Diodes Incorporated DMN31D4UFZ-7B
- Part No.:
- DMN31D4UFZ-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
DMN31D4UFZ-7B.pdf
- Description:
- MOSFET BVDSS: 25V~30V X2-DFN0606
- Quantity:
- Payment:

- Shipping:

Inventory:6,825
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMN31D4UFZ-7B from Diodes Incorporated is an N-channel enhancement-mode MOSFET in a 0.62 mm × 0.62 mm X2-DFN0606-3 package, rated for 30 V VDSS, 1.5 Ω RDS(ON) at 4.5 V VGS, 0.31 A continuous drain current at 25°C, and featuring 1.0 V max gate threshold voltage - optimized for low-voltage power switching in space-constrained portable electronics.
For engineers reviewing the DMN31D4UFZ-7B datasheet, DMN31D4UFZ-7B pinout, DMN31D4UFZ-7B application, or DMN31D4UFZ-7B equivalent, this page delivers verified electrical parameters, thermal performance data, package dimensions, ESD-protected gate behavior, and real-world use cases in battery-powered analog and power management switches.
Technical Context
This MOSFET employs a trench-gate process to achieve ultra-low RDS(ON) down to 1.3 Ω (typ) at VGS = 4.5 V while maintaining fast switching with 0.3 nC total gate charge and 5.7 ns turn-on delay. Its 1.0 V max VGS(TH) enables direct drive from 1.8 V and 2.5 V logic rails without level shifting.
The device integrates a body diode with 0.54 V typical forward voltage at 10 mA and exhibits normalized RDS(ON) variation of ≤1.6× across −55°C to +150°C junction temperature, supporting operation in thermally demanding environments without derating penalties beyond datasheet limits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - supports input rails up to 24 V DC with 25% safety margin for transient spikes |
| RDS(ON) @ 4.5 V | 1.5 Ω max - enables <150 mW conduction loss at 0.31 A, critical for battery runtime |
| VGS(TH) max | 1.0 V - ensures reliable turn-on with 1.2 V logic, eliminating need for gate drivers in low-power systems |
| Qg | 0.3 nC - reduces gate drive energy and switching losses in high-frequency PWM control |
| PD (Steady State) | 0.3 W - defines maximum continuous dissipation on FR-4 PCB with minimum pad layout |
| RθJA | 403 °C/W - quantifies thermal resistance from junction to ambient under standard test conditions |
| Ciss | 15.4 pF - impacts gate drive loop stability and Miller effect in high-speed switching |
Pinout & Package
Package: X2-DFN0606-3, 0.62 mm × 0.62 mm footprint, 0.4 mm max height, 3-terminal leadless plastic package with NiPdAu-plated copper leadframe. Moisture sensitivity level 1 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Current return path for channel conduction | Internally connected to exposed thermal pad; must be soldered to PCB ground plane for thermal and electrical performance |
| 2 (Gate) | Control electrode for channel formation | ESD-protected (HBM >2 kV); requires no external gate resistor for 1.8 V logic drive due to low Qg |
| 3 (Drain) | Main current-carrying terminal | Connected to load or supply rail; electrically isolated from thermal pad; handles full VDSS stress |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate threshold voltage | 1.0 V max enables direct interface with 1.2 V/1.8 V microcontrollers and PMICs without level shifters |
| 0.62 mm × 0.62 mm footprint | Reduces PCB area by >60% vs. SOT-23, enabling dense integration in wearables and hearing aids |
| ESD-protected gate | HBM rating >2 kV eliminates need for external gate protection in handheld assembly lines |
| Green, halogen-free construction | Meets IEC 61249-2-21 and JEDEC JS709E requirements for automotive and medical end equipment |
Applications
| Smartphone Power Sequencing | Wireless Earbud Battery Protection |
|---|---|
Use Scenario: Controlled enable/disable of camera module power rail during sleep/wake transitions. IC Role / Device Role / Timing Role: Low-side load switch managing 3.3 V rail sequencing with <10 μs response time. Use Value: 1.5 Ω RDS(ON) limits dropout to <0.5 V at 300 mA, preserving system voltage margin during peak current. | Use Scenario: Isolation of charging circuitry from main battery during firmware updates. IC Role / Device Role / Timing Role: Reverse-current blocking switch placed between Li-ion cell and USB-C PD input. Use Value: 1.0 V VGS(TH) allows activation directly from MCU GPIO, eliminating auxiliary bias supply. |
| IoT Sensor Node Sleep Mode Control | Medical Patch Monitor Analog Signal Switching |
Use Scenario: Disabling RF transceiver and sensor ASIC during deep-sleep intervals to reduce quiescent current. IC Role / Device Role / Timing Role: High-efficiency power gate with <100 nA leakage (IDSS ≤100 nA) ensuring sub-μA system standby. Use Value: 0.3 W power rating supports intermittent 500 mA pulse loads without thermal throttling on compact PCBs. | Use Scenario: Multiplexing biopotential signals (ECG, EMG) between front-end amplifier and ADC inputs. IC Role / Device Role / Timing Role: Low-charge-injection analog switch with 0.54 V body diode forward drop limiting signal distortion. Use Value: 15.4 pF Ciss minimizes capacitive loading on high-impedance sensor nodes, preserving SNR above 1 kHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-voltage power switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3026LFG-7 | 30 V VDSS, 2.2 Ω RDS(ON) @ 4.5 V, 0.6 V VGS(TH) max, same X2-DFN0606-3 package | Lower gate threshold enables earlier turn-on but higher RDS(ON) increases conduction loss at >200 mA | Select when driving from sub-1.5 V logic; avoid if minimizing I²R loss at 300 mA is critical |
| AO3400A | 30 V VDSS, 2.7 Ω RDS(ON) @ 4.5 V, 1.4 V VGS(TH) max, SOT-23-3 package (2.9 mm × 1.3 mm) | Larger footprint and higher threshold require gate driver for 1.8 V logic; 403 °C/W RθJA vs. 390.5 °C/W for DMN31D4UFZ | Choose only if legacy SOT-23 layout reuse is mandatory; not suitable for new ultra-compact designs |
Compared with DMN3026LFG-7 and AO3400A, DMN31D4UFZ-7B uniquely balances 1.0 V VGS(TH) and 1.5 Ω RDS(ON) in a 0.62 mm × 0.62 mm footprint - delivering lowest gate-drive voltage compatibility without sacrificing conduction efficiency in space-limited battery systems.
Availability
DMN31D4UFZ-7B is available at Aetrix Electronics and suitable for smartphone power sequencing, wireless earbud battery protection, and IoT sensor node sleep mode control requiring stable component supply across high-mix, low-volume production runs.
Supply support for DMN31D4UFZ-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power, and miniaturized components for consumer, industrial, and automotive markets.
This part belongs to Diodes' X2-DFN ultra-small signal MOSFET product line, engineered specifically for battery-powered portable devices where board space, gate drive simplicity, and low standby leakage are primary design constraints.
FAQ
What is the maximum continuous drain current for DMN31D4UFZ-7B at 85°C ambient?
The datasheet specifies 0.2 A continuous drain current at TA = +85°C with device mounted on FR-4 PCB using minimum recommended pad layout. This reflects thermal derating due to 403 °C/W RθJA; actual current capability depends on PCB copper area and airflow. No derating curve is provided beyond 85°C ambient.
Does DMN31D4UFZ-7B include integrated ESD protection on the gate terminal?
Yes - the device features ESD-protected gate structure with human-body-model (HBM) rating exceeding 2 kV, as confirmed in the "Features and Benefits" section and marking diagram ("ESD PROTECTED e4"). No external gate protection diode is required for standard handling and assembly per JESD22-A114.
Can DMN31D4UFZ-7B be used in reverse-current blocking configurations?
Yes - its intrinsic body diode has 0.54 V typical forward voltage at 10 mA and supports bidirectional current flow. When used as a high-side switch with source tied to load, it blocks reverse current from load to supply. The 30 V VDSS rating ensures safe operation with 24 V nominal supplies.
What is the moisture sensitivity level (MSL) and reflow profile compliance for DMN31D4UFZ-7B?
The device is rated MSL Level 1 per J-STD-020, meaning it is not moisture-sensitive and may be stored indefinitely at ≤30°C/60% RH without dry pack or baking. It complies with IPC/JEDEC J-STD-020D reflow profiles for lead-free soldering, with peak temperature up to 260°C for ≤30 seconds.
DMN31D4UFZ-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 310mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 1.5Ohm @ 100mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.3 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 15.4 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN0606-3
DMN31D4UFZ-7B FAQ
1.How can I place an order for DMN31D4UFZ-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN31D4UFZ-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN31D4UFZ-7B reliable?
The price and inventory of DMN31D4UFZ-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN31D4UFZ-7B is usually 5 days.
3.What payment methods are accepted for DMN31D4UFZ-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN31D4UFZ-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN31D4UFZ-7B?
DMN31D4UFZ-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN31D4UFZ-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN31D4UFZ-7B?
For technical support, including DMN31D4UFZ-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN31D4UFZ-7B requirements.
6.How does Aetrix verify that DMN31D4UFZ-7B is sourced from the original manufacturer or authorized distributors?
All DMN31D4UFZ-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN31D4UFZ-7B meets industry standards.
7.What is the process for return or replacement of DMN31D4UFZ-7B?
All DMN31D4UFZ-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMN31D4UFZ-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN31D4UFZ-7B part is unused and in its original packaging.
Return procedure for DMN31D4UFZ-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMN31D4UFZ-7B Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

