Diodes Incorporated DMN31D5UDW-13

Overview

DMN31D5UDW-13 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in SOT363 package, rated for 30V V_DSS, 1.5Ω R_DS(ON) at V_GS = 4.5V, and 0.43A continuous drain current at T_A = +25°C. It features low gate threshold (0.5–0.9V), fast switching (t_F = 48ns), and ESD protection - designed for compact, battery-powered load switching in portable electronics.

For engineers reviewing the DMN31D5UDW-13 datasheet, DMN31D5UDW-13 pinout, DMN31D5UDW-13 application, or DMN31D5UDW-13 equivalent, key selection criteria include ultra-low V_GS(TH) enabling 1.8V logic compatibility, dual-channel integration for space-constrained relay/solenoid drivers, and thermal resistance (R_θJA = 290°C/W) validated on FR-4 with 2oz copper.

Technical Context

This dual MOSFET integrates two independent N-channel devices sharing a common source terminal (S1/S2 tied internally per SOT363 pinout), supporting high-side or low-side switching configurations without cross-conduction risk. Its 0.5–0.9V gate threshold enables direct drive from 1.8V/2.5V microcontrollers and ensures reliable turn-on under weak-battery conditions down to 1.5V V_GS.

With C_iss = 15.4pF and Q_g = 0.3nC, it delivers fast switching (t_D(ON) = 5.7ns, t_F = 48ns) while minimizing gate drive power. The device's R_DS(ON) remains stable across −55°C to +150°C junction temperature, with normalized variation ≤1.8× at T_J = 150°C (V_GS = 4.5V).

Key Specifications

Pinout & Package

Package: SOT363 - ultra-small surface-mount outline (2.2 × 2.1 mm), 6-pin, lead-free, halogen-free, RoHS-compliant, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Compared with DMN31D5UDW-13, DMN3026LSD-13 trades lower gate charge for reduced integration density and missing ESD hardening, while AOB410L offers superior current handling but abandons the ultra-low-voltage drive capability and dual-channel topology essential for portable system power management.

Availability

DMN31D5UDW-13 is available at Aetrix Electronics and suitable for battery-operated systems, solid-state relay modules, and portable display backlight circuits requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for DMN31D5UDW-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

DMN31D5UDW-13 belongs to Diodes' low-voltage logic-level MOSFET product line, engineered specifically for space- and energy-constrained portable electronics requiring direct 1.8V/2.5V microcontroller interfacing and minimal board real estate.

FAQ

What is the maximum continuous drain current for DMN31D5UDW-13 at 70°C ambient?

The maximum continuous drain current is 0.28A at T_A = +70°C with V_GS = 4.5V, as specified in the Absolute Maximum Ratings table. This derating accounts for thermal resistance (R_θJA = 290°C/W) and junction temperature limit of 150°C, ensuring safe operation without forced cooling on standard FR-4 PCBs.

Can DMN31D5UDW-13 be used in high-side switching configurations?

Yes - each channel operates independently with isolated source terminals (S1 and S2), allowing either channel to be configured as high-side switch by connecting its source to the positive rail and driving the gate relative to that rail. No internal connection exists between S1 and S2, enabling true high-side or floating-load implementations.

Does the SOT363 package support reflow soldering per JEDEC J-STD-020?

Yes - the SOT363 package is rated for moisture sensitivity level 1 (MSL-1), meaning it may be stored indefinitely at ≤30°C/85% RH and is compatible with standard Pb-free reflow profiles (peak 260°C). The matte tin finish on Alloy 42 leadframe ensures solderability per MIL-STD-202, Method 208.

Is there a recommended PCB pad layout for thermal performance?

Diodes specifies a minimum recommended pad layout with 1-inch square copper pour for optimal thermal dissipation. For production use, follow the exact dimensions published in Package Outline SOT363 (C = 0.65mm, G = 1.30mm, Y = 0.60mm, Y1 = 2.50mm) and use 2oz copper to achieve the validated R_θJA = 290°C/W rating.