Diodes Incorporated DMN3024SFG-7
- Part No.:
- DMN3024SFG-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMN3024SFG-7.pdf
- Description:
- MOSFET N-CH 30V 7.5A PWRDI3333-8
- Quantity:
- Payment:

- Shipping:

Inventory:844
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMN3024SFG-7 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in POWERDI®3333-8 package, optimized for high-efficiency power management with RDS(on) = 23 mΩ @ VGS = 10V and 33 mΩ @ VGS = 4.5V, rated for 7.5 A continuous drain current at 25°C, and used in DC-DC converters and backlighting circuits.
For engineers reviewing the DMN3024SFG-7 datasheet, DMN3024SFG-7 pinout, DMN3024SFG-7 application, or DMN3024SFG-7 equivalent, key selection criteria include low on-resistance at 4.5V gate drive, AEC-Q101 qualification, thermal performance in compact layout, and lead-free/Green compliance for automotive and industrial power stages.
Technical Context
This MOSFET employs planar trench-enhanced silicon technology to achieve low RDS(on) while maintaining fast switching characteristics (tD(on) = 2.9 ns, tD(off) = 14.6 ns) and robust UIS capability (IAS = 9 A, EAS = 12 mJ). Its gate threshold voltage (VGS(th) = 1.0–2.4 V) ensures reliable turn-on with standard logic-level drivers.
The device is thermally optimized for FR-4 PCBs: with 1-inch² copper pad, RθJA drops to 58°C/W (steady-state), enabling 2.2 W power dissipation at 25°C ambient - critical for space-constrained DC-DC synchronous rectification and load-switching applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - supports 24V rail systems with margin against transients |
| RDS(on) @ 10V | 23 mΩ - enables <170 mW conduction loss at 7.5 A |
| RDS(on) @ 4.5V | 33 mΩ - ensures full enhancement with 3.3V/5V microcontroller GPIO |
| ID (continuous, 25°C) | 7.5 A - suitable for medium-power buck converter output stages |
| Qg @ 10V | 10.5 nC - balances switching speed and gate drive power in 500 kHz–1 MHz designs |
| TJ range | −55°C to +150°C - qualified for under-hood automotive and industrial environments |
| AEC-Q101 | Qualified - meets stress test requirements for automotive electronics reliability |
Pinout & Package
Package: POWERDI®3333-8 - surface-mount, thermally enhanced 8-pin plastic package with exposed drain paddle; footprint occupies only 33% of SO-8 area; UL 94V-0 rated, MSL Level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 (Drain) | Power Drain Connection | Internally tied to exposed thermal pad; primary current path and heat sink interface |
| 5, 6, 7, 8 (Source) | Power Source Return | Four parallel source terminals reduce loop inductance and improve current sharing |
| Gate (Pin 1 top-view marking indicator) | Control Input | Single gate terminal (Pin 1 per top-view diagram); requires <10.5 nC charge for full enhancement |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS tested | Guarantees ruggedness in inductive switching (L = 0.3 mH) without external snubbers |
| Thermally efficient package | RθJC = 11°C/W enables direct thermal coupling to PCB copper for >2 W operation |
| Green, halogen-free construction | <900 ppm Br/Cl, <1000 ppm Sb - compliant with automotive and EU environmental mandates |
| Low gate charge | Qgd = 1.6 nC minimizes Miller-induced shoot-through risk in synchronous buck topologies |
Applications
| LED Backlight Driver | Automotive Body Control Module |
|---|---|
Use Scenario: Driving white LED strings in LCD displays using PWM-controlled high-side switch configuration. IC Role / Device Role / Timing Role: High-efficiency synchronous rectifier and current-sink switch operating at 10–20 kHz PWM frequency. Use Value: 23 mΩ RDS(on) reduces thermal load on 4-layer PCB, enabling fanless design in thin-form-factor monitors. | Use Scenario: Load switching for interior lighting, window lift motors, and HVAC actuators in 12V vehicle electrical architecture. IC Role / Device Role / Timing Role: Protected high-side power switch with integrated avalanche energy handling for inductive kickback suppression. Use Value: AEC-Q101 qualification and 9 A IAS rating eliminate need for external TVS in cost-sensitive BCM designs. |
| Industrial DC-DC Converter | USB-C Power Delivery Sink |
Use Scenario: Secondary-side synchronous rectifier in isolated 24V-to-5V/12V flyback or forward converters for PLC I/O modules. IC Role / Device Role / Timing Role: Low-VGS activated MOSFET replacing Schottky diode to improve efficiency above 85% at full load. Use Value: 33 mΩ RDS(on) @ 4.5V allows direct drive from controller's 5V gate driver, reducing BOM count. | Use Scenario: Input power path switch for USB-C PD 3.0 sink applications requiring reverse-voltage blocking and overcurrent protection. IC Role / Device Role / Timing Role: Bidirectional, logic-level controlled load switch managing VBUS connection between port controller and system rails. Use Value: Low Qg (10.5 nC) and fast tD(off) (14.6 ns) support dynamic load switching during PD contract negotiation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025SFG-7 | RDS(on) = 28 mΩ @ 10V (vs. 23 mΩ); same package and pinout | Slightly higher conduction loss; identical thermal and switching specs | Select when tighter RDS(on) tolerance or alternate lot availability is required |
| SI2302DS-T1-GE3 | RDS(on) = 45 mΩ @ 4.5V; SOT-23 package; no AEC-Q101 qualification | Lower current rating (3.2 A), smaller footprint, non-automotive grade | Use only in cost-sensitive consumer DC-DC where AEC-Q101 and >6 A current not required |
Compared with DMN3024SFG-7, DMN3025SFG-7 trades marginal RDS(on) increase for broader process yield, while SI2302DS-T1-GE3 sacrifices automotive reliability and current capacity for board-area savings - making DMN3024SFG-7 optimal for thermally constrained, AEC-Q101–mandated 6–7.5 A power switches.
Availability
DMN3024SFG-7 is available at Aetrix Electronics and suitable for DC-DC converters, LED backlight drivers, and automotive body control modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for DMN3024SFG-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This part belongs to Diodes' POWERDI® portfolio of thermally optimized MOSFETs, engineered specifically for high-density power conversion and automotive-grade load switching where board area, thermal resistance, and reliability are critical.
FAQ
What is the maximum continuous drain current for DMN3024SFG-7 at 70°C ambient?
At TA = 70°C with 1-inch² copper pad (Note 6), the continuous drain current is 6.0 A when VGS = 10V and 5.0 A when VGS = 4.5V. This derating reflects thermal limits under realistic PCB layout conditions, not just junction temperature alone.
Does DMN3024SFG-7 support logic-level gate drive?
Yes - its gate threshold voltage (VGS(th)) ranges from 1.0 V to 2.4 V, and it delivers RDS(on) = 33 mΩ at VGS = 4.5V with 7.5 A pulsed current, enabling full enhancement from standard 3.3V or 5V microcontroller outputs without level-shifting.
How is thermal performance affected by PCB layout?
With minimum recommended pad layout (2 oz copper, no thermal pad), RθJA is 145°C/W (PD = 0.9 W). With 1-inch² copper plate, RθJA improves to 58°C/W (PD = 2.2 W). The exposed drain paddle must be soldered to a large copper pour to realize specified thermal ratings.
Is DMN3024SFG-7 suitable for automotive applications?
Yes - it is explicitly qualified to AEC-Q101 standards, operates from −55°C to +150°C, and features 100% UIS testing. It is approved for use in non-safety-critical automotive systems including lighting, HVAC, and body electronics, excluding life-support functions.
DMN3024SFG-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 7.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 23mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 10.5 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 479 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 900mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMN3024SFG-7 FAQ
1.How can I place an order for DMN3024SFG-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3024SFG-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3024SFG-7 reliable?
The price and inventory of DMN3024SFG-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3024SFG-7 is usually 5 days.
3.What payment methods are accepted for DMN3024SFG-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3024SFG-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3024SFG-7?
DMN3024SFG-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3024SFG-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3024SFG-7?
For technical support, including DMN3024SFG-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3024SFG-7 requirements.
6.How does Aetrix verify that DMN3024SFG-7 is sourced from the original manufacturer or authorized distributors?
All DMN3024SFG-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3024SFG-7 meets industry standards.
7.What is the process for return or replacement of DMN3024SFG-7?
All DMN3024SFG-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3024SFG-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3024SFG-7 part is unused and in its original packaging.
Return procedure for DMN3024SFG-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMN3024SFG-7 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
