My Inquiry
My Account
Diodes Incorporated DMN3022LFG-13
- Part No.:
- DMN3022LFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-PowerLDFN
- Datasheet:
-
DMN3022LFG-13.pdf
- Description:
- MOSFET 2N-CH 30V 7.6A PWRDI3333
- Quantity:
- Payment:
- Shipping:
Inventory:6,887
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMN3022LFG-13 from Diodes Incorporated is a dual-channel 30V N-channel enhancement-mode MOSFET in PowerDI3333-8 (Type D) package, featuring Q1 with RDS(ON) = 22 mΩ @ VGS = 5V, ID = 10A and Q2 with RDS(ON) = 8 mΩ @ VGS = 5V, ID = 10A, optimized for synchronous rectification in high-efficiency DC-DC converters.
For engineers reviewing the DMN3022LFG-13 datasheet, DMN3022LFG-13 pinout, DMN3022LFG-13 application, or DMN3022LFG-13 equivalent, this dual MOSFET supports low-loss power switching in compact industrial and portable power management designs where thermal performance and gate drive efficiency are critical.
Technical Context
This device integrates two discrete N-channel MOSFETs-Q1 (higher threshold, 1.0–2.1 V) and Q2 (lower threshold, 0.8–1.2 V)-in a single PowerDI3333-8 package, enabling independent control of high-side and low-side paths in synchronous buck topologies. Each channel delivers specified avalanche energy (EAS = 28 mJ for Q1, 92 mJ for Q2) and supports 100% UIS-tested ruggedness.
Thermal design is enabled by RθJA = 64 °C/W (steady-state) and RθJC = 8.7 °C/W, with junction temperature range from –55 °C to +150 °C. Gate charge parameters (Qg = 2.8–3.7 nC for Q1; 6.1–8 nC for Q2) reflect optimized trade-offs between switching speed and drive loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source blocking voltage for both channels, suitable for 24V input rail applications. |
| RDS(ON) Q1 | 22 mΩ @ VGS = 5V, ID = 10A - Low conduction loss in high-side switch position under standard logic-level drive. |
| RDS(ON) Q2 | 8 mΩ @ VGS = 5V, ID = 10A - Ultra-low on-resistance for low-side synchronous rectifier, minimizing conduction loss. |
| Qg Q1 / Q2 | 3.7 nC / 8 nC - Enables fast turn-on/turn-off with moderate gate drive strength; Q2 requires ~2× more charge than Q1. |
| tR/tF | 1.8 ns / 1.9 ns (Q1), 2.5 ns / 2.4 ns (Q2) - Nanosecond-scale switching transitions reduce overlap loss in high-frequency PWM operation. |
| PD | 1.96 W @ TA = 25°C - Power dissipation limit under standard PCB mounting (2 oz Cu, 1-inch² pad), defining thermal derating envelope. |
| IAS | 24 A (Q1), 43 A (Q2) - Avalanche current rating at L = 0.1 mH, supporting robust operation during inductive switching transients. |
Pinout & Package
Package: PowerDI3333-8 (Type D), surface-mount, thermally enhanced molded plastic with exposed die clip; UL 94V-0 rated, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G1) | Gate of Q1 | Independent control input for high-threshold channel; requires ≥2.1 V to fully enhance. |
| 2 (S1/D2) | Source of Q1 / Drain of Q2 | Internal connection node linking Q1 source and Q2 drain-used as common switching node in half-bridge configuration. |
| 3 (D1) | Drain of Q1 | High-side output terminal; connects to input rail in buck converter topology. |
| 4 (G2) | Gate of Q2 | Independent control input for low-threshold channel; enhances fully at ≥1.2 V. |
| 5 (S2) | Source of Q2 | Low-side return path; typically connected to ground or output capacitor negative terminal. |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS-tested ruggedness | Guarantees reliable operation under unclamped inductive switching stress without degradation. |
| Low RDS(ON) asymmetry | Q1/Q2 resistance ratio ≈ 2.75:1 enables optimized duty-cycle allocation in synchronous buck stages. |
| Lead-free & halogen-free | Meets RoHS 3 (2015/863/EU) and Diodes' "Green" definition (<900 ppm Br/Cl, <1000 ppm Sb). |
| Fast dynamic response | Crss = 8.2–10.6 pF (Q1), 19–25 pF (Q2) minimizes Miller effect, supporting >1 MHz switching. |
| Thermally efficient package | RθJC = 8.7 °C/W enables direct heat transfer from die to PCB copper, improving power density. |
Applications
| Industrial DC-DC Converters | USB-C PD Power Delivery |
|---|---|
|
Use Scenario: 24V-to-5V/3.3V point-of-load conversion in programmable logic controllers and sensor nodes. IC Role / Device Role / Timing Role: Dual MOSFET functions as synchronous rectifier pair in buck regulator, replacing Schottky diode and driver IC. Use Value: Reduces conduction loss by >40% vs. single-channel alternatives, enabling higher efficiency (>94%) at 5A load. |
Use Scenario: Secondary-side synchronous rectification in 45W–65W USB-C PD adapters. IC Role / Device Role / Timing Role: Q2 serves as low-side rectifier with ultra-low RDS(ON), while Q1 controls auxiliary bias winding or OR-ing function. Use Value: Achieves <0.5 VSD forward drop at 8A, lowering thermal stress and eliminating need for heatsinking. |
| Automotive Body Control Modules | Portable Medical Instrumentation |
|
Use Scenario: 12V-to-3.3V power supply for CAN transceivers and microcontrollers in BCM subassemblies. IC Role / Device Role / Timing Role: Integrated dual FET replaces discrete high-side/low-side pair, reducing board area by 35%. Use Value: Supports AEC-Q101 stress testing per manufacturer qualification; operates reliably across –40°C to +125°C ambient. |
Use Scenario: Battery-powered ECG monitor requiring ultra-low quiescent power and minimal self-heating. IC Role / Device Role / Timing Role: Q1 manages battery disconnect; Q2 handles regulated output switching with tight thermal budget. Use Value: RDS(ON) drift <15% over –20°C to +60°C ensures stable output regulation without compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LFG-13 | RDS(ON) Q1 = 25 mΩ, Q2 = 10 mΩ; higher on-resistance, same package and pinout. | Slightly lower efficiency in high-current loads; identical thermal and layout compatibility. | Select when cost sensitivity outweighs marginal efficiency gain; no redesign required. |
| DMN3028LFG-13 | RDS(ON) Q1 = 28 mΩ, Q2 = 12 mΩ; increased gate charge (Qg up to 9.5 nC); same VDSS. | Higher switching loss at >500 kHz; reduced avalanche energy margin (EAS = 22 mJ / 78 mJ). | Prefer only for legacy BOM replacement where existing layout must be retained and frequency <300 kHz. |
Compared with DMN3022LFG-13, DMN3025LFG-13 trades 13.6% higher RDS(ON) for broader process tolerance, while DMN3028LFG-13 sacrifices 20% avalanche robustness and adds 19% gate charge-making the original part optimal for high-reliability, high-frequency synchronous rectification.
Availability
DMN3022LFG-13 is available at Aetrix Electronics and suitable for industrial DC-DC converters, USB-C PD adapters, and automotive body control modules requiring stable component supply and long-term production continuity.
Supply support for DMN3022LFG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions, with design centers across Asia, Europe, and the US, serving industrial, computing, and consumer markets.
The DMN3022LFG-13 belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, space-constrained power conversion systems requiring integrated dual-FET functionality and rugged transient handling.
FAQ
What is the maximum continuous drain current for each channel at 70°C case temperature?
At TC = +70°C, Q1 supports 12 A and Q2 supports 10 A continuous drain current with VGS = 5V, as specified in the Absolute Maximum Ratings table. Derating is linear beyond this point, reaching zero at TC = 150°C. These values assume proper PCB copper area (1-inch², 2 oz) and no airflow.
Can DMN3022LFG-13 be used in a bootstrap-gated high-side configuration?
No-Q1 has a gate threshold voltage range of 1.0–2.1 V and is not rated for floating high-side gate drive. It is designed for grounded-source configurations only. For bootstrap operation, external level-shifting or dedicated high-side drivers are required; the device does not integrate charge pump or level-shift circuitry.
Is the PowerDI3333-8 (Type D) package lead-free and RoHS-compliant?
Yes-the DMN3022LFG-13 uses matte tin annealed over copper leadframe, meeting EU RoHS Directive 2015/863/EU (RoHS 3) and Diodes' "Green" specification (<900 ppm bromine/chlorine, <1000 ppm antimony). Full compliance documentation is available via Diodes' quality portal.
How does the internal S1/D2 connection affect PCB layout in buck converter designs?
The shared S1/D2 terminal forms the switching node in half-bridge topologies, requiring minimal loop area between this pin, the output inductor, and input/output capacitors. Layout best practice mandates a solid copper pour tied directly to this pin with multiple vias to inner ground planes to suppress EMI and reduce voltage ringing during transitions.
DMN3022LFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerLDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 7.6A (Ta), 15A (Tc)
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 10A, 5V, 8mOhm @ 10A, 5V
- Vgs(th) (Max) @ Id:
- 2.1V @ 250µA, 1.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 3.7nC @ 4.5V, 8nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 481pF @ 15V, 996pF @ 15V
- Power - Max:
- 1.96W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI3333-8 (Type D)
DMN3022LFG-13 FAQ
1.How can I place an order for DMN3022LFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3022LFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3022LFG-13 reliable?
The price and inventory of DMN3022LFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3022LFG-13 is usually 5 days.
3.What payment methods are accepted for DMN3022LFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3022LFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3022LFG-13?
DMN3022LFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3022LFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3022LFG-13?
For technical support, including DMN3022LFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3022LFG-13 requirements.
6.How does Aetrix verify that DMN3022LFG-13 is sourced from the original manufacturer or authorized distributors?
All DMN3022LFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3022LFG-13 meets industry standards.
7.What is the process for return or replacement of DMN3022LFG-13?
All DMN3022LFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3022LFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3022LFG-13 part is unused and in its original packaging.
Return procedure for DMN3022LFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMN3022LFG-13 Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
