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Diodes Incorporated DMN3025LFDF-13

Part No.:
DMN3025LFDF-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixDMN3025LFDF-13.pdf
Description:
MOSFET N-CH 30V 9.9A 6UDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,299

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Product details

Overview

DMN3025LFDF-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, featuring 20.5 mΩ RDS(ON) at VGS = 10 V and 8.3 A continuous drain current at TA = +25°C. It serves as a low-profile power switch in DC-DC converters, load switches, and battery protection circuits.

For engineers reviewing the DMN3025LFDF-13 datasheet, DMN3025LFDF-13 pinout, DMN3025LFDF-13 application, or DMN3025LFDF-13 equivalent, key selection criteria include its 20.5 mΩ on-resistance at 10 V gate drive, 4.5 V logic-level compatibility, 641 pF input capacitance, 13.2 nC total gate charge, and thermal resistance of 62 °C/W under enhanced PCB layout.

Technical Context

This MOSFET employs a trench-gate silicon process optimized for low RDS(ON) while preserving fast switching performance-evidenced by 3.3 ns turn-on delay and 5.3 ns turn-off fall time. Its gate threshold voltage (1.0–2.0 V) enables reliable operation with 3.3 V and 5 V microcontroller outputs.

The device integrates a body diode with 0.70–1.0 V forward voltage at 1 A and supports avalanche energy up to 11 mJ. Thermal design is enabled by a 9.4 °C/W junction-to-case resistance and JEDEC-qualified reliability per AEC-Q standards for high-reliability industrial use.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage for 12 V/24 V rail applications
RDS(ON) @ VGS = 10 V20.5 mΩ - Enables ≤170 mW conduction loss at 8.3 A
RDS(ON) @ VGS = 4.5 V30 mΩ - Ensures full enhancement with 3.3 V logic-level drivers
ID (TA = +25°C)8.3 A - Supports compact power stages without forced cooling
Ciss641 pF - Low input capacitance reduces gate drive power and EMI
Qg @ VGS = 10 V13.2 nC - Enables efficient 1–2 MHz switching in synchronous buck converters
RθJA (enhanced layout)62 °C/W - Allows 2.1 W dissipation with 1-inch² copper pad at +70°C ambient

Pinout & Package

U-DFN2020-6 (Type F) package: 2.0 × 2.0 mm footprint, 0.6 mm profile, NiPdAu-plated terminals, moisture sensitivity level 1, UL 94V-0 molding compound.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (G)GateControl terminal; accepts 0–20 V gate-source swing; 2.2 Ω internal gate resistance limits ringing
Pins 2 & 3 (S)SourcePower return node; dual-source configuration lowers parasitic inductance and improves thermal spreading
Pins 4 & 5 (D)DrainMain current path; connected to exposed thermal pad; requires soldered thermal land for RθJA = 62 °C/W
Pin 6 (S)SourceThird source connection; completes low-inductance source loop for high-di/dt switching

Key Features

FeatureDesign Value
Low-profile U-DFN2020-60.6 mm height enables integration into space-constrained portable electronics
4 mm² PCB footprintReduces board area vs. SO-8 or SOT-23; compatible with automated placement
Logic-level gate driveOperates fully enhanced at VGS = 4.5 V, eliminating need for gate boosters in 3.3 V systems
Low Qgd/Qg ratio2.2/13.2 nC = 0.17 - Improves hard-switching efficiency and reduces Miller-induced shoot-through risk
Halogen- and antimony-free<900 ppm Br, <900 ppm Cl, <1000 ppm Sb - Meets IPC-1752A "Green" compliance requirements

Applications

Battery Protection CircuitUSB-C Power Delivery Switch

Use Scenario: Bidirectional overvoltage/overcurrent protection in single-cell Li-ion battery packs.

IC Role / Device Role: High-side load switch controlling charging/discharging paths with reverse-current blocking.

Use Value: 30 mΩ RDS(ON) at 4.5 V gate drive ensures minimal voltage drop during 5 A discharge, preserving battery runtime.

Use Scenario: 5–20 V power path switching in USB-C PD sink applications.

IC Role / Device Role: Low-loss, fast-turning power switch enabling dynamic voltage negotiation and fault isolation.

Use Value: 13.2 nC Qg and 3.3 ns tD(ON) support <10 µs response to PD contract changes without thermal penalty.

DC-DC Synchronous Buck ConverterIndustrial Sensor Node Power Switch

Use Scenario: High-efficiency 12 V to 3.3 V conversion in programmable logic controllers.

IC Role / Device Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction losses.

Use Value: 20.5 mΩ RDS(ON) cuts rectifier loss by >65% vs. 0.4 V Schottky at 6 A, improving full-load efficiency to >94%.

Use Scenario: Remote wireless sensor nodes powered by coin-cell or energy harvesters.

IC Role / Device Role: Ultra-low-quiescent-power load switch enabling deep-sleep mode with <1 µA leakage.

Use Value: 1 µA IDSS at 30 V ensures <10 nW standby loss, extending 10-year battery life targets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN3025LSD-13Same die in SOT-23-3 package; RDS(ON) = 20.5 mΩ @ 10 V but higher RθJA = 220 °C/WLimited to ≤1.5 A continuous due to thermal constraints; unsuitable for >500 kHz switchingSelect when board space permits larger footprint and thermal relief is impractical
AO3400A30 V, 26 mΩ @ 10 V, 5.7 A; higher Ciss = 750 pF and Qg = 17 nCLower peak current capability and slower switching increase losses above 1 MHzChoose only if cost sensitivity outweighs efficiency and size requirements

Compared with DMN3025LSD-13 and AO3400A, DMN3025LFDF-13 delivers superior thermal performance (62 vs. 220/150 °C/W), smaller footprint (4 vs. 10/6 mm²), and lower switching losses-making it optimal for high-density, high-frequency power management where board area and efficiency are critical.

Availability

DMN3025LFDF-13 is available at Aetrix Electronics and suitable for battery protection circuits, USB-C power delivery switches, and DC-DC synchronous buck converters requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for DMN3025LFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

The DMN3025LFDF belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, low-voltage power switching in portable, industrial, and automotive-qualified systems.

FAQ

What is the maximum safe operating temperature for DMN3025LFDF-13?

The device has a rated junction temperature range of –55°C to +150°C. Under continuous operation with the recommended 1-inch² copper pad, it sustains 2.1 W power dissipation at +70°C ambient, corresponding to a maximum junction temperature of +150°C. Derating is required above +70°C ambient per the RθJA = 62 °C/W curve.

Does DMN3025LFDF-13 require a gate resistor for stability?

A gate resistor of 1–10 Ω is recommended to dampen ringing caused by PCB trace inductance interacting with the device's 2.2 Ω intrinsic gate resistance and 641 pF Ciss. This prevents false turn-on during fast dv/dt events and ensures clean switching in high-frequency buck regulators.

Can DMN3025LFDF-13 be used in automotive applications?

The standard DMN3025LFDF-13 is not AEC-Q200 qualified. For automotive use, Diodes offers the Q-suffix variant DMN3025LFDFQ-13, which is AEC-Q200 qualified, PPAP-capable, and manufactured in IATF 16949-certified facilities-available separately with full change control documentation.

How does the dual-source/dual-drain pinout improve performance?

The U-DFN2020-6 (Type F) layout places two source pins (2 & 3) and two drain pins (4 & 5) to minimize loop inductance in high-di/dt switching. This reduces voltage overshoot during turn-off and improves EMI behavior, especially critical in 1–2 MHz DC-DC converters where parasitic inductance directly impacts efficiency and noise.

DMN3025LFDF-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
9.9A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
20.5mOhm @ 7A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
13.2 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
641 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.1W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type F)

DMN3025LFDF-13 FAQ

1.How can I place an order for DMN3025LFDF-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN3025LFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN3025LFDF-13 reliable?

The price and inventory of DMN3025LFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3025LFDF-13 is usually 5 days.

3.What payment methods are accepted for DMN3025LFDF-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3025LFDF-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN3025LFDF-13?

DMN3025LFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN3025LFDF-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN3025LFDF-13?

For technical support, including DMN3025LFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3025LFDF-13 requirements.

6.How does Aetrix verify that DMN3025LFDF-13 is sourced from the original manufacturer or authorized distributors?

All DMN3025LFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3025LFDF-13 meets industry standards.

7.What is the process for return or replacement of DMN3025LFDF-13?

All DMN3025LFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3025LFDF-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN3025LFDF-13 part is unused and in its original packaging.

Return procedure for DMN3025LFDF-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN3025LFDF-13 Tags

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  • Diodes Incorporated
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