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Diodes Incorporated DMN3016LFDF-13
- Part No.:
- DMN3016LFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMN3016LFDF-13.pdf
- Description:
- MOSFET N-CH 30V 12A 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:9,691
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Product details
Overview
DMN3016LFDF-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, featuring 12 mΩ RDS(ON) at VGS = 10V and 16 mΩ at VGS = 4.5V, rated for 10 A continuous drain current at TA = +25°C. It delivers low-profile power switching in DC-DC converters and battery management systems where space-constrained PCB layouts demand high efficiency and thermal performance.
For engineers reviewing the DMN3016LFDF-13 datasheet, DMN3016LFDF-13 pinout, DMN3016LFDF-13 application, or DMN3016LFDF-13 equivalent, key selection criteria include its 0.6 mm profile, 4 mm² footprint, 1.4–2.0 V gate threshold voltage, 25.1 nC total gate charge at 10 V, and JEDEC-qualified reliability for industrial power management designs.
Technical Context
This MOSFET employs a trench-gate process to achieve low RDS(ON) while maintaining fast switching characteristics: tD(ON) = 4.8 ns, tR = 16.5 ns, tD(OFF) = 26.1 ns, and tF = 5.6 ns under standard test conditions (VDD = 15 V, RL = 1.25 Ω, Rg = 3 Ω). Its Ciss = 1415 pF and Crss = 82 pF support stable operation in synchronous buck topologies.
The device integrates a body diode with VSD = 0.70–1.0 V at IS = 1 A and tRR = 12.3 ns (IF = 12 A, di/dt = 500 A/μs), enabling efficient freewheeling in high-frequency converters. Thermal resistance RθJA is 66 °C/W with 1-inch² copper pad, confirming suitability for thermally dense power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage compatible with 24 V nominal input rails and transient margin. |
| RDS(ON) | 12 mΩ @ VGS = 10 V - Enables <120 mW conduction loss at 10 A, critical for >95% converter efficiency. |
| ID (max) | 10 A @ TA = +25°C - Supports high-current output stages in compact point-of-load regulators. |
| Qg | 25.1 nC @ VGS = 10 V - Determines gate drive power and switching loss in 500 kHz–1 MHz applications. |
| RθJA | 66 °C/W - Achieved with 1-inch² copper pad; enables 2.02 W power dissipation without forced cooling. |
| VGS(TH) | 1.4–2.0 V - Ensures robust turn-on with 3.3 V or 5 V logic-level gate drivers. |
| Coss | 119 pF - Low output capacitance minimizes dead-time losses and improves light-load efficiency. |
Pinout & Package
U-DFN2020-6 (Type F) package: 2.0 × 2.0 × 0.6 mm, 0.65 mm pitch, NiPdAu-plated terminals, moisture sensitivity level 1, UL 94V-0 molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Top View) | Drain | Main current path terminal; connected to high-side switch node or ground return in low-side configuration. |
| Pin 2 | Source | Reference node for gate control and body diode cathode; tied to power ground or output rail. |
| Pin 3 | Gate | Control input; requires 1.4–2.0 V threshold to initiate conduction; sensitive to ESD per MIL-STD-202. |
| Pin 4 | Drain | Second drain connection; paralleled internally with Pin 1 to reduce package inductance and RDS(ON). |
| Pin 5 | Source | Second source connection; paralleled internally with Pin 2 to improve current sharing and thermal spreading. |
| Pin 6 | Drain | Third drain connection; enhances thermal coupling to PCB copper and reduces thermal resistance by 30% vs. 3-pin DFN. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile (0.6 mm height) | Enables integration into space-constrained modules such as USB-C PD adapters and wearable battery packs. |
| 4 mm² PCB footprint | Reduces board area by >50% versus SO-8 or PowerPAK 1212-8, supporting miniaturized DC-DC solutions. |
| JEDEC-qualified reliability | Validated per AEC-Q stress standards for long-term stability in industrial temperature range (−55°C to +150°C). |
| Halogen- and antimony-free "Green" construction | Meets RoHS 3 (2015/863/EU) with <900 ppm Br, <900 ppm Cl, <1000 ppm Sb-compliant for eco-sensitive end equipment. |
| Low gate threshold voltage | Ensures full enhancement with 3.3 V microcontroller GPIO, eliminating need for level-shifting gate drivers. |
Applications
| Battery Protection Circuit | USB-C Power Delivery Module |
|---|---|
|
Use Scenario: Bidirectional overcurrent and short-circuit protection in Li-ion battery packs using integrated protection ICs. IC Role / Device Role: Low-side switch controlling discharge path; body diode supports reverse-current blocking during charging. Use Value: 12 mΩ RDS(ON) limits voltage drop to <120 mV at 10 A, preserving battery runtime and thermal headroom. |
Use Scenario: Synchronous rectification in 20–100 W USB-C PD buck-boost converters. IC Role / Device Role: High-efficiency power switch in secondary-side regulation; driven by dedicated gate controller. Use Value: 25.1 nC Qg and 16.5 ns tR enable clean 1 MHz switching with minimal overlap loss. |
| Industrial IoT Sensor Node | Automotive Body Control Module |
|
Use Scenario: Load switching for ultra-low-power sensors and RF transceivers powered from coin-cell or energy-harvesting sources. IC Role / Device Role: High-side or low-side load switch enabling precise power gating and leakage control. Use Value: 1 μA IDSS at VDS = 30 V ensures <100 nW standby loss-critical for multi-year battery life. |
Use Scenario: LED driver and solenoid control in non-safety-critical automotive cabin functions (e.g., door locks, interior lighting). IC Role / Device Role: Logic-level controlled power switch interfacing with 3.3 V/5 V microcontrollers. Use Value: 1.4–2.0 V VGS(TH) guarantees reliable turn-on across automotive voltage transients (4.5–16 V battery range). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3016LFG-7 | Same die, identical RDS(ON), Qg, and thermal specs; differs only in packaging (3,000/reel vs. 10,000/reel). | No functional difference; selected solely for smaller-volume procurement or prototyping quantity requirements. | Choose when order volume aligns with 3k tape-and-reel; no design or layout impact. |
| DMN3016LFDE-7 | Same electrical specs but U-DFN2020-6 (Type E) variant-slightly different leadframe geometry and marking location. | Compatible footprint and soldering profile; validated for same industrial applications but not automotive-qualified. | Select for cost-sensitive industrial designs where AEC-Q traceability is not required. |
Compared with DMN3016LFDF-13, DMN3016LFG-7 offers identical performance in smaller reels, while DMN3016LFDE-7 provides equivalent electrical behavior with alternate mechanical marking-both require no schematic or layout changes but differ in supply chain logistics and qualification scope.
Availability
DMN3016LFDF-13 is available at Aetrix Electronics and suitable for battery management systems, USB-C power delivery modules, and industrial IoT sensor nodes requiring stable component supply, JEDEC-compliant reliability, and compact 2×2 mm footprint.
Supply support for DMN3016LFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and distribution operations across Asia, Europe, and the Americas.
This part belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, low-voltage DC-DC conversion and battery-powered system switching-emphasizing low RDS(ON), fast switching, and miniature packaging.
FAQ
What is the maximum continuous drain current at 70°C ambient?
At TA = +70°C, DMN3016LFDF-13 supports 8 A continuous drain current with VGS = 10 V under steady-state conditions on a FR-4 board with 2 oz copper and minimum recommended pad layout. This rating assumes no additional heatsinking and accounts for thermal derating due to increased junction-to-ambient resistance at elevated temperatures.
Is this MOSFET suitable for 3.3 V logic-level gate drive?
Yes-its gate threshold voltage range is 1.4–2.0 V, ensuring full enhancement with 3.3 V microcontroller outputs. At VGS = 4.5 V, it achieves 16 mΩ RDS(ON) and 8.5 A ID, making it compatible with standard 3.3 V or 5 V gate drivers without external level shifting.
Does DMN3016LFDF-13 have an integrated body diode, and what are its characteristics?
Yes-it features an intrinsic body diode with forward voltage VSD = 0.70–1.0 V at IS = 1 A and reverse recovery time tRR = 12.3 ns under IF = 12 A and di/dt = 500 A/μs. This enables use in synchronous rectification and freewheeling paths without external diodes.
What is the thermal resistance when mounted on a 1-inch² copper pad?
When mounted on a FR-4 board with 2 oz copper and a 1-inch² copper plate, DMN3016LFDF-13 exhibits RθJA = 66 °C/W (steady state) and RθJC = 11.6 °C/W. This allows 2.02 W power dissipation at TA = +25°C before reaching the 150°C maximum junction temperature.
DMN3016LFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 12mOhm @ 11A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 25.1 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1415 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.02W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMN3016LFDF-13 FAQ
1.How can I place an order for DMN3016LFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3016LFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3016LFDF-13 reliable?
The price and inventory of DMN3016LFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3016LFDF-13 is usually 5 days.
3.What payment methods are accepted for DMN3016LFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3016LFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3016LFDF-13?
DMN3016LFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3016LFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3016LFDF-13?
For technical support, including DMN3016LFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3016LFDF-13 requirements.
6.How does Aetrix verify that DMN3016LFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMN3016LFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3016LFDF-13 meets industry standards.
7.What is the process for return or replacement of DMN3016LFDF-13?
All DMN3016LFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3016LFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3016LFDF-13 part is unused and in its original packaging.
Return procedure for DMN3016LFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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