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Diodes Incorporated DMN3027LFG-13
- Part No.:
- DMN3027LFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMN3027LFG-13.pdf
- Description:
- MOSFET N-CH 30V 5.3A PWRDI3333-8
- Quantity:
- Payment:
- Shipping:
Inventory:4,297
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Product details
Overview
DMN3027LFG-13 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in POWERDI®3333-8 package, rated for 30V VDSS, 18.6mΩ RDS(ON) @ VGS = 10V, and 8.0A continuous drain current at TA = +25°C. It serves as a high-efficiency power switch in DC-DC converters and LED backlighting circuits.
For engineers reviewing the DMN3027LFG-13 datasheet, DMN3027LFG-13 pinout, DMN3027LFG-13 application, or DMN3027LFG-13 equivalent, key selection criteria include RDS(ON) at 4.5V/10V, thermal resistance (RθJA = 62.5°C/W on 2"×2" FR-4), avalanche rating (IAR = 18A), and AEC-Q101 qualification for automotive-grade reliability.
Technical Context
This MOSFET employs planar silicon technology optimized for low conduction loss and fast switching. Its gate threshold voltage (VGS(TH) = 0.9–1.8V) enables robust turn-on with standard logic-level drivers, while its 70A pulsed drain current supports transient load handling in power management stages.
The device features fully characterized dynamic parameters: Qg = 11.3nC @ VGS = 10V, Ciss = 580pF, and tF = 5.8ns - enabling efficient operation in synchronous buck topologies up to several hundred kHz without excessive gate drive loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - supports 24V rail systems with margin against transients |
| RDS(ON) @ VGS = 10V | 18.6mΩ max - limits conduction loss to ≤1.2W at 8A DC |
| RDS(ON) @ VGS = 4.5V | 26.5mΩ max - ensures usable on-resistance with 3.3V/5V logic-level gate drive |
| ID Continuous @ TA = +25°C | 8.0A - delivers >19W output in compact DC-DC converter designs |
| RθJA | 62.5°C/W - enables 2.07W power dissipation on 2"×2" 2oz copper PCB |
| Avalanche Energy EAR | 16mJ - withstands single-pulse inductive kickback without failure |
| Qg @ VGS = 10V | 11.3nC - determines gate driver current requirement (~1.1mA avg @ 100kHz) |
Pinout & Package
Packaged in POWERDI®3333-8 - a thermally enhanced, surface-mount 8-pin leadless package with exposed drain pad for improved heat transfer. Dimensions: 3.30mm × 3.30mm × 0.80mm (L×W×H), footprint occupies only 33% of SO-8 area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (S) | Common source connection; tied internally to thermal pad for low-inductance return path |
| 5, 6, 7, 8 | Drain (D) | Main power output node; connected to exposed copper pad for thermal and electrical conduction |
| Gate (G) | Control input | Single terminal located between pins 4 and 5 - requires <3Ω series resistance to damp ringing |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS (Avalanche) Rated | Guarantees ruggedness against inductive switching stress without external snubbers |
| 100% Rg Tested | Ensures consistent gate drive timing and minimizes variation in tD(ON)/tF |
| AEC-Q101 Qualified | Validated for automotive power modules, infotainment supplies, and body control units |
| Green, Halogen-Free Construction | Meets JESD22-A112 for MSL Level 1 - no baking required before reflow |
| Thermal Resistance Reduction | RθJA = 62.5°C/W (vs. ~150°C/W for SO-8) enables higher power density in space-constrained layouts |
Applications
| LED Backlighting | DC-DC Buck Converter |
|---|---|
|
Use Scenario: Driving parallel strings of white LEDs in automotive instrument clusters and LCD displays. IC Role / Device Role / Timing Role: Low-side synchronous rectifier switch operating at 200–500kHz PWM frequency. Use Value: 26.5mΩ RDS(ON) @ 4.5V ensures <0.5W conduction loss per channel at 6.5A, reducing thermal load on display PCB. |
Use Scenario: High-efficiency 12V-to-3.3V/5V point-of-load conversion in industrial PLC I/O modules. IC Role / Device Role / Timing Role: Main power FET in non-isolated buck regulator with integrated controller. Use Value: 11.3nC Qg and 5.8ns tF enable >92% efficiency at 300kHz switching, minimizing gate drive losses and EMI. |
| Automotive Power Management | USB-C PD Power Path |
|
Use Scenario: Load switching for 12V accessory rails in ADAS camera modules and radar sensors. IC Role / Device Role / Timing Role: Hot-swap protection switch with controlled turn-on via gate resistor network. Use Value: 18A avalanche current rating handles load dump transients up to ISO 7637-2 Pulse 5a without derating. |
Use Scenario: Input power path switch in USB-C power delivery sink applications requiring reverse-current blocking. IC Role / Device Role / Timing Role: Reverse-blocking N-channel FET placed between VBUS and system input, driven by dedicated PD controller. Use Value: 30V VDSS and 0.7V diode forward voltage (VSD) support bidirectional fault detection and low-loss reverse conduction during dead-time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3028LFG-13 | RDS(ON) = 22.5mΩ @ 4.5V (higher), same 30V rating and POWERDI®3333-8 package | Slightly lower efficiency in 3.3V-gate-drive designs; identical thermal profile and footprint | Select when cost sensitivity outweighs marginal RDS(ON) penalty and layout reuse is critical |
| DMT3006LPS-13 | 60V VDSS, 6.5mΩ @ 10V, PowerDI™5060 package (larger, 5.0×6.0mm) | Supports 48V systems but requires PCB redesign; higher peak current (12A) and lower RDS(ON) | Choose for future-proofing to higher bus voltages or where 6.5mΩ conduction loss justifies larger footprint |
Compared with DMN3027LFG-13, DMN3028LFG-13 trades 15% higher RDS(ON) for lower unit cost in identical footprint, while DMT3006LPS-13 offers double the voltage rating and half the on-resistance at the expense of board area and thermal mass - making DMN3027LFG-13 optimal for space-constrained 24V/3.3V-driven power stages.
Availability
DMN3027LFG-13 is available at Aetrix Electronics and suitable for LED backlighting, DC-DC buck converters, and automotive power management applications requiring stable component supply, AEC-Q101 compliance, and high-density thermal performance.
Supply support for DMN3027LFG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Malaysia, and Taiwan.
This part belongs to Diodes' POWERDI® portfolio of thermally optimized MOSFETs, engineered specifically for high-power-density DC-DC conversion, LED lighting, and automotive subsystems where board space and thermal headroom are constrained.
FAQ
What is the maximum junction temperature for DMN3027LFG-13?
The absolute maximum junction temperature is +150°C, validated across the full operating range (–55°C to +150°C). Derating begins above +125°C ambient when mounted on a 2"×2" 2oz copper PCB, where power dissipation drops linearly from 2.07W at +25°C to zero at +150°C ambient.
Is DMN3027LFG-13 suitable for 3.3V gate drive applications?
Yes - its gate threshold voltage (VGS(TH) = 0.9–1.8V) and guaranteed RDS(ON) = 26.5mΩ @ VGS = 4.5V ensure reliable enhancement-mode turn-on with 3.3V logic drivers. For full saturation, a 4.5V or higher gate drive is recommended to minimize conduction loss.
Does DMN3027LFG-13 require special PCB layout considerations?
Yes - the exposed drain pad must be connected to a minimum 100mm² copper pour with ≥4 thermal vias (0.3mm diameter) to achieve the specified RθJA = 62.5°C/W. The gate trace should be short and shielded from noisy power paths to prevent false triggering due to dV/dt coupling.
How does the POWERDI®3333-8 package compare to SO-8 thermally?
POWERDI®3333-8 achieves RθJA = 62.5°C/W on a 2"×2" 2oz FR-4 board, versus ~150°C/W for standard SO-8 - a 58% reduction. This is enabled by direct die-to-pad thermal conduction and elimination of plastic body thermal resistance, allowing 2.07W continuous dissipation versus ~0.8W in SO-8 under identical conditions.
DMN3027LFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 5.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 18.6mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 1.8V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11.3 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 580 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMN3027LFG-13 FAQ
1.How can I place an order for DMN3027LFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3027LFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3027LFG-13 reliable?
The price and inventory of DMN3027LFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3027LFG-13 is usually 5 days.
3.What payment methods are accepted for DMN3027LFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3027LFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3027LFG-13?
DMN3027LFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3027LFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3027LFG-13?
For technical support, including DMN3027LFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3027LFG-13 requirements.
6.How does Aetrix verify that DMN3027LFG-13 is sourced from the original manufacturer or authorized distributors?
All DMN3027LFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3027LFG-13 meets industry standards.
7.What is the process for return or replacement of DMN3027LFG-13?
All DMN3027LFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3027LFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3027LFG-13 part is unused and in its original packaging.
Return procedure for DMN3027LFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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