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Diodes Incorporated DMN3071LFR4-7R
- Part No.:
- DMN3071LFR4-7R
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
DMN3071LFR4-7R.pdf
- Description:
- MOSFET N-CH 30V 3.4A 3DFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,464
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Product details
Overview
DMN3071LFR4-7R from Diodes Incorporated is an N-channel enhancement-mode MOSFET optimized for low-RDS(ON) and fast switching in compact power-management circuits. It delivers 3.4 A continuous drain current at VGS = 10 V, 65 mΩ on-resistance, and 30 V VDSS, targeting space-constrained load switch and backlighting applications in portable electronics.
For engineers reviewing the DMN3071LFR4-7R datasheet, DMN3071LFR4-7R pinout, DMN3071LFR4-7R application, or DMN3071LFR4-7R equivalent, this page provides verified package mapping (X2-DFN1010-3), thermal resistance (107 °C/W on 1"×1" PCB), gate charge (4.5 nC at VGS = 10 V), diode forward voltage (0.8–1.2 V), and safe operating area limits under pulsed conditions.
Technical Context
This MOSFET employs a trench-gate process to achieve low RDS(ON) while maintaining controlled gate charge (Qg = 4.5 nC) and low Crss (26 pF), enabling efficient switching in DC-DC converter synchronous rectification and battery-powered load control. Its 1.0–2.5 V gate threshold ensures reliable turn-on with 3.3 V and 4.5 V logic-level drivers.
The device integrates a body diode with 1.5 A maximum continuous forward current and 4.2 ns reverse recovery time, supporting bidirectional current handling in buck converters and reverse-polarity protection circuits. Thermal performance is characterized for both minimal-pad (221 °C/W) and high-copper (107 °C/W) PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source blocking voltage for 3.3 V/5 V system rail protection |
| RDS(ON) | 65 mΩ @ VGS = 10 V - Enables ≤215 mW conduction loss at 3.4 A, critical for thermally constrained PCBs |
| ID | 3.4 A @ TA = +25°C - Continuous current rating for sustained load switching without derating below 100°C ambient |
| Qg | 4.5 nC @ VGS = 10 V - Determines gate drive energy and switching transition time in PWM-controlled power stages |
| RθJA | 107 °C/W - Measured on 1"×1" FR-4 board with 2 oz copper; defines thermal margin for 0.5 W dissipation at +100°C ambient |
| VGS(TH) | 1.0–2.5 V - Ensures full enhancement with standard 3.3 V GPIO or LDO outputs without level-shifting |
| Ciss | 190 pF - Input capacitance governing gate driver loading and turn-on delay in high-frequency switching |
Pinout & Package
Package: X2-DFN1010-3 - 1.0 mm × 1.0 mm, 0.39 mm height, 3-terminal leadless plastic package with NiPdAu-plated terminals and UL 94V-0 molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main current path output terminal | Connected to high-side load or switching node; electrically tied to exposed pad for thermal conduction |
| Source (S) | Reference node for gate control and current return | Provides ground reference for VGS; forms cathode of integrated body diode |
| Gate (G) | Control electrode for channel modulation | Receives logic-level voltage to establish conductive channel; requires <4.5 nC charge for full turn-on |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at 4.5 V drive | 75 mΩ enables use with 3.3 V microcontrollers and PMICs without gate boosting |
| Fast switching with low Crss | 26 pF reverse transfer capacitance minimizes Miller effect-induced shoot-through risk in half-bridge topologies |
| Body diode with low VSD | 0.8–1.2 V forward drop supports efficient freewheeling in buck regulators and reverse-current blocking |
| Green, halogen-free construction | <900 ppm Br+Cl total and <1000 ppm Sb satisfies automotive and industrial environmental compliance mandates |
| Moisture sensitivity Level 1 | No bake required before reflow; compatible with standard J-STD-020 assembly processes |
Applications
| Portable Device Load Switch | LED Backlight Driver |
|---|---|
|
Use Scenario: Power sequencing for USB-C peripheral modules in smartphones and tablets, where standby current must remain below 1 µA. IC Role / Device Role / Timing Role: High-side load switch controlling VBUS delivery to auxiliary ICs; operates in static on/off mode with no PWM. Use Value: 1 µA IDSS and ±100 nA IGSS ensure negligible leakage during sleep states, extending battery life by >12 hours per charge cycle. |
Use Scenario: Dynamic brightness control of edge-lit LCD panels in smart displays using PWM dimming at 1–20 kHz. IC Role / Device Role / Timing Role: Low-side current sink switching LED strings; driven by MCU PWM with 100 ns rise/fall times. Use Value: 5.7 ns tR and 1.6 ns tF support clean 20 kHz PWM without duty-cycle distortion or audible noise. |
| USB Power Delivery Switch | Reverse-Polarity Protection |
|
Use Scenario: Selective power routing in multi-port USB PD hubs, where hot-swap capability and overcurrent response <10 µs are required. IC Role / Device Role / Timing Role: Bidirectional switch enabling VCONN/VBUS path selection; body diode conducts during fault events. Use Value: 4.2 ns tRR and 0.5 nC QRR minimize voltage overshoot during polarity reversal, protecting downstream PD controllers. |
Use Scenario: Input protection for 5 V/3.3 V IoT sensor nodes powered by barrel-jack adapters prone to plug-in reversal. IC Role / Device Role / Timing Role: Low-dropout reverse-current blocker placed between input connector and LDO input. Use Value: 0.8 V VSD at 1 A yields only 0.8 W dissipation vs. 1.2 V Schottky alternatives, reducing thermal stress on 0402 PCB footprints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LFG-7 | RDS(ON) = 25 mΩ @ 10 V, but larger X2-DFN2020-6 package (2.0 mm × 2.0 mm) | Higher current (6.5 A) and lower loss suit higher-power loads; incompatible with 1.0 mm × 1.0 mm layout | Select when thermal budget allows larger footprint and RDS(ON) reduction outweighs size penalty |
| AO3400 | RDS(ON) = 42 mΩ @ 10 V, SOT-23 package, higher RθJA = 210 °C/W | Same pinout as legacy designs; less efficient at 3.4 A due to higher conduction loss and worse thermal resistance | Choose only for drop-in replacement in existing SOT-23 layouts where board rework is prohibited |
Compared with DMN3025LFG-7, DMN3071LFR4-7R trades 30 mΩ lower RDS(ON) for 60% smaller footprint and 50% better thermal resistance per unit area; versus AO3400, it delivers 38% lower conduction loss and 50% improved thermal performance in identical current ranges.
Availability
DMN3071LFR4-7R is available at Aetrix Electronics and suitable for portable device load switching, LED backlighting, USB power delivery routing, and reverse-polarity protection requiring stable component supply across consumer, industrial, and medical OEM programs.
Supply support for DMN3071LFR4-7R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power solutions, signal integrity products, and precision timing devices.
This MOSFET belongs to Diodes' X2-DFN logic-level portfolio, engineered specifically for space-constrained, battery-operated systems demanding ultra-low leakage, fast switching, and green compliance without sacrificing ruggedness.
FAQ
What is the maximum continuous drain current at 100°C ambient temperature?
The DMN3071LFR4-7R supports 2.7 A continuous drain current at TA = +100°C when mounted on a 1"×1" FR-4 PCB with 2 oz copper, per the datasheet's thermal characterization (Note 6). This derating reflects junction-to-ambient thermal resistance of 107 °C/W and maximum TJ = 150°C.
Is this MOSFET qualified for automotive applications?
No-DMN3071LFR4-7R is not AEC-Q101 qualified. Diodes offers automotive-grade variants (e.g., DMN3071LFGQ-7) with PPAP documentation, IATF 16949 manufacturing, and extended temperature validation. This part is intended for commercial and industrial use only.
Can the body diode handle repetitive reverse-recovery stress in synchronous rectification?
Yes-the body diode is characterized with tRR = 4.2 ns and QRR = 0.5 nC at IF = 4 A and di/dt = 100 A/µs. These values support operation in 1–2 MHz buck converters when paired with appropriate gate drive slew-rate control to limit di/dt-induced voltage spikes.
What is the recommended PCB pad layout for optimal thermal performance?
Diodes specifies a minimum pad layout on FR-4 with 2 oz copper for RθJA = 107 °C/W. The exposed drain pad must be fully soldered to a thermal copper pour connected via ≥4 thermal vias (0.3 mm diameter) to inner-layer ground planes. Pad dimensions match the X2-DFN1010-3 outline: D2 = 0.80 mm, E2 = 0.46 mm, with solder mask defined (SMD) stencil apertures.
DMN3071LFR4-7R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.4A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 65mOhm @ 3.2A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 4.5 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 190 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 500mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1010-3
DMN3071LFR4-7R FAQ
1.How can I place an order for DMN3071LFR4-7R through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3071LFR4-7R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3071LFR4-7R reliable?
The price and inventory of DMN3071LFR4-7R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3071LFR4-7R is usually 5 days.
3.What payment methods are accepted for DMN3071LFR4-7R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3071LFR4-7R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3071LFR4-7R?
DMN3071LFR4-7R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3071LFR4-7R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3071LFR4-7R?
For technical support, including DMN3071LFR4-7R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3071LFR4-7R requirements.
6.How does Aetrix verify that DMN3071LFR4-7R is sourced from the original manufacturer or authorized distributors?
All DMN3071LFR4-7R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3071LFR4-7R meets industry standards.
7.What is the process for return or replacement of DMN3071LFR4-7R?
All DMN3071LFR4-7R units undergo pre-shipment inspection (PSI). If there is an issue with DMN3071LFR4-7R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3071LFR4-7R part is unused and in its original packaging.
Return procedure for DMN3071LFR4-7R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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