continuous dissipation without forced air or heatsink in space-constrained modules. |
Applications
| DC-DC Buck Converter | USB PD Power Delivery |
|---|---|
Use Scenario: 24V-to-5V/3A step-down regulator in industrial IoT gateway power supply. IC Role / Device Role / Timing Role: Dual N-channel synchronous rectifier replacing discrete high-side/low-side FETs; operates at 500 kHz with dead-time control. Use Value: Achieves 96.2% peak efficiency and 12°C lower junction temperature vs. single-channel alternatives due to shared thermal pad and matched RDS(ON). | Use Scenario: Programmable power supply output stage supporting 20V/3A USB PD 3.0 profiles. IC Role / Device Role / Timing Role: High-efficiency synchronous switch in adjustable buck controller feedback loop; driven by dedicated gate driver IC. Use Value: Enables compact 12 mm × 12 mm layout with <15 mΩ total path resistance and <10 ns propagation skew between channels. |
| Motor Driver Half-Bridge | Hot-Swap Controller |
Use Scenario: 12V brushed DC motor interface in battery-powered medical pump. IC Role / Device Role / Timing Role: Upper/lower switch pair in half-bridge configuration; controlled via PWM with shoot-through prevention logic. Use Value: Withstands 80A pulsed current during stall conditions and delivers <2.5A continuous RMS current with <0.5W conduction loss per channel. | Use Scenario: Inrush current limiter and fault protection block in 48V telecom shelf power distribution. IC Role / Device Role / Timing Role: Back-to-back configured as ideal diode + current-limiting switch; monitored via external sense resistor. Use Value: Provides <100 μs overcurrent response time and <1.2V forward drop at 4A, reducing thermal stress vs. Schottky-based solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3016LFG-13 | RDS(ON) = 16.1 mΩ @ VGS = 4.5V (vs. 13.3 mΩ for DMN3013LFG-13); same package and pinout. | Slightly higher conduction loss limits use in <1 MHz, high-current (>6A) applications where thermal headroom is constrained. | Select when cost sensitivity outweighs 0.3W/channel efficiency gain at 4A load. |
| SI6926ADQ-T1-GE3 | SO-8 package (not thermally enhanced); RDS(ON) = 18 mΩ @ VGS = 4.5V; no UIS rating specified. | Lacks integrated thermal pad and avalanche testing - unsuitable for inductive loads or high-reliability industrial use. | Acceptable only for low-power, non-inductive consumer applications with ample board area for thermal relief. |
Compared with DMN3013LFG-13, DMN3016LFG-13 trades marginal RDS(ON) increase for broader availability, while SI6926ADQ-T1-GE3 sacrifices thermal performance and ruggedness for legacy SO-8 compatibility - making DMN3013LFG-13 optimal for space- and reliability-critical synchronous buck designs.
Availability
DMN3013LFG-13 is available at Aetrix Electronics and suitable for DC-DC converters, USB PD power delivery systems, and motor driver half-bridges requiring stable component supply, consistent parametric matching, and long-term industrial lifecycle support.
Supply support for DMN3013LFG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal devices, with design centers across Asia, Europe, and the U.S., serving industrial, computing, communications, and consumer markets.
This part belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, high-density power conversion systems where thermal performance, parametric consistency, and production-tested ruggedness are mandatory.
FAQ
What is the maximum continuous drain current per channel at TC = 70°C?
The DMN3013LFG-13 supports 12 A continuous drain current per channel when case temperature is maintained at +70°C, verified under standard JEDEC test conditions with proper PCB copper area. This rating assumes single-channel operation; simultaneous full-load operation of both channels requires thermal derating based on measured junction temperature rise.
Does the device support logic-level gate drive at 3.3V?
Yes - the gate threshold voltage (VGS(TH)) ranges from 0.75 V to 1.2 V, ensuring reliable turn-on with 3.3V logic drivers. However, RDS(ON) increases to 17.7 mΩ at VGS = 3.5V, so 4.5V or higher is recommended for minimum conduction loss in high-current applications.
How is the exposed thermal pad electrically connected internally?
The exposed die pad is internally connected to both drain terminals (Q1 and Q2), forming a common high-current return path and primary thermal interface. It must be soldered to a large PCB copper pour tied to system ground to achieve rated RθJA and power dissipation performance.
Is there any difference between Q1 and Q2 electrical characteristics?
No - electrical specifications are fully matched: both channels share identical BVDSS (30 V), RDS(ON) (14.3 mΩ max @ VGS = 8V), Qg (5.7 nC typ), and dynamic timing parameters (e.g., tF = 2.2 ns for Q2 vs. 2.0 ns for Q1). Minor variations fall within datasheet tolerances and do not affect functional symmetry.
DMN3013LFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerLDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 9.5A (Ta), 15A (Tc)
- Rds On (Max) @ Id, Vgs:
- 14.3mOhm @ 4A, 8V
- Vgs(th) (Max) @ Id:
- 1.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 5.7nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 600pF @ 15V
- Power - Max:
- 2.16W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI3333-8 (Type D)
DMN3013LFG-13 FAQ
1.How can I place an order for DMN3013LFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3013LFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3013LFG-13 reliable?
The price and inventory of DMN3013LFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3013LFG-13 is usually 5 days.
3.What payment methods are accepted for DMN3013LFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3013LFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3013LFG-13?
DMN3013LFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3013LFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3013LFG-13?
For technical support, including DMN3013LFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3013LFG-13 requirements.
6.How does Aetrix verify that DMN3013LFG-13 is sourced from the original manufacturer or authorized distributors?
All DMN3013LFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3013LFG-13 meets industry standards.
7.What is the process for return or replacement of DMN3013LFG-13?
All DMN3013LFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3013LFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3013LFG-13 part is unused and in its original packaging.
Return procedure for DMN3013LFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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