Diodes Incorporated DMN3024LK3-13
- Part No.:
- DMN3024LK3-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
DMN3024LK3-13.pdf
- Description:
- MOSFET N-CH 30V 9.78A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:3,780
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Product details
Overview
DMN3024LK3-13 from Diodes Incorporated is a 30V, 14.4A N-channel enhancement-mode MOSFET in TO-252 (DPAK) package, featuring 24mΩ RDS(on) at VGS = 10V and 39mΩ at VGS = 4.5V. It serves as a high-efficiency power switch in DC-DC converters and LED backlighting circuits, supporting continuous drain current up to 14.4A at TA = 25°C.
For engineers reviewing the DMN3024LK3-13 datasheet, DMN3024LK3-13 pinout, DMN3024LK3-13 application, or DMN3024LK3-13 equivalent, key selection criteria include RDS(on) at low gate drive (4.5V), thermal resistance (RθJA = 30.8°C/W on 50mm × 50mm 2oz FR4), safe operating area limits, body diode forward voltage (0.82V typ), and gate charge (12.9nC).
Technical Context
This MOSFET employs planar silicon process technology optimized for low conduction loss while maintaining fast switching performance. Its gate threshold voltage (1.0–3.0V) enables compatibility with 3.3V and 5V logic-level drivers, and its low Qg (12.9nC) and Qgd (2.5nC) support high-frequency operation in synchronous buck topologies.
The device integrates a robust body diode with trr = 12ns and Qrr = 4.8nC, suitable for freewheeling in non-isolated DC-DC stages. Thermal design is supported by validated RθJL = 2.24°C/W and dual PCB mounting derating curves for both 25mm × 25mm 1oz and 50mm × 50mm 2oz copper layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - Maximum blocking voltage before avalanche; sets upper limit for input/output rail voltage in buck, boost, and load-switch applications. |
| RDS(on) @ 10V | 24mΩ - Conduction loss of 2.4W at 10A drain current; enables >95% efficiency in 12V-input/3.3V-output 10A converters. |
| RDS(on) @ 4.5V | 39mΩ - Usable with 3.3V microcontroller GPIOs; yields 3.9W loss at 10A, suitable for space-constrained industrial SMPS. |
| ID (continuous) | 14.4A @ TA=25°C - Sustained current capability under standard test board conditions; derates to 9.78A at 70°C ambient. |
| Qg | 12.9nC - Total gate charge determines driver strength requirement; compatible with low-power gate drivers like DIODES AP21xx series. |
| tr/tf | 3.3ns / 8ns - Fast edge rates minimize switching transition losses; supports >1MHz operation with appropriate gate resistor tuning. |
| VSD | 0.82V typ - Low body diode forward drop reduces reverse conduction loss during dead-time in synchronous rectification. |
Pinout & Package
Package: TO-252 (DPAK), surface-mount, single-ended leadframe with exposed drain pad for thermal dissipation. Dimensions per Diodes Inc. drawing: 6.22mm × 6.73mm × 2.39mm (L × W × H), weight ≈ 0.33g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D (Drain) | Main current-carrying terminal (high-side or low-side switch node) | Connected to large copper pour for heat sinking; electrically tied to exposed pad; handles full load current and voltage stress. |
| S (Source) | Reference node for gate drive and current return path | Provides ground reference for gate control; used as Kelvin sense point in precision current monitoring configurations. |
| G (Gate) | Control terminal for channel modulation | High-impedance input requiring <100nA leakage; driven by logic-level or dedicated gate driver; sensitive to ESD and ringing. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) at 4.5V | 39mΩ enables direct interface with 3.3V MCUs without level-shifting, reducing BOM count in portable power rails. |
| Fast switching with low Qgd | 2.5nC gate-drain charge minimizes Miller plateau duration, improving controllability in hard-switched topologies. |
| RoHS-compliant "Green" construction | Halogen- and antimony-free molding compound meets EU environmental directives and supports lead-free reflow profiles. |
| Validated thermal performance | RθJA = 30.8°C/W on industry-standard 50mm × 50mm 2oz FR4 allows accurate junction temperature prediction without custom thermal modeling. |
Applications
| LED Backlighting | DC-DC Buck Converter |
|---|---|
Use Scenario: Driving parallel strings of white LEDs in LCD monitor backlight units with PWM dimming. IC Role / Device Role: Low-side constant-current switch modulating LED current at 1–20kHz. Use Value: 39mΩ RDS(on) at 4.5V ensures minimal conduction loss during extended dimming cycles, preserving thermal margin in sealed enclosures. | Use Scenario: High-efficiency 12V-to-3.3V/10A step-down regulator for FPGA core power supply. IC Role / Device Role: Synchronous rectifier in continuous conduction mode (CCM) buck stage. Use Value: 0.82V body diode VSD and 12.9nC Qg reduce switching and conduction losses, enabling >94% peak efficiency at 500kHz. |
| Load Switch for Industrial I/O | Hot-Swap Controller Protection |
Use Scenario: Controlled power-up of field-connected sensors and actuators in PLC modules. IC Role / Device Role: Inrush-limited high-side load switch with integrated current sensing. Use Value: 30V VDSS and 14.4A ID rating accommodate 24V nominal systems with transient overvoltage tolerance up to ±20V gate drive. | Use Scenario: Input-stage protection in 48V telecom power distribution boards. IC Role / Device Role: OR-ing FET in redundant power path with fast fault isolation. Use Value: 12ns reverse recovery time and 4.8nC Qrr prevent shoot-through during source-fail transitions, ensuring clean bus switchover. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LFD-13 | Same 30V rating but 22mΩ RDS(on) @ 10V; smaller 2×2mm DFN package; no exposed drain pad. | Higher power density but lower thermal mass; unsuitable for >5A continuous without aggressive PCB cooling. | Select when board space is constrained and thermal budget allows higher junction temperature rise. |
| IRLML6344TRPBF | 30V, 28mΩ @ 4.5V; SOT-23 package; 4.3A ID; higher RDS(on) at same VGS. | Limited to sub-5A loads; not viable for 10A+ DC-DC outputs or backlighting with >8 strings. | Choose only for low-current signal switching where TO-252 footprint is unavailable. |
Compared with DMN3024LK3-13, DMN3025LFD-13 offers lower RDS(on) in a smaller package but sacrifices thermal robustness, while IRLML6344TRPBF trades current capacity and thermal performance for ultra-compact size-neither matches the original's balance of 14.4A handling, 39mΩ logic-level drive, and TO-252 thermal reliability.
Availability
DMN3024LK3-13 is available at Aetrix Electronics and suitable for DC-DC converters, LED backlighting systems, and industrial load-switching applications requiring stable component supply across production lifecycles.
Supply support for DMN3024LK3-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.
This part belongs to Diodes' Power MOSFET product line, engineered specifically for high-efficiency, medium-current power conversion and load management in consumer, industrial, and computing power supplies.
FAQ
What is the maximum gate-source voltage rating for DMN3024LK3-13?
The absolute maximum VGS is ±20V per the datasheet's Maximum Ratings table. Exceeding this risks permanent gate oxide damage. For reliable operation, gate drive should be limited to 12V max in standard applications, with transient spikes clamped using Zener diodes if driving from higher-voltage sources.
Can DMN3024LK3-13 be used in a high-side switch configuration?
Yes, it can operate as a high-side switch, but requires a gate drive voltage ≥ VIN + VGS(th) (typically ≥33V for 30V input). A bootstrap or isolated gate driver is necessary to maintain sufficient VGS during conduction; the device itself does not integrate level-shifting circuitry.
What is the significance of the "K3" suffix in DMN3024LK3-13?
The "K3" denotes Diodes Incorporated's internal package variant code for the TO-252 (DPAK) configuration with standard leadframe plating and marking layout. It distinguishes this version from other TO-252 variants (e.g., K4) that may differ in lead finish, moisture sensitivity level, or tape-and-reel packaging specifications.
How does the body diode performance affect synchronous rectification use?
With VSD = 0.82V (typ) and trr = 12ns, the intrinsic body diode supports efficient freewheeling during dead-time intervals. However, for optimal efficiency above 2A, external Schottky diodes or complementary MOSFETs are recommended to avoid conduction loss and reverse recovery energy dissipation.
DMN3024LK3-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 9.78A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 24mOhm @ 7A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 608 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.17W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252-3
DMN3024LK3-13 FAQ
1.How can I place an order for DMN3024LK3-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3024LK3-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3024LK3-13 reliable?
The price and inventory of DMN3024LK3-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3024LK3-13 is usually 5 days.
3.What payment methods are accepted for DMN3024LK3-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3024LK3-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3024LK3-13?
DMN3024LK3-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3024LK3-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3024LK3-13?
For technical support, including DMN3024LK3-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3024LK3-13 requirements.
6.How does Aetrix verify that DMN3024LK3-13 is sourced from the original manufacturer or authorized distributors?
All DMN3024LK3-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3024LK3-13 meets industry standards.
7.What is the process for return or replacement of DMN3024LK3-13?
All DMN3024LK3-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3024LK3-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3024LK3-13 part is unused and in its original packaging.
Return procedure for DMN3024LK3-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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