Diodes Incorporated DMN3061S-13
- Part No.:
- DMN3061S-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
DMN3061S-13.pdf
- Description:
- MOSFET BVDSS: 25V~30V SOT23 T&R
- Quantity:
- Payment:

- Shipping:

Inventory:7,360
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Product details
Overview
DMN3061S-13 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in SOT23 package, rated for 30V VDSS, 59 mΩ RDS(ON) @ 10V VGS, and 2.9A continuous drain current at TA = +25°C. It serves as a low-side power switch in compact DC-DC converters, load switches, and battery protection circuits.
For engineers reviewing the DMN3061S-13 datasheet, DMN3061S-13 pinout, DMN3061S-13 application, or DMN3061S-13 equivalent, key selection criteria include its 4.5V gate drive compatibility, 98 mΩ RDS(ON) at 4.5V, 233 pF Ciss, thermal resistance of 161 °C/W (FR-4), and SOT23 footprint constraints.
Technical Context
This MOSFET employs planar trench-gate technology to achieve low on-resistance while maintaining fast switching speed (tD(ON) = 0.9 ns, tF = 2.4 ns) and low gate charge (Qg = 2.9 nC @ 4.5V). Its gate threshold voltage (VGS(TH) = 0.5–1.8 V) enables reliable turn-on with 3.3V logic-level signals.
The device integrates a body diode with VSD = 0.7–1.0 V at 1A, supporting synchronous rectification and reverse-current blocking. Thermal performance is characterized for two PCB layouts: 0.77 W PD on standard FR-4 (RθJA = 161 °C/W) and 1.23 W on enhanced copper (RθJA = 101 °C/W).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source blocking voltage before avalanche conduction begins. |
| RDS(ON) @ 10V | 59 mΩ - On-resistance at full gate drive; determines I²R conduction loss in high-current paths. |
| RDS(ON) @ 4.5V | 98 mΩ - On-resistance compatible with 4.5V microcontroller GPIOs; critical for 5V/3.3V system integration. |
| Ciss | 233 pF - Input capacitance governing gate drive strength requirements and switching transition time. |
| Qg @ 4.5V | 2.9 nC - Total gate charge needed to fully turn on; directly impacts driver IC sizing and switching loss. |
| PD (FR-4) | 0.77 W - Max steady-state power dissipation on standard 2oz copper PCB; sets practical current limit under natural convection. |
| TJ Range | −55 to +150 °C - Junction temperature operating range; supports industrial and extended-temperature applications. |
Pinout & Package
Package: SOT23 - Surface-mount plastic package (2.9 mm × 1.3 mm × 1.0 mm), RoHS-compliant, halogen-free, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Current return path for channel conduction | Connected to ground or low-side reference; forms body diode cathode. |
| 2 (Gate) | Control terminal for channel formation | High-impedance input requiring <2.9 nC charge to switch; sensitive to ESD. |
| 3 (Drain) | Power output node for switched load | Carries full load current; electrically isolated from Source when off; connects to body diode anode. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) @ 4.5V | 98 mΩ enables efficient operation with 3.3V/5V logic drivers without external level-shifting. |
| Fast switching speed | tF = 2.4 ns and tD(OFF) = 10.0 ns reduce transition losses in high-frequency PWM applications. |
| Low input capacitance | Ciss = 233 pF minimizes gate drive power and simplifies driver selection for space-constrained designs. |
| Body diode forward voltage | VSD = 0.7 V typical at 1A supports bidirectional current handling in back-to-back configurations. |
| Thermal robustness | RθJA = 161 °C/W on standard FR-4 allows 0.77W dissipation without forced cooling in ambient ≤50°C. |
Applications
| Battery Protection Circuit | USB Load Switch |
|---|---|
Use Scenario: Preventing over-discharge and short-circuit in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: Low-side protection switch controlling discharge path; activated by battery management IC during fault conditions. Use Value: 98 mΩ RDS(ON) at 4.5V ensures minimal voltage drop during normal operation, preserving battery runtime. | Use Scenario: Enabling/disabling power to USB peripherals in portable devices. IC Role / Device Role / Timing Role: Controlled power rail switch responding to USB enumeration status or host control signals. Use Value: Fast 2.4 ns fall time prevents bus glitches during hot-plug events; low leakage (<1 µA) maintains sleep-mode integrity. |
| DC-DC Converter Synchronous Rectifier | Microcontroller GPIO Interface Driver |
Use Scenario: Replacing Schottky diode in buck converter output stage to improve efficiency. IC Role / Device Role / Timing Role: Synchronous rectifier driven by controller's complementary PWM signal; conducts during low-side phase. Use Value: 0.7 V VSD and 98 mΩ RDS(ON) reduce conduction loss vs. 0.35 V Schottky at 1A, especially below 100 kHz. | Use Scenario: Driving small solenoids, LEDs, or sensors from MCU GPIO pins with limited current capability. IC Role / Device Role / Timing Role: Logic-level buffer and current amplifier; isolates MCU from inductive loads. Use Value: 0.5–1.8 V VGS(TH) guarantees turn-on with 3.3V outputs; 24 A pulsed rating handles inrush currents safely. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LSD-13 | Lower RDS(ON) (25 mΩ @ 10V), larger SOT23-6 package, higher Qg (6.5 nC) | Requires more board area and stronger gate drive; better for high-efficiency, lower-frequency designs | Select when lower conduction loss outweighs layout and drive complexity. |
| AO3400 | Similar RDS(ON) (42 mΩ @ 10V), same SOT23-3, but higher Ciss (420 pF) and Qg (12 nC) | Slower switching and higher drive power demand; less suitable for >1 MHz operation | Choose only if cost is primary constraint and switching frequency ≤500 kHz. |
Compared with DMN3061S-13, DMN3025LSD-13 delivers lower conduction loss but demands more PCB real estate and gate drive strength, while AO3400 trades higher switching losses and drive burden for lower unit cost-making DMN3061S-13 optimal for space- and efficiency-balanced 3.3V/5V logic-driven power switches.
Availability
DMN3061S-13 is available at Aetrix Electronics and suitable for battery protection circuits, USB load switching, DC-DC synchronous rectification, and microcontroller GPIO interface drivers requiring stable component supply and consistent SOT23 sourcing.
Supply support for DMN3061S-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions.
The DMN3061S belongs to Diodes' logic-level N-channel MOSFET product line, engineered for efficient, low-voltage switching in space-constrained consumer, industrial, and computing applications.
FAQ
What is the maximum continuous drain current for DMN3061S-13 at 70°C ambient?
The maximum continuous drain current is 1.8 A at TA = +70°C with standard FR-4 PCB layout (2 oz copper, minimum pad size). This derating reflects thermal limits imposed by RθJA = 161 °C/W and TJ(max) = 150°C. Operation above this current requires enhanced heatsinking or reduced ambient temperature.
Is DMN3061S-13 suitable for 3.3V microcontroller GPIO drive without a level shifter?
Yes. With VGS(TH) ranging from 0.5 V to 1.8 V and RDS(ON) = 98 mΩ at VGS = 4.5 V, the device reliably turns on using 3.3V GPIO outputs. At 3.3V VGS, RDS(ON) rises to 196 mΩ (ID = 1.5 A), which remains usable for ≤500 mA loads where modest conduction loss is acceptable.
Does DMN3061S-13 have avalanche ruggedness rating?
No avalanche energy rating (EAS) is specified in the datasheet. The device is rated for VDSS = 30 V maximum, and operation beyond this voltage-even transiently-may cause irreversible breakdown. External clamping (e.g., TVS diode) is required in inductive-switching applications where VDS spikes exceed 30 V.
What is the moisture sensitivity level (MSL) and reflow profile compliance for DMN3061S-13?
DMN3061S-13 has MSL Level 1 per J-STD-020, meaning it is not moisture-sensitive and may be stored indefinitely at ≤30°C/85% RH without dry-pack requirements. It is qualified for standard lead-free reflow profiles (peak 260°C, 20–40 sec above 217°C), compatible with IPC/JEDEC J-STD-020D.2 specifications.
DMN3061S-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 3.3V, 10V
- Rds On (Max) @ Id, Vgs:
- 59mOhm @ 3.1A, 10V
- Vgs(th) (Max) @ Id:
- 1.8V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 5.5 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 233 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 770mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-3
DMN3061S-13 FAQ
1.How can I place an order for DMN3061S-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3061S-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3061S-13 reliable?
The price and inventory of DMN3061S-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3061S-13 is usually 5 days.
3.What payment methods are accepted for DMN3061S-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3061S-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3061S-13?
DMN3061S-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3061S-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3061S-13?
For technical support, including DMN3061S-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3061S-13 requirements.
6.How does Aetrix verify that DMN3061S-13 is sourced from the original manufacturer or authorized distributors?
All DMN3061S-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3061S-13 meets industry standards.
7.What is the process for return or replacement of DMN3061S-13?
All DMN3061S-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3061S-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3061S-13 part is unused and in its original packaging.
Return procedure for DMN3061S-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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